JPWO2020170977A5 - - Google Patents
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- Publication number
- JPWO2020170977A5 JPWO2020170977A5 JP2021501945A JP2021501945A JPWO2020170977A5 JP WO2020170977 A5 JPWO2020170977 A5 JP WO2020170977A5 JP 2021501945 A JP2021501945 A JP 2021501945A JP 2021501945 A JP2021501945 A JP 2021501945A JP WO2020170977 A5 JPWO2020170977 A5 JP WO2020170977A5
- Authority
- JP
- Japan
- Prior art keywords
- dimensional material
- laminate
- adhesive
- heat
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 17
- 239000000853 adhesive Substances 0.000 claims 13
- 230000001070 adhesive effect Effects 0.000 claims 13
- 239000012790 adhesive layer Substances 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 239000003575 carbonaceous material Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- 229910052582 BN Inorganic materials 0.000 claims 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 2
- 229910021389 graphene Inorganic materials 0.000 claims 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims 2
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims 2
- 230000003746 surface roughness Effects 0.000 claims 2
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019027773 | 2019-02-19 | ||
| JP2019027773 | 2019-02-19 | ||
| PCT/JP2020/005841 WO2020170977A1 (ja) | 2019-02-19 | 2020-02-14 | 二次元材料積層体の製造方法及び積層体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020170977A1 JPWO2020170977A1 (https=) | 2020-08-27 |
| JPWO2020170977A5 true JPWO2020170977A5 (https=) | 2023-02-14 |
| JP7558517B2 JP7558517B2 (ja) | 2024-10-01 |
Family
ID=72143659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021501945A Active JP7558517B2 (ja) | 2019-02-19 | 2020-02-14 | 二次元材料積層体の製造方法及び積層体 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12263662B2 (https=) |
| EP (1) | EP3928977B1 (https=) |
| JP (1) | JP7558517B2 (https=) |
| KR (1) | KR102815609B1 (https=) |
| CN (1) | CN113453884A (https=) |
| ES (1) | ES3039924T3 (https=) |
| TW (1) | TWI868110B (https=) |
| WO (1) | WO2020170977A1 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3928977B1 (en) * | 2019-02-19 | 2025-08-27 | Nitto Denko Corporation | Method for manufacturing laminate of two-dimensional material, and laminate |
| US12221695B2 (en) | 2021-05-18 | 2025-02-11 | Mellanox Technologies, Ltd. | CVD system with flange assembly for facilitating uniform and laminar flow |
| US11963309B2 (en) | 2021-05-18 | 2024-04-16 | Mellanox Technologies, Ltd. | Process for laminating conductive-lubricant coated metals for printed circuit boards |
| US12289839B2 (en) | 2021-05-18 | 2025-04-29 | Mellanox Technologies, Ltd. | Process for localized repair of graphene-coated lamination stacks and printed circuit boards |
| US12163228B2 (en) | 2021-05-18 | 2024-12-10 | Mellanox Technologies, Ltd. | CVD system with substrate carrier and associated mechanisms for moving substrate therethrough |
| US12004308B2 (en) * | 2021-05-18 | 2024-06-04 | Mellanox Technologies, Ltd. | Process for laminating graphene-coated printed circuit boards |
| CN113352729A (zh) * | 2021-06-21 | 2021-09-07 | 苏州鸿凌达电子科技有限公司 | 一种基于六方氮化硼复合导热膜的加工方法 |
| KR102668464B1 (ko) * | 2021-11-15 | 2024-05-24 | 한국에너지기술연구원 | 2차원 tmd 물질로 접촉 특성이 개선된 투명 전극, 이를 적용한 전자 소자 및 투명 전극의 형성방법 |
