JPWO2021075240A1 - - Google Patents

Info

Publication number
JPWO2021075240A1
JPWO2021075240A1 JP2021552292A JP2021552292A JPWO2021075240A1 JP WO2021075240 A1 JPWO2021075240 A1 JP WO2021075240A1 JP 2021552292 A JP2021552292 A JP 2021552292A JP 2021552292 A JP2021552292 A JP 2021552292A JP WO2021075240 A1 JPWO2021075240 A1 JP WO2021075240A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021552292A
Other versions
JP7368488B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021075240A1 publication Critical patent/JPWO2021075240A1/ja
Application granted granted Critical
Publication of JP7368488B2 publication Critical patent/JP7368488B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/03—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021552292A 2019-10-18 2020-09-25 構造体および加熱装置 Active JP7368488B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019190776 2019-10-18
JP2019190776 2019-10-18
PCT/JP2020/036476 WO2021075240A1 (ja) 2019-10-18 2020-09-25 構造体および加熱装置

Publications (2)

Publication Number Publication Date
JPWO2021075240A1 true JPWO2021075240A1 (ja) 2021-04-22
JP7368488B2 JP7368488B2 (ja) 2023-10-24

Family

ID=75537828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021552292A Active JP7368488B2 (ja) 2019-10-18 2020-09-25 構造体および加熱装置

Country Status (4)

Country Link
US (1) US20230141651A1 (ja)
JP (1) JP7368488B2 (ja)
KR (1) KR20220062390A (ja)
WO (1) WO2021075240A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7498605B2 (ja) 2020-07-01 2024-06-12 日本特殊陶業株式会社 セラミックス部材、保持装置、及びセラミックス部材の製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57136196U (ja) * 1981-02-21 1982-08-25
JP2002313531A (ja) * 2001-04-17 2002-10-25 Toshiba Ceramics Co Ltd 面状セラミックスヒーター及び製造方法
JP2003188248A (ja) * 2001-12-19 2003-07-04 Kyocera Corp ウェハ支持部材
JP2003245792A (ja) * 2002-02-21 2003-09-02 Sumitomo Electric Ind Ltd 接続構造
JP2004087392A (ja) * 2002-08-28 2004-03-18 Toshiba Ceramics Co Ltd ＡｌＮヒータ及びその製造方法
JP2009188394A (ja) * 2008-01-08 2009-08-20 Ngk Insulators Ltd 接合構造及び半導体製造装置
JP2015002300A (ja) * 2013-06-17 2015-01-05 株式会社Maruwa 接合構造体及びこれを用いた半導体製造装置
JP2018064055A (ja) * 2016-10-14 2018-04-19 日本碍子株式会社 半導体製造装置用部材及びその製法
JP2018185972A (ja) * 2017-04-26 2018-11-22 京セラ株式会社 試料保持具

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003040686A (ja) 2001-07-27 2003-02-13 Taiheiyo Cement Corp セラミック部品

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57136196U (ja) * 1981-02-21 1982-08-25
JP2002313531A (ja) * 2001-04-17 2002-10-25 Toshiba Ceramics Co Ltd 面状セラミックスヒーター及び製造方法
JP2003188248A (ja) * 2001-12-19 2003-07-04 Kyocera Corp ウェハ支持部材
JP2003245792A (ja) * 2002-02-21 2003-09-02 Sumitomo Electric Ind Ltd 接続構造
JP2004087392A (ja) * 2002-08-28 2004-03-18 Toshiba Ceramics Co Ltd ＡｌＮヒータ及びその製造方法
JP2009188394A (ja) * 2008-01-08 2009-08-20 Ngk Insulators Ltd 接合構造及び半導体製造装置
JP2015002300A (ja) * 2013-06-17 2015-01-05 株式会社Maruwa 接合構造体及びこれを用いた半導体製造装置
JP2018064055A (ja) * 2016-10-14 2018-04-19 日本碍子株式会社 半導体製造装置用部材及びその製法
JP2018185972A (ja) * 2017-04-26 2018-11-22 京セラ株式会社 試料保持具

Also Published As

Publication number Publication date
WO2021075240A1 (ja) 2021-04-22
US20230141651A1 (en) 2023-05-11
KR20220062390A (ko) 2022-05-16
JP7368488B2 (ja) 2023-10-24

Similar Documents

Publication Publication Date Title
BR112021017339A2 (ja)
BR112021013854A2 (ja)
BR112021018450A2 (ja)
AU2020104490A4 (ja)
BR112021017738A2 (ja)
BR112021017782A2 (ja)
BR112021018168A2 (ja)
BR112021017728A2 (ja)
BR112021018452A2 (ja)
BR112021017234A2 (ja)
BR112021017355A2 (ja)
BR112021017703A2 (ja)
BR112021018102A2 (ja)
BR112021017173A2 (ja)
BR112021017083A2 (ja)
BR112021017637A2 (ja)
BR112021018250A2 (ja)
BR112021018093A2 (ja)
BR112021018084A2 (ja)
BR112021018484A2 (ja)
BR112021017732A2 (ja)
BR112021015080A2 (ja)
BR112021016996A2 (ja)
BR112021017010A2 (ja)
AT524962A5 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220408

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230124

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230324

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230425

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230713

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20230817

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230912

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231012

R150 Certificate of patent or registration of utility model

Ref document number: 7368488

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150