JPWO2021075240A1 - - Google Patents
Info
- Publication number
- JPWO2021075240A1 JPWO2021075240A1 JP2021552292A JP2021552292A JPWO2021075240A1 JP WO2021075240 A1 JPWO2021075240 A1 JP WO2021075240A1 JP 2021552292 A JP2021552292 A JP 2021552292A JP 2021552292 A JP2021552292 A JP 2021552292A JP WO2021075240 A1 JPWO2021075240 A1 JP WO2021075240A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019190776 | 2019-10-18 | ||
| JP2019190776 | 2019-10-18 | ||
| PCT/JP2020/036476 WO2021075240A1 (ja) | 2019-10-18 | 2020-09-25 | 構造体および加熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021075240A1 true JPWO2021075240A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2021-04-22 |
| JP7368488B2 JP7368488B2 (ja) | 2023-10-24 |
Family
ID=75537828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021552292A Active JP7368488B2 (ja) | 2019-10-18 | 2020-09-25 | 構造体および加熱装置 |
Country Status (4)
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12183601B2 (en) * | 2019-10-18 | 2024-12-31 | Kyocera Corporation | Structural body and heating apparatus |
| JP7498605B2 (ja) * | 2020-07-01 | 2024-06-12 | 日本特殊陶業株式会社 | セラミックス部材、保持装置、及びセラミックス部材の製造方法 |
| JP7547282B2 (ja) * | 2021-05-20 | 2024-09-09 | 京セラ株式会社 | セラミック構造体の製造方法 |
| JP7623309B2 (ja) | 2022-01-12 | 2025-01-28 | 日本碍子株式会社 | ウエハ載置台 |
| WO2025041254A1 (ja) * | 2023-08-22 | 2025-02-27 | 日本碍子株式会社 | 半導体製造装置用部材 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57136196U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1981-02-21 | 1982-08-25 | ||
| JP2002313531A (ja) * | 2001-04-17 | 2002-10-25 | Toshiba Ceramics Co Ltd | 面状セラミックスヒーター及び製造方法 |
| JP2003188248A (ja) * | 2001-12-19 | 2003-07-04 | Kyocera Corp | ウェハ支持部材 |
| JP2003245792A (ja) * | 2002-02-21 | 2003-09-02 | Sumitomo Electric Ind Ltd | 接続構造 |
| JP2004087392A (ja) * | 2002-08-28 | 2004-03-18 | Toshiba Ceramics Co Ltd | ＡｌＮヒータ及びその製造方法 |
| JP2009188394A (ja) * | 2008-01-08 | 2009-08-20 | Ngk Insulators Ltd | 接合構造及び半導体製造装置 |
| JP2015002300A (ja) * | 2013-06-17 | 2015-01-05 | 株式会社Maruwa | 接合構造体及びこれを用いた半導体製造装置 |
| JP2018064055A (ja) * | 2016-10-14 | 2018-04-19 | 日本碍子株式会社 | 半導体製造装置用部材及びその製法 |
| JP2018185972A (ja) * | 2017-04-26 | 2018-11-22 | 京セラ株式会社 | 試料保持具 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003040686A (ja) | 2001-07-27 | 2003-02-13 | Taiheiyo Cement Corp | セラミック部品 |
| JP4531004B2 (ja) * | 2006-03-24 | 2010-08-25 | 日本碍子株式会社 | 加熱装置 |
| JP4421595B2 (ja) * | 2006-11-16 | 2010-02-24 | 日本碍子株式会社 | 加熱装置 |
| US8414704B2 (en) * | 2008-01-08 | 2013-04-09 | Ngk Insulators, Ltd. | Bonding structure and semiconductor device manufacturing apparatus |
| JP5968651B2 (ja) * | 2011-03-31 | 2016-08-10 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP7025268B2 (ja) * | 2018-04-04 | 2022-02-24 | 日本特殊陶業株式会社 | セラミックス構造体 |
| US20210265189A1 (en) * | 2018-09-28 | 2021-08-26 | Kyocera Corporation | Ceramic structure and wafer system |
| US12266557B2 (en) * | 2021-11-15 | 2025-04-01 | Ngk Insulators, Ltd. | Wafer placement table |
| JP7580429B2 (ja) * | 2022-06-10 | 2024-11-11 | 日本碍子株式会社 | ウエハ載置台 |
-
2020
- 2020-09-25 KR KR1020227012459A patent/KR102735423B1/ko active Active
- 2020-09-25 US US17/769,145 patent/US20230141651A1/en active Pending
- 2020-09-25 JP JP2021552292A patent/JP7368488B2/ja active Active
- 2020-09-25 WO PCT/JP2020/036476 patent/WO2021075240A1/ja not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57136196U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1981-02-21 | 1982-08-25 | ||
| JP2002313531A (ja) * | 2001-04-17 | 2002-10-25 | Toshiba Ceramics Co Ltd | 面状セラミックスヒーター及び製造方法 |
| JP2003188248A (ja) * | 2001-12-19 | 2003-07-04 | Kyocera Corp | ウェハ支持部材 |
| JP2003245792A (ja) * | 2002-02-21 | 2003-09-02 | Sumitomo Electric Ind Ltd | 接続構造 |
| JP2004087392A (ja) * | 2002-08-28 | 2004-03-18 | Toshiba Ceramics Co Ltd | ＡｌＮヒータ及びその製造方法 |
| JP2009188394A (ja) * | 2008-01-08 | 2009-08-20 | Ngk Insulators Ltd | 接合構造及び半導体製造装置 |
| JP2015002300A (ja) * | 2013-06-17 | 2015-01-05 | 株式会社Maruwa | 接合構造体及びこれを用いた半導体製造装置 |
| JP2018064055A (ja) * | 2016-10-14 | 2018-04-19 | 日本碍子株式会社 | 半導体製造装置用部材及びその製法 |
| JP2018185972A (ja) * | 2017-04-26 | 2018-11-22 | 京セラ株式会社 | 試料保持具 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7368488B2 (ja) | 2023-10-24 |
| US20230141651A1 (en) | 2023-05-11 |
| KR102735423B1 (ko) | 2024-11-28 |
| KR20220062390A (ko) | 2022-05-16 |
| WO2021075240A1 (ja) | 2021-04-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220408 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230124 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230324 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20230425 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230713 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20230817 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230912 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20231012 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7368488 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |