JPWO2020166141A1 - - Google Patents
Info
- Publication number
- JPWO2020166141A1 JPWO2020166141A1 JP2020572081A JP2020572081A JPWO2020166141A1 JP WO2020166141 A1 JPWO2020166141 A1 JP WO2020166141A1 JP 2020572081 A JP2020572081 A JP 2020572081A JP 2020572081 A JP2020572081 A JP 2020572081A JP WO2020166141 A1 JPWO2020166141 A1 JP WO2020166141A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1659—Cell access
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1673—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/18—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using Hall-effect devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
- H01F10/30—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the intermediate layers, e.g. seed, buffer, template, diffusion preventing, cap layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/329—Spin-exchange coupled multilayers wherein the magnetisation of the free layer is switched by a spin-polarised current, e.g. spin torque effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/40—Devices controlled by magnetic fields
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Materials of the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3286—Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019024012 | 2019-02-13 | ||
| JP2019024012 | 2019-02-13 | ||
| PCT/JP2019/042667 WO2020166141A1 (ja) | 2019-02-13 | 2019-10-30 | 磁性積層膜、磁気メモリ素子及び磁気メモリ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020166141A1 true JPWO2020166141A1 (https=) | 2020-08-20 |
| JPWO2020166141A5 JPWO2020166141A5 (https=) | 2022-11-08 |
| JP7475057B2 JP7475057B2 (ja) | 2024-04-26 |
Family
ID=72044082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020572081A Active JP7475057B2 (ja) | 2019-02-13 | 2019-10-30 | 磁性積層膜、磁気メモリ素子及び磁気メモリ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11532667B2 (https=) |
| JP (1) | JP7475057B2 (https=) |
| KR (1) | KR102705726B1 (https=) |
| WO (1) | WO2020166141A1 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112582531A (zh) * | 2019-09-30 | 2021-03-30 | 华为技术有限公司 | 一种磁性存储器及其制备方法 |
| CN114641868B (zh) * | 2019-10-31 | 2026-03-17 | 国立大学法人东北大学 | 隧道结层叠膜、磁存储元件和磁存储器 |
| TWI770950B (zh) | 2020-04-28 | 2022-07-11 | 台灣積體電路製造股份有限公司 | 記憶體單元、記憶體系統與記憶體單元的操作方法 |
| JP7644464B2 (ja) * | 2020-07-15 | 2025-03-12 | 国立大学法人京都大学 | 磁気メモリ素子、磁気メモリ装置、および磁気メモリ素子へデータを記憶する方法 |
| JP2023165050A (ja) * | 2020-10-02 | 2023-11-15 | Tdk株式会社 | 磁気素子及び集積装置 |
| WO2022160226A1 (zh) | 2021-01-29 | 2022-08-04 | 北京航空航天大学 | 一种存储阵列、存储器、制备方法及写入方法 |
| US11538858B2 (en) * | 2021-03-05 | 2022-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory device, method of forming the same, and memory array |
| US12185639B2 (en) * | 2021-12-23 | 2024-12-31 | Northwestern University | Antiferromagnetic memory device featuring tunneling magnetoresistance readout and current-induced writing of information |
| KR102787478B1 (ko) * | 2023-08-14 | 2025-03-26 | 성균관대학교산학협력단 | Sot 타입 자기 저항 메모리 및 그 제조 방법 |
| CN121621042A (zh) * | 2023-08-17 | 2026-03-06 | Sp-Aith有限公司 | 磁器件 |
