JPWO2020033335A5 - - Google Patents

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Publication number
JPWO2020033335A5
JPWO2020033335A5 JP2021506755A JP2021506755A JPWO2020033335A5 JP WO2020033335 A5 JPWO2020033335 A5 JP WO2020033335A5 JP 2021506755 A JP2021506755 A JP 2021506755A JP 2021506755 A JP2021506755 A JP 2021506755A JP WO2020033335 A5 JPWO2020033335 A5 JP WO2020033335A5
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JP
Japan
Prior art keywords
test
electronic circuit
flexible electronic
boards
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021506755A
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English (en)
Japanese (ja)
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JP2021534382A (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/US2019/045175 external-priority patent/WO2020033335A1/en
Publication of JP2021534382A publication Critical patent/JP2021534382A/ja
Publication of JPWO2020033335A5 publication Critical patent/JPWO2020033335A5/ja
Priority to JP2024046321A priority Critical patent/JP2024081706A/ja
Withdrawn legal-status Critical Current

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JP2021506755A 2018-08-06 2019-08-05 半導体デバイスを試験するための装置および方法 Withdrawn JP2021534382A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024046321A JP2024081706A (ja) 2018-08-06 2024-03-22 半導体デバイスを試験するための装置および方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862715259P 2018-08-06 2018-08-06
US62/715,259 2018-08-06
PCT/US2019/045175 WO2020033335A1 (en) 2018-08-06 2019-08-05 Apparatus and method for testing semiconductor devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024046321A Division JP2024081706A (ja) 2018-08-06 2024-03-22 半導体デバイスを試験するための装置および方法

Publications (2)

Publication Number Publication Date
JP2021534382A JP2021534382A (ja) 2021-12-09
JPWO2020033335A5 true JPWO2020033335A5 (enExample) 2022-08-15

Family

ID=69228508

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021506755A Withdrawn JP2021534382A (ja) 2018-08-06 2019-08-05 半導体デバイスを試験するための装置および方法
JP2024046321A Pending JP2024081706A (ja) 2018-08-06 2024-03-22 半導体デバイスを試験するための装置および方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024046321A Pending JP2024081706A (ja) 2018-08-06 2024-03-22 半導体デバイスを試験するための装置および方法

Country Status (5)

Country Link
US (1) US11237208B2 (enExample)
JP (2) JP2021534382A (enExample)
CN (1) CN113196070B (enExample)
TW (2) TWI851590B (enExample)
WO (1) WO2020033335A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220137132A1 (en) * 2018-08-06 2022-05-05 Testmetrix, Inc. Apparatus and Method for Testing Semiconductor Devices
US11293974B2 (en) * 2019-09-27 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for semiconductor device testing
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11549981B2 (en) * 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US12320841B2 (en) 2020-11-19 2025-06-03 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11609266B2 (en) 2020-12-04 2023-03-21 Advantest Test Solutions, Inc. Active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
CN115878390B (zh) * 2021-09-27 2025-10-14 长鑫存储技术有限公司 一种用于测试内存信号的测试板
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
WO2023137100A1 (en) * 2022-01-12 2023-07-20 Testmetrix, Inc. Apparatus and method for testing semiconductor devices
CN120743051B (zh) * 2025-08-29 2025-11-04 苏州元脑智能科技有限公司 叠层装置、叠层方法及服务器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5986447A (en) * 1997-05-23 1999-11-16 Credence Systems Corporation Test head structure for integrated circuit tester
US6040691A (en) * 1997-05-23 2000-03-21 Credence Systems Corporation Test head for integrated circuit tester arranging tester component circuit boards on three dimensions
US6218910B1 (en) * 1999-02-25 2001-04-17 Formfactor, Inc. High bandwidth passive integrated circuit tester probe card assembly
DE60115437T2 (de) * 2000-06-20 2006-07-27 Nanonexus, Inc., Fremont Testsystem von integrierten schaltungen
US6822469B1 (en) * 2000-07-31 2004-11-23 Eaglestone Partners I, Llc Method for testing multiple semiconductor wafers
US7385385B2 (en) * 2001-10-03 2008-06-10 Nextest Systems Corporation System for testing DUT and tester for use therewith
AU2002363990A1 (en) * 2001-12-14 2003-06-30 Intest Ip Corporation Flexible interface for a test head
JP2005017301A (ja) * 2002-03-29 2005-01-20 Toshiba Corp 半導体装置試験用コンタクト基板
US6864698B2 (en) * 2003-03-24 2005-03-08 Teradyne, Inc. Hybrid cooling system for automatic test equipment
DE10342869B4 (de) * 2003-09-15 2005-07-21 Voith Turbo Gmbh & Co. Kg Kraftfahrzeugantrieb mit einem Wasserretarder
US7019546B1 (en) * 2004-06-25 2006-03-28 Credence Systems Corporation Test head for integrated circuit tester
JP2006186130A (ja) * 2004-12-28 2006-07-13 Matsushita Electric Ind Co Ltd 半導体検査装置
KR100720122B1 (ko) * 2005-03-30 2007-05-22 주식회사 세지 반도체 웨이퍼 검사기의 프로브 장치
US7528617B2 (en) * 2006-03-07 2009-05-05 Testmetrix, Inc. Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
JP2011169670A (ja) * 2010-02-17 2011-09-01 Advanced Systems Japan Inc プローブ装置
KR20140124065A (ko) * 2013-04-15 2014-10-24 삼성전자주식회사 검사 장치 및 검사 방법
JP6209376B2 (ja) * 2013-07-08 2017-10-04 株式会社日本マイクロニクス 電気的接続装置

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