CN113196070B - 用于测试半导体装置的设备及方法 - Google Patents

用于测试半导体装置的设备及方法 Download PDF

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Publication number
CN113196070B
CN113196070B CN201980065182.1A CN201980065182A CN113196070B CN 113196070 B CN113196070 B CN 113196070B CN 201980065182 A CN201980065182 A CN 201980065182A CN 113196070 B CN113196070 B CN 113196070B
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CN
China
Prior art keywords
test
wafer
stack
test stack
contactor
Prior art date
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Active
Application number
CN201980065182.1A
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English (en)
Chinese (zh)
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CN113196070A (zh
Inventor
克莉丝汀·O.·柯久尼纳
路西安·史酷图
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Maicuisi Test Co ltd
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Maicuisi Test Co ltd
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Publication date
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Publication of CN113196070A publication Critical patent/CN113196070A/zh
Application granted granted Critical
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
    • G01R31/275—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements for testing individual semiconductor components within integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Thermal Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN201980065182.1A 2018-08-06 2019-08-05 用于测试半导体装置的设备及方法 Active CN113196070B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862715259P 2018-08-06 2018-08-06
US62/715,259 2018-08-06
PCT/US2019/045175 WO2020033335A1 (en) 2018-08-06 2019-08-05 Apparatus and method for testing semiconductor devices

Publications (2)

Publication Number Publication Date
CN113196070A CN113196070A (zh) 2021-07-30
CN113196070B true CN113196070B (zh) 2024-10-25

Family

ID=69228508

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980065182.1A Active CN113196070B (zh) 2018-08-06 2019-08-05 用于测试半导体装置的设备及方法

Country Status (5)

Country Link
US (1) US11237208B2 (enExample)
JP (2) JP2021534382A (enExample)
CN (1) CN113196070B (enExample)
TW (2) TWI851590B (enExample)
WO (1) WO2020033335A1 (enExample)

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US20220137132A1 (en) * 2018-08-06 2022-05-05 Testmetrix, Inc. Apparatus and Method for Testing Semiconductor Devices
US11293974B2 (en) * 2019-09-27 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for semiconductor device testing
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11549981B2 (en) * 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US12320841B2 (en) 2020-11-19 2025-06-03 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11567119B2 (en) 2020-12-04 2023-01-31 Advantest Test Solutions, Inc. Testing system including active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
CN115878390B (zh) * 2021-09-27 2025-10-14 长鑫存储技术有限公司 一种用于测试内存信号的测试板
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
WO2023137100A1 (en) * 2022-01-12 2023-07-20 Testmetrix, Inc. Apparatus and method for testing semiconductor devices
CN120743051B (zh) * 2025-08-29 2025-11-04 苏州元脑智能科技有限公司 叠层装置、叠层方法及服务器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011169670A (ja) * 2010-02-17 2011-09-01 Advanced Systems Japan Inc プローブ装置

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US5986447A (en) * 1997-05-23 1999-11-16 Credence Systems Corporation Test head structure for integrated circuit tester
US6040691A (en) * 1997-05-23 2000-03-21 Credence Systems Corporation Test head for integrated circuit tester arranging tester component circuit boards on three dimensions
US6218910B1 (en) * 1999-02-25 2001-04-17 Formfactor, Inc. High bandwidth passive integrated circuit tester probe card assembly
WO2001098793A2 (en) * 2000-06-20 2001-12-27 Nanonexus, Inc. Systems for testing integraged circuits during burn-in
US6822469B1 (en) * 2000-07-31 2004-11-23 Eaglestone Partners I, Llc Method for testing multiple semiconductor wafers
US7385385B2 (en) * 2001-10-03 2008-06-10 Nextest Systems Corporation System for testing DUT and tester for use therewith
JP2005513443A (ja) * 2001-12-14 2005-05-12 インテスト　アイピー　コーポレイション テストヘッドと共に用いる接続モジュール、テストヘッドと被テスト装置との間の相互接続を提供するインタフェーステストヘッドシステム、テストヘッドを被テスト装置に接続する方法、テストヘッドシステムを変更する方法、およびテストヘッドシステムを組み立てる方法
JP2005017301A (ja) * 2002-03-29 2005-01-20 Toshiba Corp 半導体装置試験用コンタクト基板
US6864698B2 (en) * 2003-03-24 2005-03-08 Teradyne, Inc. Hybrid cooling system for automatic test equipment
DE10342869B4 (de) * 2003-09-15 2005-07-21 Voith Turbo Gmbh & Co. Kg Kraftfahrzeugantrieb mit einem Wasserretarder
US7019546B1 (en) * 2004-06-25 2006-03-28 Credence Systems Corporation Test head for integrated circuit tester
JP2006186130A (ja) * 2004-12-28 2006-07-13 Matsushita Electric Ind Co Ltd 半導体検査装置
KR100720122B1 (ko) * 2005-03-30 2007-05-22 주식회사 세지 반도체 웨이퍼 검사기의 프로브 장치
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KR20140124065A (ko) * 2013-04-15 2014-10-24 삼성전자주식회사 검사 장치 및 검사 방법
JP6209376B2 (ja) * 2013-07-08 2017-10-04 株式会社日本マイクロニクス 電気的接続装置

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Also Published As

Publication number Publication date
US20200041564A1 (en) 2020-02-06
CN113196070A (zh) 2021-07-30
US11237208B2 (en) 2022-02-01
JP2021534382A (ja) 2021-12-09
TWI851590B (zh) 2024-08-11
TW202026651A (zh) 2020-07-16
WO2020033335A1 (en) 2020-02-13
JP2024081706A (ja) 2024-06-18
TW202509503A (zh) 2025-03-01

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