JPWO2021014635A1 - - Google Patents

Info

Publication number
JPWO2021014635A1
JPWO2021014635A1 JP2021534505A JP2021534505A JPWO2021014635A1 JP WO2021014635 A1 JPWO2021014635 A1 JP WO2021014635A1 JP 2021534505 A JP2021534505 A JP 2021534505A JP 2021534505 A JP2021534505 A JP 2021534505A JP WO2021014635 A1 JPWO2021014635 A1 JP WO2021014635A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021534505A
Other languages
Japanese (ja)
Other versions
JP7179992B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021014635A1 publication Critical patent/JPWO2021014635A1/ja
Application granted granted Critical
Publication of JP7179992B2 publication Critical patent/JP7179992B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Automation & Control Theory (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021534505A 2019-07-25 2019-07-25 対基板作業機と対基板作業機の制御方法 Active JP7179992B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/029178 WO2021014635A1 (ja) 2019-07-25 2019-07-25 対基板作業機と対基板作業機の制御方法

Publications (2)

Publication Number Publication Date
JPWO2021014635A1 true JPWO2021014635A1 (zh) 2021-01-28
JP7179992B2 JP7179992B2 (ja) 2022-11-29

Family

ID=74192560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021534505A Active JP7179992B2 (ja) 2019-07-25 2019-07-25 対基板作業機と対基板作業機の制御方法

Country Status (5)

Country Link
US (1) US20220272883A1 (zh)
EP (1) EP4007477A4 (zh)
JP (1) JP7179992B2 (zh)
CN (1) CN114145082B (zh)
WO (1) WO2021014635A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023053274A1 (ja) 2021-09-29 2023-04-06 株式会社Fuji 対基板作業機及び基板製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590788A (ja) * 1991-09-30 1993-04-09 Sony Corp 自動部品マウント装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187394A (ja) * 1984-10-05 1986-05-02 松下電器産業株式会社 電子部品リ−ド線切断装置
JPS62104100A (ja) * 1985-10-30 1987-05-14 関西日本電気株式会社 部品装着検出方法
JPS6459999A (en) * 1987-08-31 1989-03-07 Nippon Denki Home Electronics Detection of insertion of electronic component
US4833776A (en) 1988-01-29 1989-05-30 Westinghouse Electric Corp. Tactile retrieval and insertion and method for electronic components in through-hole printed circuit boards
JPH0472800A (ja) * 1990-07-13 1992-03-06 Canon Inc リード線挿入検査装置
JPH09205297A (ja) * 1996-01-26 1997-08-05 Matsushita Electric Ind Co Ltd 電子部品実装方法
KR100648790B1 (ko) * 1999-04-27 2006-11-23 마츠시타 덴끼 산교 가부시키가이샤 소자 실장기기 및 기판상으로의 소자의 부착을 검출하는장치
JP3680253B2 (ja) * 1999-07-16 2005-08-10 Ｔｄｋ株式会社 リード線付き電子部品挿入方法及び装置
JP5828141B2 (ja) * 2011-11-30 2015-12-02 パナソニックＩｐマネジメント株式会社 部品挿入装置および部品挿入検出方法
JP6187394B2 (ja) 2014-06-18 2017-08-30 富士通株式会社 半導体ナノワイヤの製造方法及び半導体ナノワイヤ素子の製造方法
WO2017037895A1 (ja) * 2015-09-02 2017-03-09 富士機械製造株式会社 電子部品挿入組立機
JP6619019B2 (ja) 2015-10-22 2019-12-11 株式会社Ｆｕｊｉ 対基板作業システム、および挿入方法
JP6459999B2 (ja) 2016-02-10 2019-01-30 サミー株式会社 ぱちんこ遊技機
JP7349657B2 (ja) * 2018-10-15 2023-09-25 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装基板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590788A (ja) * 1991-09-30 1993-04-09 Sony Corp 自動部品マウント装置

Also Published As

Publication number Publication date
EP4007477A4 (en) 2022-07-20
WO2021014635A1 (ja) 2021-01-28
EP4007477A1 (en) 2022-06-01
CN114145082A (zh) 2022-03-04
US20220272883A1 (en) 2022-08-25
JP7179992B2 (ja) 2022-11-29
CN114145082B (zh) 2023-11-10

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