JPWO2021149410A1 - - Google Patents

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Publication number
JPWO2021149410A1
JPWO2021149410A1 JP2020570579A JP2020570579A JPWO2021149410A1 JP WO2021149410 A1 JPWO2021149410 A1 JP WO2021149410A1 JP 2020570579 A JP2020570579 A JP 2020570579A JP 2020570579 A JP2020570579 A JP 2020570579A JP WO2021149410 A1 JPWO2021149410 A1 JP WO2021149410A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2020570579A
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Japanese (ja)
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JP7081696B2 (ja
JPWO2021149410A5 (zh
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • General Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
JP2020570579A 2020-01-21 2020-12-16 ポジ型感光性樹脂組成物、硬化膜、積層体、導電パターン付き基板、積層体の製造方法、タッチパネル及び有機ｅｌ表示装置 Active JP7081696B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020007333 2020-01-21
JP2020007333 2020-01-21
PCT/JP2020/046911 WO2021149410A1 (ja) 2020-01-21 2020-12-16 ポジ型感光性樹脂組成物、硬化膜、積層体、導電パターン付き基板、積層体の製造方法、タッチパネル及び有機ｅｌ表示装置

Publications (3)

Publication Number Publication Date
JPWO2021149410A1 true JPWO2021149410A1 (zh) 2021-07-29
JPWO2021149410A5 JPWO2021149410A5 (zh) 2022-02-22
JP7081696B2 JP7081696B2 (ja) 2022-06-07

Family

ID=76992186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020570579A Active JP7081696B2 (ja) 2020-01-21 2020-12-16 ポジ型感光性樹脂組成物、硬化膜、積層体、導電パターン付き基板、積層体の製造方法、タッチパネル及び有機ｅｌ表示装置

Country Status (5)

Country Link
JP (1) JP7081696B2 (zh)
KR (1) KR102624811B1 (zh)
CN (1) CN114945867B (zh)
TW (1) TWI826761B (zh)
WO (1) WO2021149410A1 (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008185692A (ja) * 2007-01-29 2008-08-14 Adeka Corp ポジ型感光性樹脂組成物
WO2016158863A1 (ja) * 2015-04-01 2016-10-06 東レ株式会社 感光性着色樹脂組成物
WO2018180548A1 (ja) * 2017-03-29 2018-10-04 東レ株式会社 感光性組成物、硬化膜および有機ｅｌ表示装置
WO2019059359A1 (ja) * 2017-09-25 2019-03-28 東レ株式会社 着色樹脂組成物、着色膜、カラーフィルターおよび液晶表示装置

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JP5181968B2 (ja) * 2007-09-28 2013-04-10 東レ株式会社 ポジ型感光性組成物、硬化膜の製造方法、硬化膜、および硬化膜を有する素子
JP5233526B2 (ja) * 2008-09-05 2013-07-10 東レ株式会社 感光性組成物、それから形成された硬化膜、および硬化膜を有する素子
JP5441542B2 (ja) * 2009-07-22 2014-03-12 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化膜、層間絶縁膜、有機ｅｌ表示装置、及び液晶表示装置
JP5821481B2 (ja) * 2011-09-30 2015-11-24 東レ株式会社 ネガ型感光性樹脂組成物およびそれを用いた保護膜およびタッチパネル部材
JP2014048607A (ja) * 2012-09-04 2014-03-17 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP2014052401A (ja) * 2012-09-05 2014-03-20 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP2014091790A (ja) * 2012-11-05 2014-05-19 Toyo Ink Sc Holdings Co Ltd 樹脂組成物
JP6417669B2 (ja) * 2013-03-05 2018-11-07 東レ株式会社 感光性樹脂組成物、保護膜及び絶縁膜並びにタッチパネルの製造方法
JP2015193758A (ja) * 2014-03-31 2015-11-05 東洋インキＳｃホールディングス株式会社 オーバーコート用感光性樹脂組成物、ならびにそれを用いた塗膜
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KR101611836B1 (ko) * 2015-01-13 2016-04-12 동우 화인켐 주식회사 감광성 수지 조성물, 이로부터 형성된 광경화 패턴 및 이를 포함하는 화상 표시 장치
CN107407876A (zh) * 2015-03-06 2017-11-28 东丽株式会社 感光性树脂组合物及电子部件
KR102540423B1 (ko) * 2015-12-24 2023-06-05 미쯔비시 케미컬 주식회사 감광성 착색 조성물, 경화물, 착색 스페이서, 화상 표시 장치
KR102341566B1 (ko) * 2016-03-15 2021-12-21 도레이 카부시키가이샤 감광성 수지 조성물, 경화막, 적층체, 터치 패널용 부재, 및 경화막의 제조 방법
KR101979980B1 (ko) * 2016-03-23 2019-05-17 동우 화인켐 주식회사 감광성 수지 조성물
WO2018021331A1 (ja) * 2016-07-27 2018-02-01 東レ株式会社 樹脂組成物
JP6859353B2 (ja) * 2016-08-25 2021-04-14 富士フイルム株式会社 硬化性組成物及びその製造方法、硬化膜及びその製造方法、カラーフィルタ、固体撮像素子、固体撮像装置、並びに、赤外線センサ
WO2018066296A1 (ja) * 2016-10-04 2018-04-12 富士フイルム株式会社 分散組成物、硬化性組成物、硬化膜、カラーフィルタ、固体撮像素子、固体撮像装置、赤外線センサ、分散組成物の製造方法、硬化性組成物の製造方法、及び、硬化膜の製造方法
KR102313710B1 (ko) * 2017-09-29 2021-10-18 후지필름 가부시키가이샤 광경화성 조성물, 적층체, 및 고체 촬상 소자
JP6994044B2 (ja) * 2017-10-06 2022-01-14 富士フイルム株式会社 硬化膜の製造方法、固体撮像素子の製造方法、画像表示装置の製造方法
JP2019172975A (ja) * 2018-03-26 2019-10-10 東レ株式会社 樹脂組成物、樹脂シート、硬化膜
JP2019185034A (ja) * 2018-03-30 2019-10-24 Jsr株式会社 着色組成物、着色硬化膜、カラーフィルタ、表示素子、受光素子及び発光素子

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008185692A (ja) * 2007-01-29 2008-08-14 Adeka Corp ポジ型感光性樹脂組成物
WO2016158863A1 (ja) * 2015-04-01 2016-10-06 東レ株式会社 感光性着色樹脂組成物
WO2018180548A1 (ja) * 2017-03-29 2018-10-04 東レ株式会社 感光性組成物、硬化膜および有機ｅｌ表示装置
WO2019059359A1 (ja) * 2017-09-25 2019-03-28 東レ株式会社 着色樹脂組成物、着色膜、カラーフィルターおよび液晶表示装置

Also Published As

Publication number Publication date
KR20220131512A (ko) 2022-09-28
CN114945867A (zh) 2022-08-26
JP7081696B2 (ja) 2022-06-07
TWI826761B (zh) 2023-12-21
KR102624811B1 (ko) 2024-01-16
CN114945867B (zh) 2023-05-16
TW202132922A (zh) 2021-09-01
WO2021149410A1 (ja) 2021-07-29

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