JPWO2021070540A1 - - Google Patents

Info

Publication number
JPWO2021070540A1
JPWO2021070540A1 JP2021550522A JP2021550522A JPWO2021070540A1 JP WO2021070540 A1 JPWO2021070540 A1 JP WO2021070540A1 JP 2021550522 A JP2021550522 A JP 2021550522A JP 2021550522 A JP2021550522 A JP 2021550522A JP WO2021070540 A1 JPWO2021070540 A1 JP WO2021070540A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021550522A
Other versions
JP7369916B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021070540A1 publication Critical patent/JPWO2021070540A1/ja
Application granted granted Critical
Publication of JP7369916B2 publication Critical patent/JP7369916B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B9/00—Exposure-making shutters; Diaphragms
    • G03B9/08—Shutters
    • G03B9/36—Sliding rigid plate
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B9/00—Exposure-making shutters; Diaphragms
    • G03B9/58—Means for varying duration of "open" period of shutter
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/75—Circuitry for compensating brightness variation in the scene by influencing optical camera components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/53—Control of the integration time
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021550522A 2019-10-10 2020-09-09 部品搭載システムおよび部品搭載方法 Active JP7369916B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019186613 2019-10-10
JP2019186613 2019-10-10
PCT/JP2020/034044 WO2021070540A1 (ja) 2019-10-10 2020-09-09 部品搭載システムおよび部品搭載方法

Publications (2)

Publication Number Publication Date
JPWO2021070540A1 true JPWO2021070540A1 (ja) 2021-04-15
JP7369916B2 JP7369916B2 (ja) 2023-10-27

Family

ID=75437160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021550522A Active JP7369916B2 (ja) 2019-10-10 2020-09-09 部品搭載システムおよび部品搭載方法

Country Status (4)

Country Link
JP (1) JP7369916B2 (ja)
CN (1) CN114503797A (ja)
DE (1) DE112020004916T5 (ja)
WO (1) WO2021070540A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04180300A (ja) * 1990-11-14 1992-06-26 Matsushita Electric Ind Co Ltd 電子部品の装着装置および装着方法
JPH06260794A (ja) * 1993-03-08 1994-09-16 Toshiba Corp 電子部品の位置認識方法および位置認識装置
JPH07201932A (ja) * 1993-12-28 1995-08-04 Matsushita Electric Ind Co Ltd 電子部品のボンディング装置およびボンディング方法
JP5384085B2 (ja) * 2008-11-11 2014-01-08 ヤマハ発動機株式会社 部品実装方法および部品実装システム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3403818B2 (ja) * 1994-07-14 2003-05-06 松下電器産業株式会社 実装部品検査方法とその装置
JP3873757B2 (ja) * 2002-02-05 2007-01-24 松下電器産業株式会社 電子部品実装システムおよび電子部品実装方法
JP4029855B2 (ja) * 2004-03-26 2008-01-09 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP4595857B2 (ja) * 2006-03-27 2010-12-08 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
JP5392303B2 (ja) * 2011-06-13 2014-01-22 パナソニック株式会社 電子部品実装システムおよび電子部品実装システムにおける実装基板の製造方法
JP2014017364A (ja) * 2012-07-09 2014-01-30 Panasonic Corp 部品実装基板の製造システム、および製造方法
JP6277422B2 (ja) * 2014-09-11 2018-02-14 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装システム
JP6582240B2 (ja) * 2016-02-23 2019-10-02 パナソニックＩｐマネジメント株式会社 電子部品実装方法および電子部品実装装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04180300A (ja) * 1990-11-14 1992-06-26 Matsushita Electric Ind Co Ltd 電子部品の装着装置および装着方法
JPH06260794A (ja) * 1993-03-08 1994-09-16 Toshiba Corp 電子部品の位置認識方法および位置認識装置
JPH07201932A (ja) * 1993-12-28 1995-08-04 Matsushita Electric Ind Co Ltd 電子部品のボンディング装置およびボンディング方法
JP5384085B2 (ja) * 2008-11-11 2014-01-08 ヤマハ発動機株式会社 部品実装方法および部品実装システム

Also Published As

Publication number Publication date
CN114503797A (zh) 2022-05-13
JP7369916B2 (ja) 2023-10-27
WO2021070540A1 (ja) 2021-04-15
DE112020004916T5 (de) 2022-06-23

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