JPWO2020235597A1 - - Google Patents
Info
- Publication number
- JPWO2020235597A1 JPWO2020235597A1 JP2021520818A JP2021520818A JPWO2020235597A1 JP WO2020235597 A1 JPWO2020235597 A1 JP WO2020235597A1 JP 2021520818 A JP2021520818 A JP 2021520818A JP 2021520818 A JP2021520818 A JP 2021520818A JP WO2020235597 A1 JPWO2020235597 A1 JP WO2020235597A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/019—Manufacture or treatment using temporary auxiliary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6528—In-situ cleaning after layer formation, e.g. removing process residues
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6536—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/014—Manufacture or treatment using batch processing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
- H10P72/7442—Separation by peeling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laminated Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Recrystallisation Techniques (AREA)
- Adhesive Tapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024201669A JP2025032136A (ja) | 2019-05-22 | 2024-11-19 | 半導体装置を製造する方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019096008 | 2019-05-22 | ||
| JP2019096008 | 2019-05-22 | ||
| PCT/JP2020/019963 WO2020235597A1 (ja) | 2019-05-22 | 2020-05-20 | 半導体装置を製造する方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024201669A Division JP2025032136A (ja) | 2019-05-22 | 2024-11-19 | 半導体装置を製造する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020235597A1 true JPWO2020235597A1 (https=) | 2020-11-26 |
| JP7597025B2 JP7597025B2 (ja) | 2024-12-10 |
Family
ID=73458417
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021520818A Active JP7597025B2 (ja) | 2019-05-22 | 2020-05-20 | 半導体装置を製造する方法 |
| JP2024201669A Pending JP2025032136A (ja) | 2019-05-22 | 2024-11-19 | 半導体装置を製造する方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024201669A Pending JP2025032136A (ja) | 2019-05-22 | 2024-11-19 | 半導体装置を製造する方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US12165882B2 (https=) |
| EP (1) | EP3974491A4 (https=) |
| JP (2) | JP7597025B2 (https=) |
| KR (1) | KR102864887B1 (https=) |
| CN (2) | CN113840891B (https=) |
| TW (2) | TWI836077B (https=) |
| WO (1) | WO2020235597A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019106846A1 (ja) * | 2017-12-01 | 2019-06-06 | 日立化成株式会社 | 半導体装置の製造方法、仮固定材用樹脂組成物、及び仮固定材用積層フィルム |
| US11996384B2 (en) | 2020-12-15 | 2024-05-28 | Pulseforge, Inc. | Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications |
| DE102022114911A1 (de) * | 2022-06-14 | 2023-12-14 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Verfahren zum Herstellen von elektronischen Baugruppen und elektronische Baugruppe auf Wafer-Ebene |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013171949A (ja) * | 2012-02-20 | 2013-09-02 | Tokyo Ohka Kogyo Co Ltd | 支持体分離方法及び支持体分離装置 |
| JP2013534721A (ja) * | 2010-06-16 | 2013-09-05 | スリーエム イノベイティブ プロパティズ カンパニー | ウェーハ支持システム用の変換層を加熱するために光学的調整を施した金属化光 |
| JP2016048729A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社東芝 | 仮接着用支持基板及び半導体デバイスの製造方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6525493B2 (en) * | 1998-08-26 | 2003-02-25 | Q-Panel Lab Products | Materials test chamber with xenon lamp radiation |
| JP2000260710A (ja) * | 1999-03-11 | 2000-09-22 | Seiko Epson Corp | 半導体装置の製造方法及びアニール装置 |
| US7094451B2 (en) * | 1999-04-07 | 2006-08-22 | Board Of Trustees Of Michigan State University | Chemical functionalization of material surfaces using optical energy and chemicals |
| JP2003224117A (ja) * | 2002-01-31 | 2003-08-08 | Advanced Lcd Technologies Development Center Co Ltd | 絶縁膜の製造装置 |
| DE102004030268B4 (de) * | 2003-06-24 | 2013-02-21 | Fuji Electric Co., Ltd | Verfahren zum Herstellen eines Halbleiterelements |
| US8486742B2 (en) * | 2006-11-21 | 2013-07-16 | Epistar Corporation | Method for manufacturing high efficiency light-emitting diodes |
| JP5257314B2 (ja) * | 2009-09-29 | 2013-08-07 | 大日本印刷株式会社 | 積層体、準備用支持体、積層体の製造方法、及びデバイスの製造方法 |
