CN114929926A - 带金属膜的物体 - Google Patents

带金属膜的物体 Download PDF

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Publication number
CN114929926A
CN114929926A CN202080092190.8A CN202080092190A CN114929926A CN 114929926 A CN114929926 A CN 114929926A CN 202080092190 A CN202080092190 A CN 202080092190A CN 114929926 A CN114929926 A CN 114929926A
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CN
China
Prior art keywords
film
layer
metal
chamber
film formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080092190.8A
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English (en)
Chinese (zh)
Inventor
猿渡哲也
上山浩幸
吉冈尚规
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimadzu Corp
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Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of CN114929926A publication Critical patent/CN114929926A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Physical Vapour Deposition (AREA)
CN202080092190.8A 2020-02-28 2020-02-28 带金属膜的物体 Pending CN114929926A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/008286 WO2021171551A1 (ja) 2020-02-28 2020-02-28 金属膜付物体

Publications (1)

Publication Number Publication Date
CN114929926A true CN114929926A (zh) 2022-08-19

Family

ID=77491147

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080092190.8A Pending CN114929926A (zh) 2020-02-28 2020-02-28 带金属膜的物体

Country Status (4)

Country Link
JP (1) JPWO2021171551A1 (https=)
CN (1) CN114929926A (https=)
TW (1) TWI765565B (https=)
WO (1) WO2021171551A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09123343A (ja) * 1995-11-02 1997-05-13 Mitsui Toatsu Chem Inc 積層体
US6037257A (en) * 1997-05-08 2000-03-14 Applied Materials, Inc. Sputter deposition and annealing of copper alloy metallization
CN1512568A (zh) * 2002-12-26 2004-07-14 ͬ�Ϳ�ҵ��ʽ���� 电子部件封装用薄膜载带及其制造方法
WO2019230967A1 (ja) * 2018-06-01 2019-12-05 株式会社島津製作所 導電膜形成方法、および配線基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6236120B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6541530B2 (ja) * 2015-09-24 2019-07-10 三ツ星ベルト株式会社 ビア充填基板並びにその製造方法及び前駆体
TWI765595B (zh) * 2016-08-31 2022-05-21 日商大日本印刷股份有限公司 貫通電極基板、貫通電極基板之製造方法及安裝基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09123343A (ja) * 1995-11-02 1997-05-13 Mitsui Toatsu Chem Inc 積層体
US6037257A (en) * 1997-05-08 2000-03-14 Applied Materials, Inc. Sputter deposition and annealing of copper alloy metallization
CN1512568A (zh) * 2002-12-26 2004-07-14 ͬ�Ϳ�ҵ��ʽ���� 电子部件封装用薄膜载带及其制造方法
WO2019230967A1 (ja) * 2018-06-01 2019-12-05 株式会社島津製作所 導電膜形成方法、および配線基板の製造方法

Also Published As

Publication number Publication date
WO2021171551A1 (ja) 2021-09-02
TW202146230A (zh) 2021-12-16
JPWO2021171551A1 (https=) 2021-09-02
TWI765565B (zh) 2022-05-21

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Application publication date: 20220819

RJ01 Rejection of invention patent application after publication