JPWO2020175537A1 - - Google Patents

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Publication number
JPWO2020175537A1
JPWO2020175537A1 JP2021502311A JP2021502311A JPWO2020175537A1 JP WO2020175537 A1 JPWO2020175537 A1 JP WO2020175537A1 JP 2021502311 A JP2021502311 A JP 2021502311A JP 2021502311 A JP2021502311 A JP 2021502311A JP WO2020175537 A1 JPWO2020175537 A1 JP WO2020175537A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021502311A
Other languages
Japanese (ja)
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JP7409369B2 (ja
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Publication of JPWO2020175537A1 publication Critical patent/JPWO2020175537A1/ja
Application granted granted Critical
Publication of JP7409369B2 publication Critical patent/JP7409369B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2021502311A 2019-02-28 2020-02-26 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 Active JP7409369B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019035456 2019-02-28
JP2019035456 2019-02-28
PCT/JP2020/007686 WO2020175537A1 (ja) 2019-02-28 2020-02-26 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板

Publications (2)

Publication Number Publication Date
JPWO2020175537A1 true JPWO2020175537A1 (zh) 2020-09-03
JP7409369B2 JP7409369B2 (ja) 2024-01-09

Family

ID=72240041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021502311A Active JP7409369B2 (ja) 2019-02-28 2020-02-26 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板

Country Status (5)

Country Link
JP (1) JP7409369B2 (zh)
KR (1) KR20210133230A (zh)
CN (1) CN113490715A (zh)
TW (1) TW202039595A (zh)
WO (1) WO2020175537A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7190649B2 (ja) * 2018-04-27 2022-12-16 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
JP2022150088A (ja) 2021-03-26 2022-10-07 日鉄ケミカル＆マテリアル株式会社 ポリイミド、樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
KR20240019380A (ko) 2021-08-25 2024-02-14 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 시트, 및 프린트 배선판
KR20240065289A (ko) 2021-09-27 2024-05-14 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 프린트 배선판, 및 반도체 장치
KR20240065287A (ko) 2021-09-27 2024-05-14 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 프린트 배선판, 및 반도체 장치
WO2023047783A1 (ja) * 2021-09-27 2023-03-30 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2023047782A1 (ja) * 2021-09-27 2023-03-30 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2023048025A1 (ja) 2021-09-27 2023-03-30 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
TW202348646A (zh) * 2022-03-11 2023-12-16 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0413756A (ja) * 1990-05-08 1992-01-17 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物
JPH0415215A (ja) * 1990-05-08 1992-01-20 Sumitomo Bakelite Co Ltd 積層板用熱硬化性樹脂組成物
JPH0413751A (ja) * 1990-05-08 1992-01-17 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物
JP2002114823A (ja) 2000-10-10 2002-04-16 Mitsubishi Gas Chem Co Inc 高周波用難燃性シアネート樹脂
JP5233710B2 (ja) 2008-02-12 2013-07-10 三菱瓦斯化学株式会社 樹脂組成物、プリプレグおよび金属箔張り積層板
JP4613977B2 (ja) * 2008-04-28 2011-01-19 日立化成工業株式会社 薄層石英ガラスクロスを含むプリプレグ、およびそれを用いた配線板
JP5880450B2 (ja) * 2011-01-31 2016-03-09 住友ベークライト株式会社 樹脂組成物および半導体装置
TWI589628B (zh) * 2015-12-09 2017-07-01 中山台光電子材料有限公司 樹脂組合物
JP6833723B2 (ja) 2015-12-28 2021-02-24 日鉄ケミカル＆マテリアル株式会社 可溶性多官能ビニル芳香族共重合体、その製造方法及び硬化性組成物
KR102537249B1 (ko) 2017-03-30 2023-05-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 가용성 다관능 비닐 방향족 공중합체, 그 제조 방법, 경화성 수지 조성물 및 그 경화물
WO2018216647A1 (ja) * 2017-05-26 2018-11-29 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、レジンシート、金属箔張積層板及びプリント配線板、並びに樹脂組成物の製造方法
JP2020029504A (ja) 2018-08-22 2020-02-27 日立化成株式会社 硬化性組成物

Also Published As

Publication number Publication date
WO2020175537A1 (ja) 2020-09-03
TW202039595A (zh) 2020-11-01
KR20210133230A (ko) 2021-11-05
CN113490715A (zh) 2021-10-08
JP7409369B2 (ja) 2024-01-09

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