JPWO2021111919A5 - - Google Patents

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Publication number
JPWO2021111919A5
JPWO2021111919A5 JP2021562580A JP2021562580A JPWO2021111919A5 JP WO2021111919 A5 JPWO2021111919 A5 JP WO2021111919A5 JP 2021562580 A JP2021562580 A JP 2021562580A JP 2021562580 A JP2021562580 A JP 2021562580A JP WO2021111919 A5 JPWO2021111919 A5 JP WO2021111919A5
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JP
Japan
Prior art keywords
plating solution
electrolytic copper
copper plating
atom
mass
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JP2021562580A
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English (en)
Japanese (ja)
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JPWO2021111919A1 (cg-RX-API-DMAC7.html
JP7710376B2 (ja
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Priority claimed from PCT/JP2020/043577 external-priority patent/WO2021111919A1/ja
Publication of JPWO2021111919A1 publication Critical patent/JPWO2021111919A1/ja
Publication of JPWO2021111919A5 publication Critical patent/JPWO2021111919A5/ja
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Publication of JP7710376B2 publication Critical patent/JP7710376B2/ja
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JP2021562580A 2019-12-04 2020-11-24 電解銅めっき液、その製造方法及び電解銅めっき方法 Active JP7710376B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019219370 2019-12-04
JP2019219370 2019-12-04
PCT/JP2020/043577 WO2021111919A1 (ja) 2019-12-04 2020-11-24 電解銅めっき液、その製造方法及び電解銅めっき方法

Publications (3)

Publication Number Publication Date
JPWO2021111919A1 JPWO2021111919A1 (cg-RX-API-DMAC7.html) 2021-06-10
JPWO2021111919A5 true JPWO2021111919A5 (cg-RX-API-DMAC7.html) 2023-11-20
JP7710376B2 JP7710376B2 (ja) 2025-07-18

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ID=76222138

Family Applications (1)

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JP2021562580A Active JP7710376B2 (ja) 2019-12-04 2020-11-24 電解銅めっき液、その製造方法及び電解銅めっき方法

Country Status (6)

Country Link
US (1) US20230025950A1 (cg-RX-API-DMAC7.html)
JP (1) JP7710376B2 (cg-RX-API-DMAC7.html)
KR (1) KR20220109405A (cg-RX-API-DMAC7.html)
CN (1) CN114761621A (cg-RX-API-DMAC7.html)
TW (1) TWI901613B (cg-RX-API-DMAC7.html)
WO (1) WO2021111919A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024016330A1 (zh) * 2022-07-22 2024-01-25 扬州纳力新材料科技有限公司 无氰镀铜晶粒细化剂、无氰镀铜镀液及其配制方法、应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316875A (ja) * 1994-05-23 1995-12-05 C Uyemura & Co Ltd 電気銅めっき用添加剤及び電気銅めっき浴
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
EP1422320A1 (en) * 2002-11-21 2004-05-26 Shipley Company, L.L.C. Copper electroplating bath
JP4704761B2 (ja) 2005-01-19 2011-06-22 石原薬品株式会社 電気銅メッキ浴、並びに銅メッキ方法
JP4799887B2 (ja) 2005-03-24 2011-10-26 石原薬品株式会社 電気銅メッキ浴、並びに銅メッキ方法
JP4750486B2 (ja) * 2005-07-06 2011-08-17 株式会社Adeka 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法
JP2007016264A (ja) * 2005-07-06 2007-01-25 Adeka Corp 新規化合物、該化合物からなる電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴、該メッキ浴を使用する電解銅メッキ方法
JP5637671B2 (ja) * 2009-09-16 2014-12-10 上村工業株式会社 電気銅めっき浴及びその電気銅めっき浴を用いた電気めっき方法
CN105102687A (zh) * 2013-04-02 2015-11-25 株式会社Adeka 电镀铜浴用添加剂、含该添加剂的电镀铜浴及使用该电镀铜浴的电镀铜方法

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