JPWO2021132578A1 - - Google Patents

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Publication number
JPWO2021132578A1
JPWO2021132578A1 JP2021567682A JP2021567682A JPWO2021132578A1 JP WO2021132578 A1 JPWO2021132578 A1 JP WO2021132578A1 JP 2021567682 A JP2021567682 A JP 2021567682A JP 2021567682 A JP2021567682 A JP 2021567682A JP WO2021132578 A1 JPWO2021132578 A1 JP WO2021132578A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021567682A
Other languages
Japanese (ja)
Other versions
JP7334268B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021132578A1 publication Critical patent/JPWO2021132578A1/ja
Application granted granted Critical
Publication of JP7334268B2 publication Critical patent/JP7334268B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2021567682A 2019-12-27 2020-12-25 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス Active JP7334268B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019238513 2019-12-27
JP2019238513 2019-12-27
PCT/JP2020/048779 WO2021132578A1 (ja) 2019-12-27 2020-12-25 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Publications (2)

Publication Number Publication Date
JPWO2021132578A1 true JPWO2021132578A1 (ko) 2021-07-01
JP7334268B2 JP7334268B2 (ja) 2023-08-28

Family

ID=76573182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567682A Active JP7334268B2 (ja) 2019-12-27 2020-12-25 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

Country Status (5)

Country Link
JP (1) JP7334268B2 (ko)
KR (1) KR20220107008A (ko)
CN (1) CN114981360A (ko)
TW (1) TW202130705A (ko)
WO (1) WO2021132578A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113480566A (zh) * 2021-07-22 2021-10-08 广州星光有机硅科技有限公司 一种含二苯基甲烷的有机硅单体及其制备的超高折射率半导体led封装材料
CN118302485A (zh) * 2021-12-09 2024-07-05 日产化学株式会社 树脂组合物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283711A (ja) * 2008-05-22 2009-12-03 Hitachi Chemical Dupont Microsystems Ltd 半導体装置及びその製造方法、感光性樹脂組成物並びに電子部品
WO2017104672A1 (ja) * 2015-12-17 2017-06-22 富士フイルム株式会社 複素環含有ポリマー前駆体の製造方法、および複素環含有ポリマー前駆体、並びにその応用
WO2018043467A1 (ja) * 2016-08-31 2018-03-08 富士フイルム株式会社 樹脂組成物およびその応用
WO2018221457A1 (ja) * 2017-05-31 2018-12-06 富士フイルム株式会社 感光性樹脂組成物、ポリマー前駆体、硬化膜、積層体、硬化膜の製造方法および半導体デバイス

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5620691B2 (ja) 2010-02-16 2014-11-05 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283711A (ja) * 2008-05-22 2009-12-03 Hitachi Chemical Dupont Microsystems Ltd 半導体装置及びその製造方法、感光性樹脂組成物並びに電子部品
WO2017104672A1 (ja) * 2015-12-17 2017-06-22 富士フイルム株式会社 複素環含有ポリマー前駆体の製造方法、および複素環含有ポリマー前駆体、並びにその応用
WO2018043467A1 (ja) * 2016-08-31 2018-03-08 富士フイルム株式会社 樹脂組成物およびその応用
WO2018221457A1 (ja) * 2017-05-31 2018-12-06 富士フイルム株式会社 感光性樹脂組成物、ポリマー前駆体、硬化膜、積層体、硬化膜の製造方法および半導体デバイス

Also Published As

Publication number Publication date
TW202130705A (zh) 2021-08-16
CN114981360A (zh) 2022-08-30
KR20220107008A (ko) 2022-08-01
WO2021132578A1 (ja) 2021-07-01
JP7334268B2 (ja) 2023-08-28

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