| CN114478022B (zh) * | 2021-12-31 | 2023-01-03 | 南通威斯派尔半导体技术有限公司 | 一种高可靠性氮化铝覆铜陶瓷基板及其制备方法 |
| EP4609448A1 (en) * | 2022-10-28 | 2025-09-03 | Elevated Materials Germany GmbH | Release layer for alkali metal on plastic substrates |
| US20240397636A1 (en) * | 2023-05-22 | 2024-11-28 | Nvidia Corporation | Method for integrating a copper-graphene laminate (cgl) in a multilayer pcb fabrication process |
| US20250037979A1 (en) * | 2023-07-28 | 2025-01-30 | Applied Materials, Inc. | Resilient release layer for lithium film transfer and atmospheric plasma assisted removal of residual release layer |
| WO2026004596A1 (ja) * | 2024-06-25 | 2026-01-02 | 太陽ホールディングス株式会社 | 第１積層構造体、第２積層構造体、及びプリント配線板の製造方法 |
| US20260061734A1 (en) * | 2024-09-03 | 2026-03-05 | Elevated Materials Us Llc | Metal or alloy film release by low sublimation release layer for electrochemical device |
| CN120155357B (zh) * | 2025-05-12 | 2025-07-25 | 深圳市哈德胜精密科技股份有限公司 | 一种基于转印技术的图形胶水显色定位方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| YU218175A (en) | 1974-09-12 | 1984-04-30 | Schwartzhaupt Kg | Process for total or individual determination of lactate dehydrogenase isoenzyme |
| CN101031625A (zh) | 2004-10-01 | 2007-09-05 | 东洋油墨制造株式会社 | 活性能量射线粘合力消失型压敏粘合剂、涂布其的活性能量射线粘合力消失型粘合片和蚀刻化金属体的制造方法 |
| JP5283838B2 (ja) * | 2006-11-04 | 2013-09-04 | 日東電工株式会社 | 熱剥離性粘着シート及び被着体回収方法 |
| US8389629B2 (en) | 2007-10-16 | 2013-03-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part |
| JP5727688B2 (ja) | 2008-03-31 | 2015-06-03 | リンテック株式会社 | エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 |
| JP5850720B2 (ja) | 2011-06-02 | 2016-02-03 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔、及びグラフェンの製造方法 |
| CN103596879B (zh) | 2011-06-02 | 2018-06-12 | Jx日矿日石金属株式会社 | 石墨烯制造用铜箔以及石墨烯的制造方法 |
| WO2013186858A1 (ja) * | 2012-06-12 | 2013-12-19 | グラフェンプラットフォーム株式会社 | グラフェン積層体およびグラフェン積層体の製造方法 |
| JP2014172989A (ja) | 2013-03-08 | 2014-09-22 | Nitto Denko Corp | 脆弱部材仮固定用粘着部材 |
| WO2015021479A1 (en) | 2013-08-09 | 2015-02-12 | The Trustees Of Columbia University In The City Of New York | Systems and methods for assembling two-dimensional materials |
| JP2015076276A (ja) | 2013-10-09 | 2015-04-20 | 日東電工株式会社 | 電解質膜搬送用粘着シートおよび該粘着シートを用いた燃料電池用膜／電極複合体の製造方法 |
| JP2015097195A (ja) | 2013-10-09 | 2015-05-21 | 日東電工株式会社 | 燃料電池用膜／電極複合体の製造方法 |
| JP6844443B2 (ja) | 2017-06-23 | 2021-03-17 | 信越化学工業株式会社 | フォトリソグラフィ用ペリクル膜、ペリクル及びフォトマスク、露光方法並びに半導体デバイス又は液晶ディスプレイの製造方法 |
| JP2019027773A (ja) | 2017-07-31 | 2019-02-21 | ダイキン工業株式会社 | 空気調和システム |
| EP3928977B1 (en) * | 2019-02-19 | 2025-08-27 | Nitto Denko Corporation | Method for manufacturing laminate of two-dimensional material, and laminate |
-
2020
- 2020-02-14 EP EP20759093.6A patent/EP3928977B1/en active Active
- 2020-02-14 JP JP2021501945A patent/JP7558517B2/ja active Active
- 2020-02-14 KR KR1020217026176A patent/KR102815609B1/ko active Active
- 2020-02-14 CN CN202080015162.6A patent/CN113453884A/zh active Pending
- 2020-02-14 US US17/432,345 patent/US12263662B2/en active Active
- 2020-02-14 ES ES20759093T patent/ES3039924T3/es active Active
- 2020-02-14 WO PCT/JP2020/005841 patent/WO2020170977A1/ja not_active Ceased
- 2020-02-18 TW TW109105124A patent/TWI868110B/zh active
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