| WO2025070485A1 (ja) * | 2023-09-26 | 2025-04-03 | 国立研究開発法人産業技術総合研究所 | 磁気素子、磁気メモリ、高周波発振器およびその製造方法 |
| JP7834255B1 (ja) * | 2025-08-22 | 2026-03-23 | Tdk株式会社 | 反強磁性結合積層体、スピン軌道トルクデバイス、乱数発生器、磁化反転素子及びスピンインダクタ |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014045196A (ja) * | 2012-08-26 | 2014-03-13 | Samsung Electronics Co Ltd | スイッチングに基づいたスピン軌道相互作用を使用する磁気トンネルリング接合と、磁気トンネルリング接合を利用するメモリを提供するための方法及びシステム |
| JP2015179773A (ja) * | 2014-03-19 | 2015-10-08 | 株式会社東芝 | 熱電変換素子 |
| US9218864B1 (en) * | 2014-10-04 | 2015-12-22 | Ge Yi | Magnetoresistive random access memory cell and 3D memory cell array |
| WO2016021468A1 (ja) * | 2014-08-08 | 2016-02-11 | 国立大学法人東北大学 | 磁気抵抗効果素子、及び磁気メモリ装置 |
| JP2017059594A (ja) * | 2015-09-14 | 2017-03-23 | 株式会社東芝 | 磁気メモリ |
| US20170178705A1 (en) * | 2014-07-17 | 2017-06-22 | Cornell University | Circuits and devices based on enhanced spin hall effect for efficient spin transfer torque |
| WO2017208576A1 (ja) * | 2016-06-03 | 2017-12-07 | 国立大学法人東北大学 | 磁性積層膜、磁気メモリ素子、磁気メモリ、及びその製造方法 |
| JP2018022796A (ja) * | 2016-08-04 | 2018-02-08 | 株式会社東芝 | 磁気メモリ |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7218484B2 (en) * | 2002-09-11 | 2007-05-15 | Kabushiki Kaisha Toshiba | Magnetoresistance effect element, magnetic head, and magnetic reproducing apparatus |
| JP4435521B2 (ja) * | 2002-09-11 | 2010-03-17 | 株式会社東芝 | 磁気抵抗効果素子の製造方法 |
| JP2014179447A (ja) | 2013-03-14 | 2014-09-25 | Toshiba Corp | 磁気記憶素子 |
| JP6270934B2 (ja) | 2015-12-14 | 2018-01-31 | 株式会社東芝 | 磁気メモリ |
| JP6948993B2 (ja) * | 2018-08-20 | 2021-10-13 | 株式会社東芝 | 磁気記憶装置 |
-
2019
- 2019-10-30 WO PCT/JP2019/042667 patent/WO2020166141A1/ja not_active Ceased
- 2019-10-30 JP JP2020572081A patent/JP7475057B2/ja active Active
- 2019-10-30 US US17/430,040 patent/US11532667B2/en active Active
- 2019-10-30 KR KR1020217028810A patent/KR102705726B1/ko active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014045196A (ja) * | 2012-08-26 | 2014-03-13 | Samsung Electronics Co Ltd | スイッチングに基づいたスピン軌道相互作用を使用する磁気トンネルリング接合と、磁気トンネルリング接合を利用するメモリを提供するための方法及びシステム |
| JP2015179773A (ja) * | 2014-03-19 | 2015-10-08 | 株式会社東芝 | 熱電変換素子 |
| US20170178705A1 (en) * | 2014-07-17 | 2017-06-22 | Cornell University | Circuits and devices based on enhanced spin hall effect for efficient spin transfer torque |
| WO2016021468A1 (ja) * | 2014-08-08 | 2016-02-11 | 国立大学法人東北大学 | 磁気抵抗効果素子、及び磁気メモリ装置 |
| US9218864B1 (en) * | 2014-10-04 | 2015-12-22 | Ge Yi | Magnetoresistive random access memory cell and 3D memory cell array |
| JP2017059594A (ja) * | 2015-09-14 | 2017-03-23 | 株式会社東芝 | 磁気メモリ |
| WO2017208576A1 (ja) * | 2016-06-03 | 2017-12-07 | 国立大学法人東北大学 | 磁性積層膜、磁気メモリ素子、磁気メモリ、及びその製造方法 |
| JP2018022796A (ja) * | 2016-08-04 | 2018-02-08 | 株式会社東芝 | 磁気メモリ |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102705726B1 (ko) | 2024-09-12 |
| KR20210127717A (ko) | 2021-10-22 |
| US11532667B2 (en) | 2022-12-20 |
| WO2020166141A1 (ja) | 2020-08-20 |
| US20220115440A1 (en) | 2022-04-14 |
| JP7475057B2 (ja) | 2024-04-26 |
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