JPWO2020137152A1 - 配線基板、電子装置および電子モジュール - Google Patents
配線基板、電子装置および電子モジュール Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
第1の実施形態における配線基板1は、図1A〜図2Cに示された例のように、絶縁基板11と、絶縁基板11に形成された凹部12と、凹部12の内面に位置する内面電極13と、絶縁基板11の厚み方向に位置するビア導体14と、絶縁基板11の表面および内部に位置する配線導体15とを含んでいる。配線基板1は、平面視にて中央部で主面に電子部品2を搭載するための搭載部11aを有している。電子装置は、配線基板1と、配線基板1の搭載部11aに搭載された電子部品2とを含んでいる。電子装置は、例えば電子モジュールを構成するモジュール用基板4上の接続パッド41に接合材を用いて接続される。
次に、第2の実施形態による配線基板1について、図3A〜図5Cを参照しつつ説明する。
次に、第3の実施形態による配線基板1について、図6A〜図8Cを参照しつつ説明する。
Claims (7)
- 平面視で方形状であり、主面側に電子部品の搭載部を含み、側面に凹部を有する絶縁基板と、
前記凹部の内面に位置する内面電極と、
平面透視で前記絶縁基板の角部側に位置し、前記絶縁基板の厚み方向に両端部が位置するビア導体と、
前記絶縁基板の主面側に前記搭載部と前記内面電極と前記ビア導体とを接続する配線導体とを有しており、
平面透視において、該配線導体が前記搭載部と前記ビア導体との間に位置する領域を取り囲んだ、前記配線導体に非位置領域があることを特徴とする配線基板。 - 平面透視において、前記配線導体は、前記ビア導体が位置した前記絶縁基板の角部側の領域に位置していることを特徴とする請求項1に記載の配線基板。
- 平面透視において、前記内面電極は、前記絶縁基板の1つの辺に沿う第1部分を有しており、
該第1部分と、前記非位置領域を前記1つの辺側に延長した仮想延長領域とが重なっていないことを特徴とする請求項1または請求項2に記載の配線基板。 - 平面透視において、前記ビア導体が前記絶縁基板の角部を成す各辺側にそれぞれ位置していることを特徴とする請求項1乃至請求項3のいずれかに記載の配線基板。
- 平面透視において、前記凹部および前記内面電極および前記ビア導体および前記配線導体および前記非位置領域における、前記搭載部の反対側に、前記凹部および前記内面電極および前記ビア導体および前記配線導体および前記非位置領域が位置していることを特徴とする請求項1乃至請求項4のいずれかに記載の配線基板。
- 請求項1乃至請求項5のいずれかに記載の配線基板と、
該配線基板に搭載された電子部品とを有することを特徴とする電子装置。 - 接続パッドを有するモジュール用基板と、
前記接続パッドにはんだを介して接続された請求項6に記載の電子装置とを有することを特徴とする電子モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018242957 | 2018-12-26 | ||
JP2018242957 | 2018-12-26 | ||
PCT/JP2019/042862 WO2020137152A1 (ja) | 2018-12-26 | 2019-10-31 | 配線基板、電子装置および電子モジュール |
Publications (2)
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JPWO2020137152A1 true JPWO2020137152A1 (ja) | 2021-10-21 |
JP7136926B2 JP7136926B2 (ja) | 2022-09-13 |
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JP2020562873A Active JP7136926B2 (ja) | 2018-12-26 | 2019-10-31 | 配線基板、電子装置および電子モジュール |
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US (1) | US11742278B2 (ja) |
EP (1) | EP3905314A4 (ja) |
JP (1) | JP7136926B2 (ja) |
CN (1) | CN113228258A (ja) |
WO (1) | WO2020137152A1 (ja) |
Families Citing this family (1)
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FR3136888A1 (fr) * | 2022-06-16 | 2023-12-22 | Stmicroelectronics (Grenoble 2) Sas | Boîtiers de circuit intégré |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005191097A (ja) * | 2003-12-24 | 2005-07-14 | Kawaguchiko Seimitsu Co Ltd | 半導体パッケージ |
JP2018073905A (ja) * | 2016-10-26 | 2018-05-10 | 京セラ株式会社 | 電子部品搭載用基板、電子装置および電子モジュール |
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JP5942594B2 (ja) | 2012-04-06 | 2016-06-29 | 日亜化学工業株式会社 | 半導体装置 |
WO2015060387A1 (ja) * | 2013-10-23 | 2015-04-30 | 京セラ株式会社 | 配線基板および電子装置 |
JP6431191B2 (ja) * | 2015-06-25 | 2018-11-28 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
JP6748302B2 (ja) * | 2017-05-26 | 2020-08-26 | 京セラ株式会社 | 電子部品搭載用基板、電子装置および電子モジュール |
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2019
- 2019-10-31 CN CN201980085080.6A patent/CN113228258A/zh active Pending
- 2019-10-31 EP EP19905747.2A patent/EP3905314A4/en active Pending
- 2019-10-31 WO PCT/JP2019/042862 patent/WO2020137152A1/ja unknown
- 2019-10-31 JP JP2020562873A patent/JP7136926B2/ja active Active
- 2019-10-31 US US17/417,413 patent/US11742278B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005191097A (ja) * | 2003-12-24 | 2005-07-14 | Kawaguchiko Seimitsu Co Ltd | 半導体パッケージ |
JP2018073905A (ja) * | 2016-10-26 | 2018-05-10 | 京セラ株式会社 | 電子部品搭載用基板、電子装置および電子モジュール |
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Publication number | Publication date |
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US11742278B2 (en) | 2023-08-29 |
JP7136926B2 (ja) | 2022-09-13 |
EP3905314A1 (en) | 2021-11-03 |
CN113228258A (zh) | 2021-08-06 |
EP3905314A4 (en) | 2022-02-16 |
US20220077049A1 (en) | 2022-03-10 |
WO2020137152A1 (ja) | 2020-07-02 |
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