JPWO2021065243A1 - - Google Patents
Info
- Publication number
- JPWO2021065243A1 JPWO2021065243A1 JP2021550419A JP2021550419A JPWO2021065243A1 JP WO2021065243 A1 JPWO2021065243 A1 JP WO2021065243A1 JP 2021550419 A JP2021550419 A JP 2021550419A JP 2021550419 A JP2021550419 A JP 2021550419A JP WO2021065243 A1 JPWO2021065243 A1 JP WO2021065243A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/32—Properties characterising the ingredient of the composition containing low molecular weight liquid component
- C08L2207/324—Liquid component is low molecular weight polymer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2314/00—Polymer mixtures characterised by way of preparation
- C08L2314/08—Polymer mixtures characterised by way of preparation prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019183650 | 2019-10-04 | ||
| JP2019183650 | 2019-10-04 | ||
| PCT/JP2020/031631 WO2021065243A1 (ja) | 2019-10-04 | 2020-08-21 | 導電性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021065243A1 true JPWO2021065243A1 (https=) | 2021-04-08 |
| JPWO2021065243A5 JPWO2021065243A5 (https=) | 2022-06-13 |
| JP7541247B2 JP7541247B2 (ja) | 2024-08-28 |
Family
ID=75338182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021550419A Active JP7541247B2 (ja) | 2019-10-04 | 2020-08-21 | 導電性樹脂組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12104060B2 (https=) |
| JP (1) | JP7541247B2 (https=) |
| KR (1) | KR20220079531A (https=) |
| CN (1) | CN114450352B (https=) |
| WO (1) | WO2021065243A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102742117B1 (ko) * | 2018-08-01 | 2024-12-16 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 실리콘 점착제 조성물 및 이것을 사용한 점착 테이프 또는 점착 필름 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004331742A (ja) * | 2003-05-02 | 2004-11-25 | Shin Etsu Chem Co Ltd | 付加反応硬化型導電性シリコーンゴム組成物及びその硬化方法並びにその硬化物 |
| JP2008038137A (ja) * | 2006-07-12 | 2008-02-21 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーングリース組成物およびその硬化物 |
| JP2009108312A (ja) * | 2007-10-11 | 2009-05-21 | Dow Corning Toray Co Ltd | 金属粒子分散構造体、該構造体からなる微粒子、該構造体により被覆された物品およびこれらの製造方法 |
| JP2010150399A (ja) * | 2008-12-25 | 2010-07-08 | Shin-Etsu Chemical Co Ltd | 熱伝導性シリコーングリース組成物 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030060971A (ko) * | 2000-12-07 | 2003-07-16 | 가네가후치 가가쿠 고교 가부시키가이샤 | 반도전성 수지 조성물 및 반도전성 부재 |
| JP3922342B2 (ja) | 2001-01-17 | 2007-05-30 | 信越化学工業株式会社 | 電気接点材料用又は電磁波シールド材料用導電性シリコーンゴム組成物及び電気接点材料用又は電磁波シールド材料用導電性部品 |
| JP2007154100A (ja) * | 2005-12-07 | 2007-06-21 | Canon Inc | 樹脂用導電剤、導電性樹脂組成物及び導電性樹脂組成物の製造方法 |
| EP1878767A1 (en) * | 2006-07-12 | 2008-01-16 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone grease composition and cured product thereof |
| CN101624471A (zh) * | 2009-03-06 | 2010-01-13 | 上海锐朗光电材料有限公司 | 一种热固化现场成型高导电硅橡胶组合物及其应用 |
| CN102220012B (zh) * | 2011-06-08 | 2012-10-31 | 北京工业大学 | 电磁屏蔽用单组分挤出成型导电橡胶及其制备方法 |
| JP5511872B2 (ja) * | 2012-03-19 | 2014-06-04 | 日本バルカー工業株式会社 | 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート |
| JP6592438B2 (ja) * | 2014-07-30 | 2019-10-16 | 住友精化株式会社 | シリコーン樹脂組成物、シリコーン樹脂硬化物、及び、光半導体素子封止体 |
| WO2016116959A1 (ja) * | 2015-01-19 | 2016-07-28 | 京セラケミカル株式会社 | 導電性樹脂組成物および半導体装置 |
| JP6791672B2 (ja) * | 2016-07-22 | 2020-11-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱伝導性ポリシロキサン組成物 |
| US11542381B2 (en) * | 2018-02-06 | 2023-01-03 | Mitsubishi Materials Corporation | Silver-coated resin particle |
-
2020
- 2020-08-21 JP JP2021550419A patent/JP7541247B2/ja active Active
- 2020-08-21 WO PCT/JP2020/031631 patent/WO2021065243A1/ja not_active Ceased
- 2020-08-21 KR KR1020227009703A patent/KR20220079531A/ko active Pending
- 2020-08-21 US US17/754,414 patent/US12104060B2/en active Active
- 2020-08-21 CN CN202080067368.3A patent/CN114450352B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004331742A (ja) * | 2003-05-02 | 2004-11-25 | Shin Etsu Chem Co Ltd | 付加反応硬化型導電性シリコーンゴム組成物及びその硬化方法並びにその硬化物 |
| JP2008038137A (ja) * | 2006-07-12 | 2008-02-21 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーングリース組成物およびその硬化物 |
| JP2009108312A (ja) * | 2007-10-11 | 2009-05-21 | Dow Corning Toray Co Ltd | 金属粒子分散構造体、該構造体からなる微粒子、該構造体により被覆された物品およびこれらの製造方法 |
| JP2010150399A (ja) * | 2008-12-25 | 2010-07-08 | Shin-Etsu Chemical Co Ltd | 熱伝導性シリコーングリース組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114450352B (zh) | 2023-12-26 |
| KR20220079531A (ko) | 2022-06-13 |
| US20220372292A1 (en) | 2022-11-24 |
| CN114450352A (zh) | 2022-05-06 |
| JP7541247B2 (ja) | 2024-08-28 |
| WO2021065243A1 (ja) | 2021-04-08 |
| US12104060B2 (en) | 2024-10-01 |
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