JPWO2021014505A1 - - Google Patents

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Publication number
JPWO2021014505A1
JPWO2021014505A1 JP2021534864A JP2021534864A JPWO2021014505A1 JP WO2021014505 A1 JPWO2021014505 A1 JP WO2021014505A1 JP 2021534864 A JP2021534864 A JP 2021534864A JP 2021534864 A JP2021534864 A JP 2021534864A JP WO2021014505 A1 JPWO2021014505 A1 JP WO2021014505A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021534864A
Other languages
Japanese (ja)
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JP7197705B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2021014505A1 publication Critical patent/JPWO2021014505A1/ja
Application granted granted Critical
Publication of JP7197705B2 publication Critical patent/JP7197705B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021534864A 2019-07-19 2019-07-19 実装装置、実装システム及び検査実装方法 Active JP7197705B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/028508 WO2021014505A1 (ja) 2019-07-19 2019-07-19 実装装置、実装システム及び検査実装方法

Publications (2)

Publication Number Publication Date
JPWO2021014505A1 true JPWO2021014505A1 (https=) 2021-01-28
JP7197705B2 JP7197705B2 (ja) 2022-12-27

Family

ID=74193737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021534864A Active JP7197705B2 (ja) 2019-07-19 2019-07-19 実装装置、実装システム及び検査実装方法

Country Status (5)

Country Link
US (1) US12262476B2 (https=)
EP (1) EP4002977B1 (https=)
JP (1) JP7197705B2 (https=)
CN (1) CN114041332B (https=)
WO (1) WO2021014505A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113591589B (zh) * 2021-07-02 2022-09-27 北京百度网讯科技有限公司 产品漏检的识别方法、装置、电子设备及存储介质

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000013097A (ja) * 1998-06-18 2000-01-14 Juki Corp 部品搭載装置
JP2007158052A (ja) * 2005-12-06 2007-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置及び実装エラー修復方法
JP2007214212A (ja) * 2006-02-07 2007-08-23 Matsushita Electric Ind Co Ltd 実装状態判定方法、実装状態判定プログラム、実装状態判定装置、実装方法
WO2015040667A1 (ja) * 2013-09-17 2015-03-26 富士機械製造株式会社 実装検査装置
WO2017141377A1 (ja) * 2016-02-17 2017-08-24 富士機械製造株式会社 作業装置および生産ライン

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04324999A (ja) * 1991-04-25 1992-11-13 Matsushita Electric Ind Co Ltd 電子部品の実装方法
JP4045838B2 (ja) * 2002-04-12 2008-02-13 松下電器産業株式会社 部品装着管理方法
WO2004017704A1 (ja) * 2002-08-06 2004-02-26 Matsushita Electric Industrial Co., Ltd. 部品実装方法、及び部品実装装置
JP2006349441A (ja) * 2005-06-15 2006-12-28 Dainippon Printing Co Ltd ワークの検査方法、およびワークの検査装置
US20090000110A1 (en) * 2006-02-27 2009-01-01 Yasuhiro Maenishi Mounting Method and Component Mounter
JP2009198397A (ja) * 2008-02-22 2009-09-03 Nagoya Electric Works Co Ltd 基板検査装置および基板検査方法
US20100155106A1 (en) * 2008-12-22 2010-06-24 Sun Microsystems, Inc. Method and apparatus for optical differentiation to detect missing components on a circuit board
JP5201115B2 (ja) * 2009-10-08 2013-06-05 パナソニック株式会社 部品実装システム
JP5877639B2 (ja) * 2010-12-27 2016-03-08 富士機械製造株式会社 画像生成装置および画像生成方法
CN103597920B (zh) * 2011-05-31 2016-06-29 富士机械制造株式会社 对基板作业支援装置及对基板作业支援方法
JP2014007213A (ja) * 2012-06-22 2014-01-16 Panasonic Corp 部品実装装置及び部品実装方法
CN103528523A (zh) * 2013-11-06 2014-01-22 湖北工业大学 一种基于三维立体建模的螺纹检测方法及系统
WO2016110941A1 (ja) * 2015-01-06 2016-07-14 富士機械製造株式会社 実装関連処理装置、画像処理方法及びそのプログラム
JP6550589B2 (ja) * 2015-02-24 2019-07-31 パナソニックＩｐマネジメント株式会社 部品実装方法
US10820459B2 (en) 2015-08-25 2020-10-27 Fuji Corporation Component mounting line
WO2017216950A1 (ja) * 2016-06-17 2017-12-21 富士機械製造株式会社 部品実装装置及び部品実装システム
JP6837138B2 (ja) * 2017-05-01 2021-03-03 株式会社Ｆｕｊｉ 実装装置、情報処理装置、実装システム、実装方法及び情報処理方法
JP7084416B2 (ja) * 2017-12-15 2022-06-14 株式会社Fuji 情報処理装置及び情報処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000013097A (ja) * 1998-06-18 2000-01-14 Juki Corp 部品搭載装置
JP2007158052A (ja) * 2005-12-06 2007-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置及び実装エラー修復方法
JP2007214212A (ja) * 2006-02-07 2007-08-23 Matsushita Electric Ind Co Ltd 実装状態判定方法、実装状態判定プログラム、実装状態判定装置、実装方法
WO2015040667A1 (ja) * 2013-09-17 2015-03-26 富士機械製造株式会社 実装検査装置
WO2017141377A1 (ja) * 2016-02-17 2017-08-24 富士機械製造株式会社 作業装置および生産ライン

Also Published As

Publication number Publication date
CN114041332A (zh) 2022-02-11
EP4002977A1 (en) 2022-05-25
US20220322595A1 (en) 2022-10-06
WO2021014505A1 (ja) 2021-01-28
EP4002977A4 (en) 2022-08-03
EP4002977B1 (en) 2024-09-04
JP7197705B2 (ja) 2022-12-27
US12262476B2 (en) 2025-03-25
CN114041332B (zh) 2024-01-30

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