JPWO2021171551A5 - - Google Patents

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Publication number
JPWO2021171551A5
JPWO2021171551A5 JP2022502772A JP2022502772A JPWO2021171551A5 JP WO2021171551 A5 JPWO2021171551 A5 JP WO2021171551A5 JP 2022502772 A JP2022502772 A JP 2022502772A JP 2022502772 A JP2022502772 A JP 2022502772A JP WO2021171551 A5 JPWO2021171551 A5 JP WO2021171551A5
Authority
JP
Japan
Prior art keywords
layer
metal film
substrate
base material
mainly composed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022502772A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021171551A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2020/008286 external-priority patent/WO2021171551A1/ja
Publication of JPWO2021171551A1 publication Critical patent/JPWO2021171551A1/ja
Publication of JPWO2021171551A5 publication Critical patent/JPWO2021171551A5/ja
Pending legal-status Critical Current

Links

JP2022502772A 2020-02-28 2020-02-28 Pending JPWO2021171551A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/008286 WO2021171551A1 (ja) 2020-02-28 2020-02-28 金属膜付物体

Publications (2)

Publication Number Publication Date
JPWO2021171551A1 JPWO2021171551A1 (https=) 2021-09-02
JPWO2021171551A5 true JPWO2021171551A5 (https=) 2022-09-14

Family

ID=77491147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022502772A Pending JPWO2021171551A1 (https=) 2020-02-28 2020-02-28

Country Status (4)

Country Link
JP (1) JPWO2021171551A1 (https=)
CN (1) CN114929926A (https=)
TW (1) TWI765565B (https=)
WO (1) WO2021171551A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09123343A (ja) * 1995-11-02 1997-05-13 Mitsui Toatsu Chem Inc 積層体
US6037257A (en) * 1997-05-08 2000-03-14 Applied Materials, Inc. Sputter deposition and annealing of copper alloy metallization
US7060364B2 (en) * 2002-12-26 2006-06-13 Mitsui Mining & Smelting Co., Ltd. Film carrier tape for mounting electronic devices thereon
JP6236120B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6541530B2 (ja) * 2015-09-24 2019-07-10 三ツ星ベルト株式会社 ビア充填基板並びにその製造方法及び前駆体
TWI765595B (zh) * 2016-08-31 2022-05-21 日商大日本印刷股份有限公司 貫通電極基板、貫通電極基板之製造方法及安裝基板
JP7146213B2 (ja) * 2018-06-01 2022-10-04 株式会社島津製作所 導電膜形成方法、および配線基板の製造方法

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