JPWO2021171551A1 - - Google Patents
Info
- Publication number
- JPWO2021171551A1 JPWO2021171551A1 JP2022502772A JP2022502772A JPWO2021171551A1 JP WO2021171551 A1 JPWO2021171551 A1 JP WO2021171551A1 JP 2022502772 A JP2022502772 A JP 2022502772A JP 2022502772 A JP2022502772 A JP 2022502772A JP WO2021171551 A1 JPWO2021171551 A1 JP WO2021171551A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/008286 WO2021171551A1 (ja) | 2020-02-28 | 2020-02-28 | 金属膜付物体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021171551A1 true JPWO2021171551A1 (https=) | 2021-09-02 |
| JPWO2021171551A5 JPWO2021171551A5 (https=) | 2022-09-14 |
Family
ID=77491147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022502772A Pending JPWO2021171551A1 (https=) | 2020-02-28 | 2020-02-28 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2021171551A1 (https=) |
| CN (1) | CN114929926A (https=) |
| TW (1) | TWI765565B (https=) |
| WO (1) | WO2021171551A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09123343A (ja) * | 1995-11-02 | 1997-05-13 | Mitsui Toatsu Chem Inc | 積層体 |
| WO2019230967A1 (ja) * | 2018-06-01 | 2019-12-05 | 株式会社島津製作所 | 導電膜形成方法、および配線基板の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6037257A (en) * | 1997-05-08 | 2000-03-14 | Applied Materials, Inc. | Sputter deposition and annealing of copper alloy metallization |
| US7060364B2 (en) * | 2002-12-26 | 2006-06-13 | Mitsui Mining & Smelting Co., Ltd. | Film carrier tape for mounting electronic devices thereon |
| JP6236120B2 (ja) * | 2015-06-24 | 2017-11-22 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6541530B2 (ja) * | 2015-09-24 | 2019-07-10 | 三ツ星ベルト株式会社 | ビア充填基板並びにその製造方法及び前駆体 |
| TWI765595B (zh) * | 2016-08-31 | 2022-05-21 | 日商大日本印刷股份有限公司 | 貫通電極基板、貫通電極基板之製造方法及安裝基板 |
-
2020
- 2020-02-28 CN CN202080092190.8A patent/CN114929926A/zh active Pending
- 2020-02-28 JP JP2022502772A patent/JPWO2021171551A1/ja active Pending
- 2020-02-28 WO PCT/JP2020/008286 patent/WO2021171551A1/ja not_active Ceased
-
2021
- 2021-02-05 TW TW110104536A patent/TWI765565B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09123343A (ja) * | 1995-11-02 | 1997-05-13 | Mitsui Toatsu Chem Inc | 積層体 |
| WO2019230967A1 (ja) * | 2018-06-01 | 2019-12-05 | 株式会社島津製作所 | 導電膜形成方法、および配線基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114929926A (zh) | 2022-08-19 |
| WO2021171551A1 (ja) | 2021-09-02 |
| TW202146230A (zh) | 2021-12-16 |
| TWI765565B (zh) | 2022-05-21 |
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