JPWO2021166230A1 - - Google Patents
Info
- Publication number
- JPWO2021166230A1 JPWO2021166230A1 JP2022501562A JP2022501562A JPWO2021166230A1 JP WO2021166230 A1 JPWO2021166230 A1 JP WO2021166230A1 JP 2022501562 A JP2022501562 A JP 2022501562A JP 2022501562 A JP2022501562 A JP 2022501562A JP WO2021166230 A1 JPWO2021166230 A1 JP WO2021166230A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/40—Analysis of texture
- G06T7/41—Analysis of texture based on statistical description of texture
- G06T7/42—Analysis of texture based on statistical description of texture using transform domain methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/50—Extraction of image or video features by performing operations within image blocks; by using histograms, e.g. histogram of oriented gradients [HoG]; by summing image-intensity values; Projection analysis
- G06V10/507—Summing image-intensity values; Histogram projection analysis
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/60—Extraction of image or video features relating to illumination properties, e.g. using a reflectance or lighting model
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Multimedia (AREA)
- Software Systems (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Operations Research (AREA)
- Quality & Reliability (AREA)
- Probability & Statistics with Applications (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/007121 WO2021166230A1 (ja) | 2020-02-21 | 2020-02-21 | 画像処理装置および実装装置、画像処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021166230A1 true JPWO2021166230A1 (ja) | 2021-08-26 |
JP7423741B2 JP7423741B2 (ja) | 2024-01-29 |
Family
ID=77390555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022501562A Active JP7423741B2 (ja) | 2020-02-21 | 2020-02-21 | 画像処理装置および画像処理方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230108672A1 (ja) |
EP (1) | EP4110031A4 (ja) |
JP (1) | JP7423741B2 (ja) |
CN (1) | CN115004877B (ja) |
WO (1) | WO2021166230A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014072409A (ja) * | 2012-09-28 | 2014-04-21 | Juki Corp | 部品検査方法及び装置 |
WO2019123527A1 (ja) * | 2017-12-19 | 2019-06-27 | 株式会社Fuji | 実装装置、検出装置及び検出方法 |
WO2019207763A1 (ja) * | 2018-04-27 | 2019-10-31 | 株式会社Fuji | キャリアテープ搬送装置およびキャリアテープ搬送方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4744241B2 (ja) * | 2005-08-31 | 2011-08-10 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP5047031B2 (ja) * | 2008-03-28 | 2012-10-10 | 富士機械製造株式会社 | 電子部品装着装置における部品認識方法 |
JP5443894B2 (ja) * | 2009-08-21 | 2014-03-19 | Juki株式会社 | 電子部品実装装置及びその吸着位置補正方法 |
EP3071007B1 (en) * | 2013-11-11 | 2018-06-06 | Fuji Machine Mfg. Co., Ltd. | Component mounting device |
JP6476397B2 (ja) * | 2014-06-06 | 2019-03-06 | 株式会社Fuji | リード画像認識方法及びリード画像認識装置並びに画像処理用部品データ作成方法及び画像処理用部品データ作成装置 |
JP6647049B2 (ja) * | 2016-01-18 | 2020-02-14 | ヤマハ発動機株式会社 | ピッチ測定装置、ピッチ測定方法および部品実装装置 |
JP6735608B2 (ja) | 2016-06-10 | 2020-08-05 | 株式会社Fuji | テープの自動スプライシング装置およびテープの自動セット装置 |
-
2020
- 2020-02-21 EP EP20919743.3A patent/EP4110031A4/en active Pending
- 2020-02-21 JP JP2022501562A patent/JP7423741B2/ja active Active
- 2020-02-21 CN CN202080094559.9A patent/CN115004877B/zh active Active
- 2020-02-21 US US17/904,493 patent/US20230108672A1/en active Pending
- 2020-02-21 WO PCT/JP2020/007121 patent/WO2021166230A1/ja unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014072409A (ja) * | 2012-09-28 | 2014-04-21 | Juki Corp | 部品検査方法及び装置 |
WO2019123527A1 (ja) * | 2017-12-19 | 2019-06-27 | 株式会社Fuji | 実装装置、検出装置及び検出方法 |
WO2019207763A1 (ja) * | 2018-04-27 | 2019-10-31 | 株式会社Fuji | キャリアテープ搬送装置およびキャリアテープ搬送方法 |
Also Published As
Publication number | Publication date |
---|---|
US20230108672A1 (en) | 2023-04-06 |
WO2021166230A1 (ja) | 2021-08-26 |
CN115004877A (zh) | 2022-09-02 |
EP4110031A4 (en) | 2023-06-28 |
CN115004877B (zh) | 2023-09-05 |
EP4110031A1 (en) | 2022-12-28 |
JP7423741B2 (ja) | 2024-01-29 |
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