JPWO2021181923A1 - - Google Patents

Info

Publication number
JPWO2021181923A1
JPWO2021181923A1 JP2022505822A JP2022505822A JPWO2021181923A1 JP WO2021181923 A1 JPWO2021181923 A1 JP WO2021181923A1 JP 2022505822 A JP2022505822 A JP 2022505822A JP 2022505822 A JP2022505822 A JP 2022505822A JP WO2021181923 A1 JPWO2021181923 A1 JP WO2021181923A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022505822A
Other languages
Japanese (ja)
Other versions
JPWO2021181923A5 (https=
JP7367845B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021181923A1 publication Critical patent/JPWO2021181923A1/ja
Publication of JPWO2021181923A5 publication Critical patent/JPWO2021181923A5/ja
Application granted granted Critical
Publication of JP7367845B2 publication Critical patent/JP7367845B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C1/00—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles
    • B66C1/10—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles by mechanical means
    • B66C1/22—Rigid members, e.g. L-shaped members, with parts engaging the under surface of the loads; Crane hooks
    • B66C1/28—Duplicate, e.g. pivoted, members engaging the loads from two sides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61B—RAILWAY SYSTEMS; EQUIPMENT THEREFOR NOT OTHERWISE PROVIDED FOR
    • B61B3/00—Elevated railway systems with suspended vehicles
    • B61B3/02—Elevated railway systems with suspended vehicles with self-propelled vehicles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C13/00—Other constructional features or details
    • B66C13/04—Auxiliary devices for controlling movements of suspended loads, or preventing cable slack
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3221—Overhead conveying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2811/00—Indexing codes relating to common features for more than one conveyor kind or type
    • B65G2811/09—Driving means for the conveyors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transportation (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Manipulator (AREA)
  • Carriers, Traveling Bodies, And Overhead Traveling Cranes (AREA)
JP2022505822A 2020-03-13 2021-01-27 グリッパ装置、搬送車、及び搬送方法 Active JP7367845B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020044629 2020-03-13
JP2020044629 2020-03-13
PCT/JP2021/002788 WO2021181923A1 (ja) 2020-03-13 2021-01-27 グリッパ装置、搬送車、及び搬送方法

Publications (3)

Publication Number Publication Date
JPWO2021181923A1 true JPWO2021181923A1 (https=) 2021-09-16
JPWO2021181923A5 JPWO2021181923A5 (https=) 2022-09-29
JP7367845B2 JP7367845B2 (ja) 2023-10-24

Family

ID=77671362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022505822A Active JP7367845B2 (ja) 2020-03-13 2021-01-27 グリッパ装置、搬送車、及び搬送方法

Country Status (8)

Country Link
US (1) US12139176B2 (https=)
EP (1) EP4109502A4 (https=)
JP (1) JP7367845B2 (https=)
KR (1) KR102700084B1 (https=)
CN (1) CN115280482B (https=)
IL (1) IL296295B1 (https=)
TW (1) TWI836195B (https=)
WO (1) WO2021181923A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023070578A (ja) * 2021-11-09 2023-05-19 ゴールド工業株式会社 基板収納容器
TWI797040B (zh) * 2022-02-17 2023-03-21 盟立自動化股份有限公司 高空走行式無人搬運車的搬運系統及無人搬運車
JP7480797B2 (ja) * 2022-03-14 2024-05-10 村田機械株式会社 天井搬送車システム
JP7745522B2 (ja) * 2022-08-30 2025-09-29 株式会社ダイフク 搬送車
JP2024150068A (ja) * 2023-04-10 2024-10-23 株式会社ダイフク 搬送車
KR102907269B1 (ko) * 2023-04-24 2026-01-05 한국항공우주산업 주식회사 Agv를 이용하여 조립체를 이송하는 방법 및 시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005026596A (ja) * 2003-06-30 2005-01-27 Oriental Kogyo Kk シリコンウェハー用洗浄装置
WO2011065146A1 (ja) * 2009-11-27 2011-06-03 株式会社ダイフク 天井搬送車
JP2013045964A (ja) * 2011-08-25 2013-03-04 Sharp Corp 被処理基板の浸漬処理方法及び浸漬処理装置
JP2018039659A (ja) * 2016-09-09 2018-03-15 株式会社ダイフク 物品搬送装置
JP2018125411A (ja) * 2017-02-01 2018-08-09 村田機械株式会社 天井搬送車

