JPWO2021187200A1 - - Google Patents

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Publication number
JPWO2021187200A1
JPWO2021187200A1 JP2022508227A JP2022508227A JPWO2021187200A1 JP WO2021187200 A1 JPWO2021187200 A1 JP WO2021187200A1 JP 2022508227 A JP2022508227 A JP 2022508227A JP 2022508227 A JP2022508227 A JP 2022508227A JP WO2021187200 A1 JPWO2021187200 A1 JP WO2021187200A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022508227A
Other languages
Japanese (ja)
Other versions
JP7428237B2 (ja
JPWO2021187200A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021187200A1 publication Critical patent/JPWO2021187200A1/ja
Publication of JPWO2021187200A5 publication Critical patent/JPWO2021187200A5/ja
Application granted granted Critical
Publication of JP7428237B2 publication Critical patent/JP7428237B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/56—Monolithic crystal filters
    • H03H9/566—Electric coupling means therefor
    • H03H9/568—Electric coupling means therefor consisting of a ladder configuration
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/205—Constructional features of resonators consisting of piezoelectric or electrostrictive material having multiple resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/703—Networks using bulk acoustic wave devices

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2022508227A 2020-03-18 2021-03-08 弾性波装置及び複合フィルタ装置 Active JP7428237B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020047272 2020-03-18
JP2020047272 2020-03-18
PCT/JP2021/009028 WO2021187200A1 (ja) 2020-03-18 2021-03-08 弾性波装置及び複合フィルタ装置

Publications (3)

Publication Number Publication Date
JPWO2021187200A1 true JPWO2021187200A1 (https=) 2021-09-23
JPWO2021187200A5 JPWO2021187200A5 (https=) 2022-09-09
JP7428237B2 JP7428237B2 (ja) 2024-02-06

Family

ID=77771257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022508227A Active JP7428237B2 (ja) 2020-03-18 2021-03-08 弾性波装置及び複合フィルタ装置

Country Status (4)

Country Link
US (1) US12438521B2 (https=)
JP (1) JP7428237B2 (https=)
CN (1) CN115191084A (https=)
WO (1) WO2021187200A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117559953B (zh) * 2023-02-15 2025-07-08 北京芯溪半导体科技有限公司 滤波器设计方法、装置及相关设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349591A (ja) * 1999-06-08 2000-12-15 Oki Electric Ind Co Ltd 弾性表面波フィルタを用いた分波器
WO2009063559A1 (ja) * 2007-11-15 2009-05-22 Fujitsu Limited 弾性波デバイス、それを用いたデュープレクサおよびそのデュープレクサを用いた通信機
WO2009150786A1 (ja) * 2008-06-09 2009-12-17 株式会社村田製作所 弾性表面波装置及びその製造方法
JP2011097237A (ja) * 2009-10-28 2011-05-12 Kyocera Corp 弾性表面波装置
JP2011211460A (ja) * 2010-03-30 2011-10-20 Sae Magnetics (Hk) Ltd 弾性表面波装置
JP2018157510A (ja) * 2017-03-21 2018-10-04 太陽誘電株式会社 マルチプレクサ
WO2019111902A1 (ja) * 2017-12-06 2019-06-13 株式会社村田製作所 マルチプレクサ、高周波フロントエンド回路および通信装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258594A (ja) 2001-12-27 2003-09-12 Murata Mfg Co Ltd 弾性表面波素子およびその製造方法
CN104205633B (zh) * 2012-03-23 2016-10-26 株式会社村田制作所 弹性波滤波器元件以及其制造方法
WO2016100692A2 (en) * 2014-12-17 2016-06-23 Rf Micro Devices, Inc. Plate wave devices with wave confinement structures and fabrication methods
US11218133B2 (en) * 2016-09-30 2022-01-04 Intel Corporation Film bulk acoustic resonator (FBAR) devices for high frequency RF filters
US10483942B2 (en) * 2017-01-24 2019-11-19 Skyworks Solutions, Inc. Acoustic wave device with acoustically separated multi-channel feedback
DE102018102891A1 (de) * 2017-02-13 2018-08-16 Murata Manufacturing Co., Ltd. Multiplexierer, Übertragungsvorrichtung und Empfangsvorrichtung
JP2018133800A (ja) * 2017-02-13 2018-08-23 株式会社村田製作所 マルチプレクサ、送信装置および受信装置
JP2018207290A (ja) * 2017-06-02 2018-12-27 株式会社村田製作所 弾性波共振子および弾性波フィルタ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349591A (ja) * 1999-06-08 2000-12-15 Oki Electric Ind Co Ltd 弾性表面波フィルタを用いた分波器
WO2009063559A1 (ja) * 2007-11-15 2009-05-22 Fujitsu Limited 弾性波デバイス、それを用いたデュープレクサおよびそのデュープレクサを用いた通信機
WO2009150786A1 (ja) * 2008-06-09 2009-12-17 株式会社村田製作所 弾性表面波装置及びその製造方法
JP2011097237A (ja) * 2009-10-28 2011-05-12 Kyocera Corp 弾性表面波装置
JP2011211460A (ja) * 2010-03-30 2011-10-20 Sae Magnetics (Hk) Ltd 弾性表面波装置
JP2018157510A (ja) * 2017-03-21 2018-10-04 太陽誘電株式会社 マルチプレクサ
WO2019111902A1 (ja) * 2017-12-06 2019-06-13 株式会社村田製作所 マルチプレクサ、高周波フロントエンド回路および通信装置

Also Published As

Publication number Publication date
WO2021187200A1 (ja) 2021-09-23
US12438521B2 (en) 2025-10-07
CN115191084A (zh) 2022-10-14
JP7428237B2 (ja) 2024-02-06
US20220416764A1 (en) 2022-12-29

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