JPWO2020176583A5 - - Google Patents
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- Publication number
- JPWO2020176583A5 JPWO2020176583A5 JP2021549601A JP2021549601A JPWO2020176583A5 JP WO2020176583 A5 JPWO2020176583 A5 JP WO2020176583A5 JP 2021549601 A JP2021549601 A JP 2021549601A JP 2021549601 A JP2021549601 A JP 2021549601A JP WO2020176583 A5 JPWO2020176583 A5 JP WO2020176583A5
- Authority
- JP
- Japan
- Prior art keywords
- solder alloy
- balance
- weight percent
- solder
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962810619P | 2019-02-26 | 2019-02-26 | |
| US62/810,619 | 2019-02-26 | ||
| PCT/US2020/019831 WO2020176583A1 (en) | 2019-02-26 | 2020-02-26 | High reliability leadfree solder alloys for harsh service conditions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022523203A JP2022523203A (ja) | 2022-04-21 |
| JPWO2020176583A5 true JPWO2020176583A5 (zh) | 2023-03-03 |
Family
ID=70190079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021549601A Pending JP2022523203A (ja) | 2019-02-26 | 2020-02-26 | 過酷な使用条件のための高信頼性無鉛はんだ合金 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11752579B2 (zh) |
| EP (1) | EP3931364A1 (zh) |
| JP (1) | JP2022523203A (zh) |
| KR (1) | KR20210138614A (zh) |
| CN (1) | CN113474474A (zh) |
| WO (1) | WO2020176583A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI814081B (zh) * | 2019-09-02 | 2023-09-01 | 美商阿爾發金屬化工公司 | 高溫超高可靠性合金、其製造方法及其應用 |
| KR20240019350A (ko) * | 2021-06-11 | 2024-02-14 | 인듐 코포레이션 | 혼합 땜납 합금 분말을 갖는 고 신뢰성 무연 땜납 페이스트 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9260768B2 (en) | 2005-12-13 | 2016-02-16 | Indium Corporation | Lead-free solder alloys and solder joints thereof with improved drop impact resistance |
| JP2015077601A (ja) | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| CN108311812A (zh) | 2014-04-02 | 2018-07-24 | 千住金属工业株式会社 | 软钎料合金和使用其的方法 |
| US20160279741A1 (en) * | 2015-03-24 | 2016-09-29 | Tamura Corporation | Lead-free solder alloy, electronic circuit board, and electronic control device |
| CN107635716B (zh) | 2015-05-05 | 2021-05-25 | 铟泰公司 | 用于严苛环境电子器件应用的高可靠性无铅焊料合金 |
| US11229979B2 (en) | 2015-05-05 | 2022-01-25 | Indium Corporation | High reliability lead-free solder alloys for harsh environment electronics applications |
| JP6230674B2 (ja) | 2016-09-20 | 2017-11-15 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| JP6745453B2 (ja) * | 2016-05-18 | 2020-08-26 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
-
2020
- 2020-02-26 US US16/801,556 patent/US11752579B2/en active Active
- 2020-02-26 KR KR1020217030585A patent/KR20210138614A/ko unknown
- 2020-02-26 WO PCT/US2020/019831 patent/WO2020176583A1/en unknown
- 2020-02-26 CN CN202080016268.8A patent/CN113474474A/zh active Pending
- 2020-02-26 EP EP20717352.7A patent/EP3931364A1/en active Pending
- 2020-02-26 JP JP2021549601A patent/JP2022523203A/ja active Pending
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