JPWO2020035982A1 - 組成物及びエッチング方法 - Google Patents

組成物及びエッチング方法 Download PDF

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Publication number
JPWO2020035982A1
JPWO2020035982A1 JP2020537369A JP2020537369A JPWO2020035982A1 JP WO2020035982 A1 JPWO2020035982 A1 JP WO2020035982A1 JP 2020537369 A JP2020537369 A JP 2020537369A JP 2020537369 A JP2020537369 A JP 2020537369A JP WO2020035982 A1 JPWO2020035982 A1 JP WO2020035982A1
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JP
Japan
Prior art keywords
mass
etching
general formula
composition
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020537369A
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English (en)
Japanese (ja)
Inventor
祐次 正元
祐次 正元
阿部　徹司
徹司 阿部
広之 千葉
広之 千葉
裕太 野口
裕太 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of JPWO2020035982A1 publication Critical patent/JPWO2020035982A1/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
JP2020537369A 2018-08-13 2019-05-28 組成物及びエッチング方法 Pending JPWO2020035982A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018152229 2018-08-13
JP2018152229 2018-08-13
PCT/JP2019/021017 WO2020035982A1 (ja) 2018-08-13 2019-05-28 組成物及びエッチング方法

Publications (1)

Publication Number Publication Date
JPWO2020035982A1 true JPWO2020035982A1 (ja) 2021-09-02

Family

ID=69525409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020537369A Pending JPWO2020035982A1 (ja) 2018-08-13 2019-05-28 組成物及びエッチング方法

Country Status (5)

Country Link
JP (1) JPWO2020035982A1 (zh)
KR (1) KR20210035090A (zh)
CN (1) CN112135927B (zh)
TW (1) TW202009326A (zh)
WO (1) WO2020035982A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113718256B (zh) * 2021-08-06 2022-11-11 浙江奥首材料科技有限公司 一种铜蚀刻液及其在晶圆级封装中的应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3483385B2 (ja) * 1996-02-07 2004-01-06 旭電化工業株式会社 ステンレス鋼のエッチング液組成物
JP2003338676A (ja) * 2002-05-20 2003-11-28 Mec Kk 銅配線基板の製造方法
JP4916455B2 (ja) 2008-01-15 2012-04-11 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物
JP4685180B2 (ja) * 2009-07-09 2011-05-18 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法
JP2012107286A (ja) 2010-11-17 2012-06-07 Mitsubishi Paper Mills Ltd 銅又は銅合金用エッチング液
JP5535060B2 (ja) * 2010-12-28 2014-07-02 株式会社Ａｄｅｋａ 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法
JP6557575B2 (ja) * 2015-10-23 2019-08-07 株式会社Adeka エッチング液組成物及びエッチング方法

Also Published As

Publication number Publication date
KR20210035090A (ko) 2021-03-31
CN112135927B (zh) 2022-06-24
TW202009326A (zh) 2020-03-01
WO2020035982A1 (ja) 2020-02-20
CN112135927A (zh) 2020-12-25

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