JPWO2021070677A1 - - Google Patents

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Publication number
JPWO2021070677A1
JPWO2021070677A1 JP2021551305A JP2021551305A JPWO2021070677A1 JP WO2021070677 A1 JPWO2021070677 A1 JP WO2021070677A1 JP 2021551305 A JP2021551305 A JP 2021551305A JP 2021551305 A JP2021551305 A JP 2021551305A JP WO2021070677 A1 JPWO2021070677 A1 JP WO2021070677A1
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JP
Japan
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JP2021551305A
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JPWO2021070677A5 (ja
JP7269362B2 (ja
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Publication of JPWO2021070677A5 publication Critical patent/JPWO2021070677A5/ja
Priority to JP2023069540A priority Critical patent/JP7504258B2/ja
Application granted granted Critical
Publication of JP7269362B2 publication Critical patent/JP7269362B2/ja
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    • H—ELECTRICITY
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C45/26—Moulds
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Citations (6)

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Publication number Priority date Publication date Assignee Title
JPH05218122A (ja) * 1992-01-30 1993-08-27 Nec Corp 樹脂封止型半導体装置の樹脂封止金型
JPH05326594A (ja) * 1992-05-22 1993-12-10 Nec Corp 半導体装置の樹脂封止金型と樹脂封止方法
JP2007042709A (ja) * 2005-08-01 2007-02-15 Seiko Epson Corp 樹脂封止金型及び樹脂封止型電子部品
JP2010263066A (ja) * 2009-05-07 2010-11-18 Renesas Electronics Corp 半導体装置の製造方法
JP2012146799A (ja) * 2011-01-12 2012-08-02 Renesas Electronics Corp 半導体装置の製造方法
JP2013207083A (ja) * 2012-03-28 2013-10-07 Seiko Epson Corp 電子デバイスの製造方法、及び樹脂成形型

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218122A (ja) * 1992-01-30 1993-08-27 Nec Corp 樹脂封止型半導体装置の樹脂封止金型
JPH05326594A (ja) * 1992-05-22 1993-12-10 Nec Corp 半導体装置の樹脂封止金型と樹脂封止方法
JP2007042709A (ja) * 2005-08-01 2007-02-15 Seiko Epson Corp 樹脂封止金型及び樹脂封止型電子部品
JP2010263066A (ja) * 2009-05-07 2010-11-18 Renesas Electronics Corp 半導体装置の製造方法
JP2012146799A (ja) * 2011-01-12 2012-08-02 Renesas Electronics Corp 半導体装置の製造方法
JP2013207083A (ja) * 2012-03-28 2013-10-07 Seiko Epson Corp 電子デバイスの製造方法、及び樹脂成形型

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