JPWO2020112635A5 - - Google Patents
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- JPWO2020112635A5 JPWO2020112635A5 JP2021529685A JP2021529685A JPWO2020112635A5 JP WO2020112635 A5 JPWO2020112635 A5 JP WO2020112635A5 JP 2021529685 A JP2021529685 A JP 2021529685A JP 2021529685 A JP2021529685 A JP 2021529685A JP WO2020112635 A5 JPWO2020112635 A5 JP WO2020112635A5
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- 230000004888 barrier function Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024137470A JP2024157013A (ja) | 2018-11-28 | 2024-08-17 | 超音波溶接システムおよび当該システムを使用する方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862772113P | 2018-11-28 | 2018-11-28 | |
| US62/772,113 | 2018-11-28 | ||
| PCT/US2019/063007 WO2020112635A1 (en) | 2018-11-28 | 2019-11-25 | Ultrasonic welding systems and methods of using the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024137470A Division JP2024157013A (ja) | 2018-11-28 | 2024-08-17 | 超音波溶接システムおよび当該システムを使用する方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022510882A JP2022510882A (ja) | 2022-01-28 |
| JPWO2020112635A5 true JPWO2020112635A5 (enExample) | 2022-11-14 |
| JP7541806B2 JP7541806B2 (ja) | 2024-08-29 |
Family
ID=70771461
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021529685A Active JP7541806B2 (ja) | 2018-11-28 | 2019-11-25 | 超音波溶接システムおよび当該システムを使用する方法 |
| JP2024137470A Pending JP2024157013A (ja) | 2018-11-28 | 2024-08-17 | 超音波溶接システムおよび当該システムを使用する方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024137470A Pending JP2024157013A (ja) | 2018-11-28 | 2024-08-17 | 超音波溶接システムおよび当該システムを使用する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US11285561B2 (enExample) |
| EP (2) | EP4403292A3 (enExample) |
| JP (2) | JP7541806B2 (enExample) |
| CN (2) | CN113165102B (enExample) |
| WO (1) | WO2020112635A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018187364A1 (en) * | 2017-04-04 | 2018-10-11 | Kulicke And Saffa Industries, Inc. | Ultrasonic welding systems and methods of using the same |
| WO2020163694A1 (en) * | 2019-02-07 | 2020-08-13 | T.A. Systems, Inc. | Ultrasonic sonotrode with workpiece clamping tool |
| US11626677B2 (en) * | 2020-05-13 | 2023-04-11 | Semiconductor Components Industries, Llc | Bonding module pins to an electronic substrate |
| WO2021247414A1 (en) * | 2020-06-03 | 2021-12-09 | Kulicke And Soffa Industries, Inc. | Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins |
| DE102022108397A1 (de) * | 2022-04-07 | 2023-10-12 | Herrmann Ultraschalltechnik Gmbh & Co. Kg | Vorrichtung zum Ultraschallschweißen eines Werkstücks und Verfahren zum Betreiben einer solchen Vorrichtung |
| CN115420412B (zh) * | 2022-08-05 | 2025-08-26 | 上海骄成超声波技术股份有限公司 | 一种用于超声波焊头的压力检测组件及其检测装置 |
| EP4357067A4 (en) * | 2022-08-31 | 2025-07-09 | Wuxi Lead Intelligent Equipment Co Ltd | TAB WELDING DEVICE |
| EP4698345A1 (en) | 2023-04-19 | 2026-02-25 | Kulicke and Soffa Industries, Inc. | Ultrasonic welding systems for conductive pins, and related methods |
| CN116652356A (zh) * | 2023-07-11 | 2023-08-29 | 广东铭基高科电子股份有限公司 | 一种超声波焊接机构 |
| CN117680867B (zh) * | 2024-02-04 | 2024-05-24 | 南京航空航天大学 | 一种基于纳米颗粒植入与微量元素补偿的高强焊丝的焊接方法 |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001105160A (ja) | 1999-09-30 | 2001-04-17 | Suzuki Motor Corp | 超音波溶着装置 |
| JP2003127234A (ja) * | 2001-10-29 | 2003-05-08 | Matsushita Electric Works Ltd | 超音波溶着装置 |
| JP3966217B2 (ja) * | 2003-04-23 | 2007-08-29 | 松下電器産業株式会社 | ボンディング装置およびボンディングツール |
| JP3848637B2 (ja) * | 2003-05-06 | 2006-11-22 | Esb株式会社 | 超音波接合装置 |
| JP4792945B2 (ja) | 2005-01-28 | 2011-10-12 | 日産自動車株式会社 | 超音波接合装置および接合構造体 |
| US7748590B2 (en) * | 2005-05-16 | 2010-07-06 | Ford Global Technologies, Llc | Ultrasonic welding apparatus |
| JP4577509B2 (ja) | 2005-06-22 | 2010-11-10 | トヨタ自動車株式会社 | パワー半導体モジュール及びその製造方法 |
| DE102005048368B3 (de) | 2005-10-10 | 2007-05-03 | Schunk Ultraschalltechnik Gmbh | Verfahren zum Herstellen einer Schweißverbindung zwischen elektrischen Leitern |
| JP5014151B2 (ja) * | 2005-12-06 | 2012-08-29 | 東レエンジニアリング株式会社 | チップ実装装置およびチップ実装方法 |
