JPWO2020196669A1 - - Google Patents

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Publication number
JPWO2020196669A1
JPWO2020196669A1 JP2021509541A JP2021509541A JPWO2020196669A1 JP WO2020196669 A1 JPWO2020196669 A1 JP WO2020196669A1 JP 2021509541 A JP2021509541 A JP 2021509541A JP 2021509541 A JP2021509541 A JP 2021509541A JP WO2020196669 A1 JPWO2020196669 A1 JP WO2020196669A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021509541A
Other versions
JPWO2020196669A5 (ja
JP7269323B2 (ja
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Publication date
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Publication of JPWO2020196669A1 publication Critical patent/JPWO2020196669A1/ja
Priority to JP2022177195A priority Critical patent/JP2023012530A/ja
Publication of JPWO2020196669A5 publication Critical patent/JPWO2020196669A5/ja
Application granted granted Critical
Publication of JP7269323B2 publication Critical patent/JP7269323B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/22—Esters containing halogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C09J133/16—Homopolymers or copolymers of esters containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021509541A 2019-03-27 2020-03-25 組成物 Active JP7269323B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022177195A JP2023012530A (ja) 2019-03-27 2022-11-04 組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019060958 2019-03-27
JP2019060958 2019-03-27
PCT/JP2020/013459 WO2020196669A1 (ja) 2019-03-27 2020-03-25 組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022177195A Division JP2023012530A (ja) 2019-03-27 2022-11-04 組成物

Publications (3)

Publication Number Publication Date
JPWO2020196669A1 true JPWO2020196669A1 (ja) 2020-10-01
JPWO2020196669A5 JPWO2020196669A5 (ja) 2022-11-14
JP7269323B2 JP7269323B2 (ja) 2023-05-08

Family

ID=72612008

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021509541A Active JP7269323B2 (ja) 2019-03-27 2020-03-25 組成物
JP2022177195A Pending JP2023012530A (ja) 2019-03-27 2022-11-04 組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022177195A Pending JP2023012530A (ja) 2019-03-27 2022-11-04 組成物

Country Status (5)

Country Link
JP (2) JP7269323B2 (ja)
KR (1) KR20210148073A (ja)
CN (2) CN113227159B (ja)
TW (1) TWI828891B (ja)
WO (1) WO2020196669A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7440498B2 (ja) 2019-04-23 2024-02-28 デンカ株式会社 組成物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006236987A (ja) * 2005-01-26 2006-09-07 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
JP2009079230A (ja) * 2005-01-26 2009-04-16 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置
WO2014017524A1 (ja) * 2012-07-26 2014-01-30 電気化学工業株式会社 樹脂組成物
WO2015111635A1 (ja) * 2014-01-23 2015-07-30 電気化学工業株式会社 樹脂組成物
WO2015111525A1 (ja) * 2014-01-23 2015-07-30 株式会社ダイセル 封止用組成物
WO2019039587A1 (ja) * 2017-08-24 2019-02-28 デンカ株式会社 有機エレクトロルミネッセンス素子用封止剤

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204676A (ja) * 1983-05-09 1984-11-20 Mitsubishi Rayon Co Ltd 高屈折率感光性接着剤
JPH08109231A (ja) * 1994-10-13 1996-04-30 Nippon Kayaku Co Ltd モータ類回転子のバランス用活性エネルギー線硬化性樹脂組成物及びそれらを用いてバランス修正された回転子
JPH09110909A (ja) * 1995-10-23 1997-04-28 Dainippon Printing Co Ltd 高分子微粒子の製造方法
JPH1074583A (ja) 1996-08-30 1998-03-17 Sanyo Electric Co Ltd 有機ｅｌディスプレイ及び有機ｅｌディスプレイの 製造方法
JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
JP5570275B2 (ja) * 2010-03-31 2014-08-13 旭化成イーマテリアルズ株式会社 ドライフィルムレジストロール
JP5840574B2 (ja) * 2012-07-11 2016-01-06 富士フイルム株式会社 二酸化炭素分離用複合体の製造方法、二酸化炭素分離用複合体、及び二酸化炭素分離用モジュール
JP6439684B2 (ja) * 2013-04-23 2018-12-19 三菱瓦斯化学株式会社 ポリアミド樹脂組成物、及び成形体
JP2015042487A (ja) 2013-07-25 2015-03-05 東洋紡株式会社 透明バリアフィルム
US10173179B2 (en) * 2014-12-15 2019-01-08 Toray Industries, Inc. Polymer-ion-permeable membrane, composite-ion-permeable membrane, battery electrolyte membrane, and electrode composite
JP2019162565A (ja) * 2016-07-25 2019-09-26 富士フイルム株式会社 ガス分離膜、ガス分離膜モジュールおよびガス分離装置
CN110461891B (zh) * 2017-03-30 2022-08-30 日铁化学材料株式会社 可溶性多官能乙烯基芳香族共聚合物、其制造方法以及硬化性树脂组合物及其应用
CN112204438B (zh) * 2018-06-01 2022-08-09 住友化学株式会社 偏光膜及其制造方法、偏光板以及显示装置
WO2020149384A1 (ja) * 2019-01-17 2020-07-23 デンカ株式会社 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006236987A (ja) * 2005-01-26 2006-09-07 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
JP2009079230A (ja) * 2005-01-26 2009-04-16 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置
WO2014017524A1 (ja) * 2012-07-26 2014-01-30 電気化学工業株式会社 樹脂組成物
WO2015111635A1 (ja) * 2014-01-23 2015-07-30 電気化学工業株式会社 樹脂組成物
WO2015111525A1 (ja) * 2014-01-23 2015-07-30 株式会社ダイセル 封止用組成物
WO2019039587A1 (ja) * 2017-08-24 2019-02-28 デンカ株式会社 有機エレクトロルミネッセンス素子用封止剤

Also Published As

Publication number Publication date
WO2020196669A1 (ja) 2020-10-01
CN117510794A (zh) 2024-02-06
CN113227159A (zh) 2021-08-06
CN113227159B (zh) 2024-04-19
KR20210148073A (ko) 2021-12-07
TWI828891B (zh) 2024-01-11
TW202102601A (zh) 2021-01-16
JP7269323B2 (ja) 2023-05-08
JP2023012530A (ja) 2023-01-25

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