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US3438510A (en) * 1967-09-26 1969-04-15 Joseph E Fawell Wheel handling apparatus
DE19806231C1 (de) * 1998-02-16 1999-07-22 Jenoptik Jena Gmbh Einrichtung zum Greifen eines Objektes
US6435330B1 (en) * 1998-12-18 2002-08-20 Asyai Technologies, Inc. In/out load port transfer mechanism
JP2005026594A (ja) * 2003-06-30 2005-01-27 Resuka:Kk 基板上に付着あるいは埋め込まれた固体試料の剥離試験方法
JP2006008355A (ja) * 2004-06-28 2006-01-12 Murata Mach Ltd 天井走行車
JP2007096140A (ja) * 2005-09-30 2007-04-12 Asyst Shinko Inc 懸垂式昇降搬送台車における物品の授受方法並びに装置
JP2007123673A (ja) * 2005-10-31 2007-05-17 Asyst Shinko Inc 物品収納用容器の防振機構
JP2011035022A (ja) 2009-07-30 2011-02-17 Murata Machinery Ltd 天井搬送車
KR101169734B1 (ko) * 2010-01-04 2012-07-30 삼성전기주식회사 기판이송장치
KR20120003368A (ko) * 2010-07-02 2012-01-10 무라텍 오토메이션 가부시키가이샤 천정 반송차의 그리퍼 장치 및 천정 반송차
JP5750926B2 (ja) * 2011-02-15 2015-07-22 村田機械株式会社 天井搬送車
CN103534798B (zh) * 2011-05-17 2016-01-06 村田机械株式会社 空中搬运车
CH705297A1 (de) * 2011-07-21 2013-01-31 Tecan Trading Ag Greiferzange mit austauschbaren Greiferfingern.
JP5590420B2 (ja) * 2011-12-21 2014-09-17 株式会社ダイフク 物品搬送設備
JP5567095B2 (ja) * 2012-10-12 2014-08-06 東芝エレベータ株式会社 エレベータ装置
JP6136775B2 (ja) * 2013-08-30 2017-05-31 株式会社ダイフク 搬送装置
JP6179406B2 (ja) * 2014-01-10 2017-08-16 株式会社ダイフク 搬送装置
JP6171984B2 (ja) * 2014-03-07 2017-08-02 株式会社ダイフク 物品支持装置
JP6064940B2 (ja) * 2014-04-07 2017-01-25 株式会社ダイフク 物品搬送車
JP6327124B2 (ja) * 2014-11-12 2018-05-23 株式会社ダイフク 物品搬送車
JP6414134B2 (ja) * 2016-05-09 2018-10-31 村田機械株式会社 搬送装置
JP6607175B2 (ja) * 2016-12-07 2019-11-20 株式会社ダイフク 移載機
CN110612258B (zh) * 2017-05-11 2021-06-15 村田机械株式会社 输送系统以及输送方法
EP3670389B1 (en) * 2017-08-16 2024-05-15 Murata Machinery, Ltd. Overhead transport vehicle, overhead transport system, and control method for overhead transport vehicle
WO2019146276A1 (ja) * 2018-01-24 2019-08-01 村田機械株式会社 搬送車

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005026596A (ja) * 2003-06-30 2005-01-27 Oriental Kogyo Kk シリコンウェハー用洗浄装置
WO2011065146A1 (ja) * 2009-11-27 2011-06-03 株式会社ダイフク 天井搬送車
JP2013045964A (ja) * 2011-08-25 2013-03-04 Sharp Corp 被処理基板の浸漬処理方法及び浸漬処理装置
JP2018039659A (ja) * 2016-09-09 2018-03-15 株式会社ダイフク 物品搬送装置
JP2018125411A (ja) * 2017-02-01 2018-08-09 村田機械株式会社 天井搬送車

Also Published As

Publication number Publication date
CN115280482B (zh) 2025-07-04
TW202139338A (zh) 2021-10-16
TWI836195B (zh) 2024-03-21
KR102700084B1 (ko) 2024-08-27
IL296295A (en) 2022-11-01
KR20220150967A (ko) 2022-11-11
EP4109502A1 (en) 2022-12-28
IL296295B1 (en) 2026-02-01
WO2021181923A1 (ja) 2021-09-16
US12139176B2 (en) 2024-11-12
US20230134312A1 (en) 2023-05-04
CN115280482A (zh) 2022-11-01
JP7367845B2 (ja) 2023-10-24
EP4109502A4 (en) 2024-05-01

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