| JP4825029B2 (ja) * | 2006-03-17 | 2011-11-30 | 富士通セミコンダクター株式会社 | ボンディング装置及びボンディング方法 |
| US8052816B2 (en) * | 2006-05-08 | 2011-11-08 | Dukane Corporation | Ultrasonic press using servo motor with delayed motion |
| JP4399869B2 (ja) * | 2007-07-30 | 2010-01-20 | Tdk株式会社 | 超音波振動を用いて実装部品を被実装部品に実装する実装装置 |
| JP4311582B1 (ja) * | 2008-04-07 | 2009-08-12 | 株式会社アドウェルズ | 共振器の支持装置 |
| JP4336732B1 (ja) * | 2008-04-11 | 2009-09-30 | Tdk株式会社 | 超音波実装装置 |
| US8746537B2 (en) * | 2010-03-31 | 2014-06-10 | Orthodyne Electronics Corporation | Ultrasonic bonding systems and methods of using the same |
| WO2011123539A2 (en) * | 2010-03-31 | 2011-10-06 | Orthodyne Electronics Corporation | Ultrasonic bonding systems and methods of using the same |
| JP4808283B1 (ja) * | 2010-06-30 | 2011-11-02 | 株式会社新川 | 電子部品実装装置及び電子部品実装方法 |
| WO2012012335A2 (en) | 2010-07-19 | 2012-01-26 | Orthodyne Electronics Corporation | Ultrasonic bonding systems including workholder and ribbon feeding system |
| ES1075973Y (es) * | 2011-05-12 | 2012-04-13 | Eficiencia Y Tecnologia S A | Dispositivo de soldadura longitudinal en continuo para maquinas envasadoras |
| JP2013051366A (ja) | 2011-08-31 | 2013-03-14 | Hitachi Ltd | パワーモジュール及びその製造方法 |
| JP5779761B2 (ja) | 2011-09-15 | 2015-09-16 | 精電舎電子工業株式会社 | 超音波溶着装置、超音波接合装置、布線装置 |
| KR101276408B1 (ko) * | 2012-01-02 | 2013-06-19 | 뉴모텍(주) | 초음파 융착 방식을 적용한 모터의 pcb 조립 장치 |
| JP6033011B2 (ja) | 2012-09-12 | 2016-11-30 | 三菱電機株式会社 | 電力用半導体装置および電力用半導体装置の製造方法 |
| US8858742B2 (en) * | 2012-11-16 | 2014-10-14 | GM Global Technology Operations LLC | Automatic monitoring of vibration welding equipment |
| JP5426000B2 (ja) * | 2012-11-16 | 2014-02-26 | 株式会社新川 | ワイヤボンディング装置及びワイヤボンディング方法 |
| CH707378A1 (de) * | 2012-12-21 | 2014-06-30 | Besi Switzerland Ag | Thermokompressionsverfahren und Vorrichtung für die Montage von Halbleiterchips auf einem Substrat. |
| US9620477B2 (en) * | 2013-01-25 | 2017-04-11 | Asm Technology Singapore Pte Ltd | Wire bonder and method of calibrating a wire bonder |
| JP6349502B2 (ja) * | 2013-04-10 | 2018-07-04 | 株式会社アドウェルズ | 接合装置 |
| US20150210003A1 (en) | 2014-01-28 | 2015-07-30 | Frito-Lay Noth America, Inc. | Transverse Sonotrode Design for Ultrasonic Welding |
| FR3019083B1 (fr) * | 2014-04-01 | 2016-12-30 | Sonimat | Dispositif de soudure par ultrasons |
| US9751257B2 (en) * | 2014-06-17 | 2017-09-05 | GM Global Technology Operations LLC | Ultrasonic welder clamp |
| JP6406983B2 (ja) | 2014-11-12 | 2018-10-17 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JP5950994B2 (ja) * | 2014-12-26 | 2016-07-13 | 株式会社新川 | 実装装置 |
| JP2016143826A (ja) | 2015-02-04 | 2016-08-08 | 三菱電機株式会社 | 電力用半導体装置、超音波接合方法および超音波接合装置 |
| CN107615464B (zh) | 2015-06-11 | 2020-03-17 | 三菱电机株式会社 | 电力用半导体装置的制造方法以及电力用半导体装置 |
| JP2017024040A (ja) | 2015-07-22 | 2017-02-02 | 矢崎総業株式会社 | 超音波接合装置 |
| WO2018187364A1 (en) * | 2017-04-04 | 2018-10-11 | Kulicke And Saffa Industries, Inc. | Ultrasonic welding systems and methods of using the same |
| WO2019075289A1 (en) | 2017-10-13 | 2019-04-18 | Kulicke And Soffa Industries, Inc. | CONDUCTIVE TERMINALS, OMNIBUS BARS, AND METHODS OF PREPARING THE SAME, AND METHODS OF ASSEMBLING POWER MODULES THEREOF |
| WO2020006062A1 (en) * | 2018-06-26 | 2020-01-02 | Db Sonics, Inc. | Sonotrode and method of manufacturing |
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2019
- 2019-11-25 CN CN201980078598.7A patent/CN113165102B/zh active Active
- 2019-11-25 WO PCT/US2019/063007 patent/WO2020112635A1/en not_active Ceased
- 2019-11-25 CN CN202310078303.4A patent/CN115971633A/zh active Pending
- 2019-11-25 EP EP24020076.6A patent/EP4403292A3/en active Pending
- 2019-11-25 EP EP19890498.9A patent/EP3887085B1/en active Active
- 2019-11-25 JP JP2021529685A patent/JP7541806B2/ja active Active
- 2019-11-26 US US16/697,010 patent/US11285561B2/en active Active
-
2022
- 2022-01-27 US US17/586,105 patent/US11504800B2/en active Active
- 2022-10-19 US US17/969,028 patent/US11958124B2/en active Active
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2024
- 2024-08-17 JP JP2024137470A patent/JP2024157013A/ja active Pending