JPWO2020094559A5 - - Google Patents

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Publication number
JPWO2020094559A5
JPWO2020094559A5 JP2021523646A JP2021523646A JPWO2020094559A5 JP WO2020094559 A5 JPWO2020094559 A5 JP WO2020094559A5 JP 2021523646 A JP2021523646 A JP 2021523646A JP 2021523646 A JP2021523646 A JP 2021523646A JP WO2020094559 A5 JPWO2020094559 A5 JP WO2020094559A5
Authority
JP
Japan
Prior art keywords
layer
electromechanical
sensor
electromechanical converter
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021523646A
Other languages
English (en)
Japanese (ja)
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JP2022506331A (ja
Publication date
Priority claimed from DE102018127651.6A external-priority patent/DE102018127651A1/de
Application filed filed Critical
Publication of JP2022506331A publication Critical patent/JP2022506331A/ja
Publication of JPWO2020094559A5 publication Critical patent/JPWO2020094559A5/ja
Pending legal-status Critical Current

Links

JP2021523646A 2018-11-06 2019-11-04 層状構造の電気機械変換器 Pending JP2022506331A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018127651.6 2018-11-06
DE102018127651.6A DE102018127651A1 (de) 2018-11-06 2018-11-06 Elektromechanischer Wandler mit einem Schichtaufbau
PCT/EP2019/080081 WO2020094559A1 (de) 2018-11-06 2019-11-04 Elektromechanischer wandler mit einem schichtaufbau

Publications (2)

Publication Number Publication Date
JP2022506331A JP2022506331A (ja) 2022-01-17
JPWO2020094559A5 true JPWO2020094559A5 (zh) 2022-05-26

Family

ID=68468725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021523646A Pending JP2022506331A (ja) 2018-11-06 2019-11-04 層状構造の電気機械変換器

Country Status (8)

Country Link
US (1) US20210343926A1 (zh)
EP (1) EP3853915B1 (zh)
JP (1) JP2022506331A (zh)
KR (1) KR20210084623A (zh)
CN (1) CN113039656A (zh)
BR (1) BR112021007772A2 (zh)
DE (1) DE102018127651A1 (zh)
WO (1) WO2020094559A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020107028B4 (de) 2020-03-13 2022-12-29 Technische Universität Chemnitz Piezoelektrische Vorrichtung und Verfahren zu deren Herstellung

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1114478A (ja) * 1997-06-26 1999-01-22 Matsushita Electric Ind Co Ltd 圧力検出装置
GB2375175A (en) * 2001-05-03 2002-11-06 Electro Mechanical Assembly Lt Peizoelectric device for detecting or measuring the bending of objects
DE10136402C2 (de) * 2001-07-26 2003-07-31 Fraunhofer Ges Forschung Physikalisch aktives Pflaster und Verfahren zur Herstellung
JP4126960B2 (ja) * 2002-05-24 2008-07-30 住友電気工業株式会社 異方導電材料
JP4617078B2 (ja) * 2003-12-08 2011-01-19 北陸電気工業株式会社 積層圧電体及び圧電型振動素子
JP2008135886A (ja) * 2006-11-27 2008-06-12 Matsushita Electric Works Ltd Baw共振器の製造方法
US20080203851A1 (en) * 2007-02-27 2008-08-28 Iptrade, Inc. Piezoelectric package with porous conductive layers
EP2144290A1 (en) * 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electronic device and method of manufacturing the same
US7656076B1 (en) * 2008-07-15 2010-02-02 Iptrade, Inc. Unimorph/bimorph piezoelectric package
DE102010013565A1 (de) 2010-03-30 2012-01-19 Fludicon Gmbh Elektromechanischer Wandler und Verfahren zur Herstellung des elektromechanischen Wandlers
US8614724B2 (en) * 2011-08-17 2013-12-24 The Boeing Company Method and system of fabricating PZT nanoparticle ink based piezoelectric sensor
DE102011086042A1 (de) * 2011-11-09 2013-05-16 Johnson Matthey Catalysts (Germany) Gmbh Biegewandler sowie Mikropumpe mit einem Biegewandler
JP6066773B2 (ja) * 2013-03-05 2017-01-25 積水化学工業株式会社 圧電センサの製造方法
WO2015041049A1 (ja) * 2013-09-20 2015-03-26 株式会社村田製作所 圧電センサ
CN104881193B (zh) * 2015-06-02 2018-11-27 南昌欧菲光科技有限公司 触控显示装置、压力触控单元及其制作方法
DE102016214607B4 (de) * 2016-08-05 2023-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektronisches Modul und Verfahren zu seiner Herstellung

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