| WO2011071889A1 (en) * | 2009-12-07 | 2011-06-16 | J.P. Sercel Associates, Inc. | Laser lift off systems and methods |
| JP4948629B2 (ja) * | 2010-07-20 | 2012-06-06 | ウシオ電機株式会社 | レーザリフトオフ方法 |
| JP2012069919A (ja) | 2010-08-25 | 2012-04-05 | Toshiba Corp | 半導体装置の製造方法 |
| JP2012069734A (ja) * | 2010-09-24 | 2012-04-05 | Toshiba Corp | 半導体装置の製造方法 |
| JP5789974B2 (ja) | 2010-12-14 | 2015-10-07 | 住友ベークライト株式会社 | 仮固定剤および基材の加工方法 |
| JP5861304B2 (ja) | 2011-08-01 | 2016-02-16 | Jsr株式会社 | 基材の処理方法、半導体装置および仮固定用組成物 |
| JP2013145808A (ja) * | 2012-01-13 | 2013-07-25 | Sharp Corp | 剥離方法、液晶ディスプレイの製造方法、有機ｅｌディスプレイの製造方法、およびタッチパネルの製造方法 |
| US20140231012A1 (en) * | 2013-02-15 | 2014-08-21 | Dainippon Screen Mfg, Co., Ltd. | Substrate processing apparatus |
| JP6243616B2 (ja) * | 2013-03-26 | 2017-12-06 | キヤノン株式会社 | 露光装置および物品の製造方法 |
| JP6050170B2 (ja) | 2013-03-27 | 2016-12-21 | 富士フイルム株式会社 | 半導体装置製造用仮接合用積層体、および、半導体装置の製造方法 |
| CN106463473A (zh) * | 2014-06-26 | 2017-02-22 | 凸版印刷株式会社 | 配线基板、半导体装置以及半导体装置的制造方法 |
| JP6437805B2 (ja) * | 2014-12-03 | 2018-12-12 | 東京応化工業株式会社 | 積層体の製造方法、封止基板積層体の製造方法及び積層体 |
| JP6404723B2 (ja) | 2015-01-27 | 2018-10-17 | デンカ株式会社 | 仮固定用接着剤組成物、それを用いた部材の仮固定方法及び硬化体残渣の除去方法 |
| JP6718736B2 (ja) * | 2015-05-22 | 2020-07-08 | 株式会社Ｓｃｒｅｅｎホールディングス | 耐熱性有機高分子層の剥離方法およびフレキシブル配線板の製造方法 |
| JP6517643B2 (ja) * | 2015-09-16 | 2019-05-22 | 株式会社ジャパンディスプレイ | 表示装置の製造方法、および、表示装置 |
| JP6524972B2 (ja) * | 2015-09-28 | 2019-06-05 | Jsr株式会社 | 対象物の処理方法、仮固定用組成物、半導体装置及びその製造方法 |
| JP6463664B2 (ja) * | 2015-11-27 | 2019-02-06 | 信越化学工業株式会社 | ウエハ加工体及びウエハ加工方法 |
| JP6649111B2 (ja) * | 2016-02-16 | 2020-02-19 | 東京応化工業株式会社 | 積層体、積層体の製造方法、及び基板の処理方法 |
| PL3469635T3 (pl) * | 2017-01-26 | 2021-04-19 | Gross, Leander Kilian | Sposób i urządzenie do rozdzielania różnych warstw materiału kompozytowego elementu konstrukcyjnego |
| US10516001B2 (en) * | 2017-10-26 | 2019-12-24 | Sakai Display Products Corporation | Method and apparatus for producing flexible OLED device |
| WO2019106846A1 (ja) * | 2017-12-01 | 2019-06-06 | 日立化成株式会社 | 半導体装置の製造方法、仮固定材用樹脂組成物、及び仮固定材用積層フィルム |
| US10505079B2 (en) * | 2018-05-09 | 2019-12-10 | X-Celeprint Limited | Flexible devices and methods using laser lift-off |
-
2020
- 2020-05-20 CN CN202080036919.XA patent/CN113840891B/zh active Active
- 2020-05-20 US US17/612,224 patent/US12165882B2/en active Active
- 2020-05-20 WO PCT/JP2020/019963 patent/WO2020235597A1/ja not_active Ceased
- 2020-05-20 CN CN202311062179.9A patent/CN117096040A/zh active Pending
- 2020-05-20 JP JP2021520818A patent/JP7597025B2/ja active Active
- 2020-05-20 TW TW109116747A patent/TWI836077B/zh active
- 2020-05-20 TW TW113105693A patent/TWI879437B/zh active
- 2020-05-20 KR KR1020217041060A patent/KR102864887B1/ko active Active
- 2020-05-20 EP EP20810743.3A patent/EP3974491A4/en active Pending
-
2024
- 2024-09-30 US US18/900,891 patent/US20250046626A1/en active Pending
- 2024-11-19 JP JP2024201669A patent/JP2025032136A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013534721A (ja) * | 2010-06-16 | 2013-09-05 | スリーエム イノベイティブ プロパティズ カンパニー | ウェーハ支持システム用の変換層を加熱するために光学的調整を施した金属化光 |
| JP2013171949A (ja) * | 2012-02-20 | 2013-09-02 | Tokyo Ohka Kogyo Co Ltd | 支持体分離方法及び支持体分離装置 |
| JP2016048729A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社東芝 | 仮接着用支持基板及び半導体デバイスの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202422724A (zh) | 2024-06-01 |
| EP3974491A1 (en) | 2022-03-30 |
| US12165882B2 (en) | 2024-12-10 |
| US20250046626A1 (en) | 2025-02-06 |
| EP3974491A4 (en) | 2022-07-27 |
| US20220319872A1 (en) | 2022-10-06 |
| KR20220012877A (ko) | 2022-02-04 |
| JP7597025B2 (ja) | 2024-12-10 |
| CN117096040A (zh) | 2023-11-21 |
| JP2025032136A (ja) | 2025-03-11 |
| CN113840891A (zh) | 2021-12-24 |
| TWI836077B (zh) | 2024-03-21 |
| TW202046421A (zh) | 2020-12-16 |
| TWI879437B (zh) | 2025-04-01 |
| WO2020235597A1 (ja) | 2020-11-26 |
| KR102864887B1 (ko) | 2025-09-25 |
| CN113840891B (zh) | 2023-08-29 |
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