JPWO2021149780A5 - - Google Patents

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JPWO2021149780A5
JPWO2021149780A5 JP2021572801A JP2021572801A JPWO2021149780A5 JP WO2021149780 A5 JPWO2021149780 A5 JP WO2021149780A5 JP 2021572801 A JP2021572801 A JP 2021572801A JP 2021572801 A JP2021572801 A JP 2021572801A JP WO2021149780 A5 JPWO2021149780 A5 JP WO2021149780A5
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Japan
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increasing
movement
application
semiconductor device
resistance value
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JP2021572801A
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Japanese (ja)
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JP7618593B2 (ja
JPWO2021149780A1 (https=
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Priority claimed from PCT/JP2021/002106 external-priority patent/WO2021149780A1/ja
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JP2021572801A 2020-01-24 2021-01-21 半導体装置及びその駆動方法 Active JP7618593B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020010097 2020-01-24
JP2020010097 2020-01-24
PCT/JP2021/002106 WO2021149780A1 (ja) 2020-01-24 2021-01-21 半導体装置及びその駆動方法

Publications (3)

Publication Number Publication Date
JPWO2021149780A1 JPWO2021149780A1 (https=) 2021-07-29
JPWO2021149780A5 true JPWO2021149780A5 (https=) 2022-09-14
JP7618593B2 JP7618593B2 (ja) 2025-01-21

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JP2021572801A Active JP7618593B2 (ja) 2020-01-24 2021-01-21 半導体装置及びその駆動方法

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US (1) US12417802B2 (https=)
JP (1) JP7618593B2 (https=)
WO (1) WO2021149780A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127458B1 (en) * 2020-04-28 2021-09-21 Applied Materials, Inc. Non-uniform state spacing in multi-state memory element for low-power operation
JP2023030687A (ja) * 2021-08-23 2023-03-08 日本放送協会 ニューロモルフィック素子及びニューラルネットワーク素子

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6418049B1 (en) * 1997-12-04 2002-07-09 Arizona Board Of Regents Programmable sub-surface aggregating metallization structure and method of making same
JP5184721B1 (ja) 2011-08-10 2013-04-17 パナソニック株式会社 抵抗変化型不揮発性記憶素子の書き込み方法
JP6180700B2 (ja) * 2011-09-09 2017-08-16 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置及びその製造方法
JP2015018591A (ja) 2013-07-12 2015-01-29 株式会社東芝 不揮発性半導体記憶装置
US10332004B2 (en) 2015-07-13 2019-06-25 Denso Corporation Memristive neuromorphic circuit and method for training the memristive neuromorphic circuit
US10268949B2 (en) 2016-03-21 2019-04-23 International Business Machines Corporation Artificial neuron apparatus
WO2018013247A2 (en) * 2016-06-02 2018-01-18 Brown University Physics informed learning machine
JP6602279B2 (ja) * 2016-09-20 2019-11-06 株式会社東芝 メムキャパシタ、ニューロ素子およびニューラルネットワーク装置
JP6974955B2 (ja) 2017-03-28 2021-12-01 学校法人慶應義塾 クロスバー構造および最適化問題解探索システム
JP6914342B2 (ja) * 2017-09-07 2021-08-04 パナソニック株式会社 半導体記憶素子を用いたニューラルネットワーク演算回路
CN111052153B (zh) 2017-09-07 2023-07-14 松下控股株式会社 使用半导体存储元件的神经网络运算电路及动作方法
JP6569755B1 (ja) * 2018-03-06 2019-09-04 Tdk株式会社 ニューラルネットワーク装置、信号生成方法およびプログラム
US10482953B1 (en) * 2018-08-14 2019-11-19 Macronix International Co., Ltd. Multi-state memory device and method for adjusting memory state characteristics of the same
US11250317B2 (en) * 2018-09-27 2022-02-15 Intel Corporation Three-dimensional oscillator structure
US10784313B1 (en) * 2019-06-11 2020-09-22 International Business Machines Corporation Integrated resistive processing unit to avoid abrupt set of RRAM and abrupt reset of PCM
US11600325B2 (en) * 2020-12-02 2023-03-07 International Business Machines Corporation Non volatile resistive memory logic device
KR102648228B1 (ko) * 2021-05-13 2024-03-14 포항공과대학교 산학협력단 신경망 소자 및 이를 구성하는 단위 시냅스 소자

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