CN114981360A - 固化性树脂组合物、固化膜、层叠体、固化膜的制造方法及半导体器件 - Google Patents

固化性树脂组合物、固化膜、层叠体、固化膜的制造方法及半导体器件 Download PDF

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Publication number
CN114981360A
CN114981360A CN202080093625.0A CN202080093625A CN114981360A CN 114981360 A CN114981360 A CN 114981360A CN 202080093625 A CN202080093625 A CN 202080093625A CN 114981360 A CN114981360 A CN 114981360A
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CN114981360B (zh
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井上和臣
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Fujifilm Corp
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN202080093625.0A 2019-12-27 2020-12-25 固化性树脂组合物、固化膜、层叠体、固化膜的制造方法及半导体器件 Active CN114981360B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019238513 2019-12-27
JP2019-238513 2019-12-27
PCT/JP2020/048779 WO2021132578A1 (ja) 2019-12-27 2020-12-25 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

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CN114981360A true CN114981360A (zh) 2022-08-30
CN114981360B CN114981360B (zh) 2024-09-10

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JP (1) JP7334268B2 (ko)
KR (1) KR20220107008A (ko)
CN (1) CN114981360B (ko)
TW (1) TW202130705A (ko)
WO (1) WO2021132578A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113480566A (zh) * 2021-07-22 2021-10-08 广州星光有机硅科技有限公司 一种含二苯基甲烷的有机硅单体及其制备的超高折射率半导体led封装材料
JPWO2023106101A1 (ko) * 2021-12-09 2023-06-15

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283711A (ja) * 2008-05-22 2009-12-03 Hitachi Chemical Dupont Microsystems Ltd 半導体装置及びその製造方法、感光性樹脂組成物並びに電子部品
TW201736438A (zh) * 2015-12-17 2017-10-16 Fujifilm Corp 含雜環的聚合物前驅體的製造方法及含雜環的聚合物前驅體以及其應用
WO2018043467A1 (ja) * 2016-08-31 2018-03-08 富士フイルム株式会社 樹脂組成物およびその応用

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5620691B2 (ja) 2010-02-16 2014-11-05 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置
EP3633455A4 (en) * 2017-05-31 2020-06-17 FUJIFILM Corporation PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, HARDENED FILM, LAMINATE, PROCESS FOR PRODUCING HARDENED FILM, AND SEMICONDUCTOR DEVICE

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009283711A (ja) * 2008-05-22 2009-12-03 Hitachi Chemical Dupont Microsystems Ltd 半導体装置及びその製造方法、感光性樹脂組成物並びに電子部品
TW201736438A (zh) * 2015-12-17 2017-10-16 Fujifilm Corp 含雜環的聚合物前驅體的製造方法及含雜環的聚合物前驅體以及其應用
WO2018043467A1 (ja) * 2016-08-31 2018-03-08 富士フイルム株式会社 樹脂組成物およびその応用

Also Published As

Publication number Publication date
JPWO2021132578A1 (ko) 2021-07-01
CN114981360B (zh) 2024-09-10
WO2021132578A1 (ja) 2021-07-01
TW202130705A (zh) 2021-08-16
JP7334268B2 (ja) 2023-08-28
KR20220107008A (ko) 2022-08-01

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