JPWO2021186891A1 - - Google Patents

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Publication number
JPWO2021186891A1
JPWO2021186891A1 JP2022508097A JP2022508097A JPWO2021186891A1 JP WO2021186891 A1 JPWO2021186891 A1 JP WO2021186891A1 JP 2022508097 A JP2022508097 A JP 2022508097A JP 2022508097 A JP2022508097 A JP 2022508097A JP WO2021186891 A1 JPWO2021186891 A1 JP WO2021186891A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022508097A
Other versions
JPWO2021186891A5 (ja
JP7205662B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021186891A1 publication Critical patent/JPWO2021186891A1/ja
Publication of JPWO2021186891A5 publication Critical patent/JPWO2021186891A5/ja
Application granted granted Critical
Publication of JP7205662B2 publication Critical patent/JP7205662B2/ja
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Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022508097A 2020-03-18 2021-01-21 半導体モジュール Active JP7205662B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020047766 2020-03-18
JP2020047766 2020-03-18
PCT/JP2021/002072 WO2021186891A1 (ja) 2020-03-18 2021-01-21 半導体モジュール

Publications (3)

Publication Number Publication Date
JPWO2021186891A1 true JPWO2021186891A1 (ja) 2021-09-23
JPWO2021186891A5 JPWO2021186891A5 (ja) 2022-05-31
JP7205662B2 JP7205662B2 (ja) 2023-01-17

Family

ID=77770797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022508097A Active JP7205662B2 (ja) 2020-03-18 2021-01-21 半導体モジュール

Country Status (4)

Country Link
US (1) US20220183194A1 (ja)
JP (1) JP7205662B2 (ja)
CN (1) CN114365282A (ja)
WO (1) WO2021186891A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3671828A1 (en) * 2018-12-21 2020-06-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Evaporative microchip cooling
JP2022048763A (ja) * 2020-09-15 2022-03-28 富士電機株式会社 冷却器及び半導体装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176881A (ja) * 2008-01-23 2009-08-06 Nissan Motor Co Ltd 冷却装置
WO2012157247A1 (ja) * 2011-05-16 2012-11-22 富士電機株式会社 半導体モジュール用冷却器
WO2016042903A1 (ja) * 2014-09-17 2016-03-24 富士電機株式会社 半導体モジュール
JP2018133350A (ja) * 2017-02-13 2018-08-23 株式会社Uacj 回路基板付きヒートシンク及びその製造方法
JP2019204922A (ja) * 2018-05-25 2019-11-28 富士電機株式会社 冷却装置、半導体モジュール、車両および製造方法
JP2020035927A (ja) * 2018-08-30 2020-03-05 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP2020092250A (ja) * 2018-11-22 2020-06-11 富士電機株式会社 半導体モジュール、車両および製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20112594U1 (de) * 2001-07-31 2002-01-17 Trw Automotive Electron & Comp Elektronisches Steuergerät in Fahrzeugen
JP4675283B2 (ja) * 2006-06-14 2011-04-20 トヨタ自動車株式会社 ヒートシンクおよび冷却器
EP2417843A2 (en) * 2009-04-08 2012-02-15 NS Acquisition LLC Low stress-inducing heat sink
JP5686606B2 (ja) * 2010-01-12 2015-03-18 日本軽金属株式会社 フィン一体型基板の製造方法およびフィン一体型基板
JP5790039B2 (ja) * 2010-07-23 2015-10-07 富士電機株式会社 半導体装置
WO2012147544A1 (ja) * 2011-04-26 2012-11-01 富士電機株式会社 半導体モジュール用冷却器及び半導体モジュール
WO2013157467A1 (ja) * 2012-04-16 2013-10-24 富士電機株式会社 半導体装置および半導体装置用冷却器
JP6262422B2 (ja) * 2012-10-02 2018-01-17 昭和電工株式会社 冷却装置および半導体装置
WO2014069174A1 (ja) * 2012-10-29 2014-05-08 富士電機株式会社 半導体装置
US10957621B2 (en) * 2014-05-30 2021-03-23 Avid Controls, Inc. Heat sink for a power semiconductor module
CN107615479B (zh) * 2015-06-03 2020-08-11 三菱电机株式会社 液冷冷却器中的散热翅片的制造方法
JP6692417B2 (ja) * 2016-05-10 2020-05-13 三菱電機株式会社 ヒートシンク
JP7205071B2 (ja) * 2018-04-02 2023-01-17 富士電機株式会社 冷却装置、半導体モジュールおよび車両
CN110543069A (zh) * 2018-05-28 2019-12-06 中强光电股份有限公司 液冷式散热器
WO2020020619A1 (de) * 2018-07-23 2020-01-30 Siemens Aktiengesellschaft Kühlung von bauteilen, stromrichter und luftfahrzeug
US11129310B2 (en) * 2018-11-22 2021-09-21 Fuji Electric Co., Ltd. Semiconductor module, vehicle and manufacturing method
JP7243262B2 (ja) * 2019-02-15 2023-03-22 富士電機株式会社 半導体モジュール、車両および製造方法
US11145571B2 (en) * 2019-06-04 2021-10-12 Semiconductor Components Industries, Llc Heat transfer for power modules

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009176881A (ja) * 2008-01-23 2009-08-06 Nissan Motor Co Ltd 冷却装置
WO2012157247A1 (ja) * 2011-05-16 2012-11-22 富士電機株式会社 半導体モジュール用冷却器
WO2016042903A1 (ja) * 2014-09-17 2016-03-24 富士電機株式会社 半導体モジュール
JP2018133350A (ja) * 2017-02-13 2018-08-23 株式会社Uacj 回路基板付きヒートシンク及びその製造方法
JP2019204922A (ja) * 2018-05-25 2019-11-28 富士電機株式会社 冷却装置、半導体モジュール、車両および製造方法
JP2020035927A (ja) * 2018-08-30 2020-03-05 富士電機株式会社 冷却装置、半導体モジュールおよび車両
JP2020092250A (ja) * 2018-11-22 2020-06-11 富士電機株式会社 半導体モジュール、車両および製造方法

Also Published As

Publication number Publication date
WO2021186891A1 (ja) 2021-09-23
US20220183194A1 (en) 2022-06-09
JP7205662B2 (ja) 2023-01-17
CN114365282A (zh) 2022-04-15

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