JPWO2021132058A1 - - Google Patents

Info

Publication number
JPWO2021132058A1
JPWO2021132058A1 JP2021567384A JP2021567384A JPWO2021132058A1 JP WO2021132058 A1 JPWO2021132058 A1 JP WO2021132058A1 JP 2021567384 A JP2021567384 A JP 2021567384A JP 2021567384 A JP2021567384 A JP 2021567384A JP WO2021132058 A1 JPWO2021132058 A1 JP WO2021132058A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021567384A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021132058A1 publication Critical patent/JPWO2021132058A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J121/00—Adhesives based on unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021567384A 2019-12-23 2020-12-18 Pending JPWO2021132058A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019231225 2019-12-23
PCT/JP2020/047362 WO2021132058A1 (ja) 2019-12-23 2020-12-18 電子タグ用接着剤および電子タグ

Publications (1)

Publication Number Publication Date
JPWO2021132058A1 true JPWO2021132058A1 (ja) 2021-07-01

Family

ID=76574673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567384A Pending JPWO2021132058A1 (ja) 2019-12-23 2020-12-18

Country Status (4)

Country Link
JP (1) JPWO2021132058A1 (ja)
CN (1) CN114729246B (ja)
TW (1) TW202132369A (ja)
WO (1) WO2021132058A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS648493A (en) * 1987-07-01 1989-01-12 Asahi Chemical Ind Ic card excellent in bend deformation
JP2003223626A (ja) * 2002-01-31 2003-08-08 Dainippon Printing Co Ltd Ｒｆｉｄタグの製造方法、及びｒｆｉｄタグ
JP2004213614A (ja) * 2002-11-21 2004-07-29 Lintec Corp Ｉｃタグ
JP2010277306A (ja) * 2009-05-28 2010-12-09 Toppan Printing Co Ltd Ｉｃタグ
WO2018030026A1 (ja) * 2016-08-09 2018-02-15 東洋紡株式会社 低誘電接着剤層を含有する積層体
WO2019230445A1 (ja) * 2018-05-28 2019-12-05 東洋紡株式会社 低誘電接着剤組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100577762C (zh) * 2004-02-03 2010-01-06 旭硝子株式会社 粘合剂组合物以及附有热塑性弹性体制模制品的玻璃板
US10562266B2 (en) * 2013-02-07 2020-02-18 Mitsui Chemicals, Inc. Adhesive, laminate, cell case packaging, cell, high-alkali solution packaging, alcohol-containing solution packaging, and package
TW201520286A (zh) * 2013-09-27 2015-06-01 Toagosei Co Ltd 接著性組成物及使用其之熱融接性複合構件
JP6718148B2 (ja) * 2014-09-24 2020-07-08 東亞合成株式会社 接着剤組成物及びこれを用いた接着剤層付き積層体
JP6791131B2 (ja) * 2015-05-15 2020-11-25 東洋紡株式会社 低誘電接着剤層を含有する積層体
CN107848259B (zh) * 2015-11-02 2020-08-21 东洋纺株式会社 低介电阻燃性粘合剂组合物
JP6561153B2 (ja) * 2017-02-20 2019-08-14 株式会社有沢製作所 樹脂組成物、接着フィルム、カバーレイフィルム、積層板、樹脂付き銅箔及び樹脂付き銅張り積層板
WO2018163999A1 (ja) * 2017-03-06 2018-09-13 株式会社村田製作所 金属張積層板、回路基板、および多層回路基板
JP7142008B2 (ja) * 2017-05-31 2022-09-26 三井化学株式会社 組成物、コーティング剤、接着剤及び積層体
JP6975326B2 (ja) * 2018-05-24 2021-12-01 三井化学株式会社 コーティング剤、フィルム、積層体および電池ケース用包材

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS648493A (en) * 1987-07-01 1989-01-12 Asahi Chemical Ind Ic card excellent in bend deformation
JP2003223626A (ja) * 2002-01-31 2003-08-08 Dainippon Printing Co Ltd Ｒｆｉｄタグの製造方法、及びｒｆｉｄタグ
JP2004213614A (ja) * 2002-11-21 2004-07-29 Lintec Corp Ｉｃタグ
JP2010277306A (ja) * 2009-05-28 2010-12-09 Toppan Printing Co Ltd Ｉｃタグ
WO2018030026A1 (ja) * 2016-08-09 2018-02-15 東洋紡株式会社 低誘電接着剤層を含有する積層体
WO2019230445A1 (ja) * 2018-05-28 2019-12-05 東洋紡株式会社 低誘電接着剤組成物

Also Published As

Publication number Publication date
WO2021132058A1 (ja) 2021-07-01
TW202132369A (zh) 2021-09-01
CN114729246A (zh) 2022-07-08
CN114729246B (zh) 2024-05-28

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