JP2021534382A - 半導体デバイスを試験するための装置および方法 - Google Patents

半導体デバイスを試験するための装置および方法 Download PDF

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Publication number
JP2021534382A
JP2021534382A JP2021506755A JP2021506755A JP2021534382A JP 2021534382 A JP2021534382 A JP 2021534382A JP 2021506755 A JP2021506755 A JP 2021506755A JP 2021506755 A JP2021506755 A JP 2021506755A JP 2021534382 A JP2021534382 A JP 2021534382A
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JP
Japan
Prior art keywords
test
wafer
stack
test stack
circuit board
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021506755A
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English (en)
Japanese (ja)
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JPWO2020033335A5 (enExample
Inventor
クリスチャン オー． コジョクニアヌ，
ルシアン スクルトゥ，
Original Assignee
テストメトリックス， インコーポレイテッド
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Application filed by テストメトリックス， インコーポレイテッド filed Critical テストメトリックス， インコーポレイテッド
Publication of JP2021534382A publication Critical patent/JP2021534382A/ja
Publication of JPWO2020033335A5 publication Critical patent/JPWO2020033335A5/ja
Priority to JP2024046321A priority Critical patent/JP2024081706A/ja
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
    • G01R31/275—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements for testing individual semiconductor components within integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Thermal Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2021506755A 2018-08-06 2019-08-05 半導体デバイスを試験するための装置および方法 Withdrawn JP2021534382A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024046321A JP2024081706A (ja) 2018-08-06 2024-03-22 半導体デバイスを試験するための装置および方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862715259P 2018-08-06 2018-08-06
US62/715,259 2018-08-06
PCT/US2019/045175 WO2020033335A1 (en) 2018-08-06 2019-08-05 Apparatus and method for testing semiconductor devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024046321A Division JP2024081706A (ja) 2018-08-06 2024-03-22 半導体デバイスを試験するための装置および方法

Publications (2)

Publication Number Publication Date
JP2021534382A true JP2021534382A (ja) 2021-12-09
JPWO2020033335A5 JPWO2020033335A5 (enExample) 2022-08-15

Family

ID=69228508

Family Applications (2)

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JP2021506755A Withdrawn JP2021534382A (ja) 2018-08-06 2019-08-05 半導体デバイスを試験するための装置および方法
JP2024046321A Pending JP2024081706A (ja) 2018-08-06 2024-03-22 半導体デバイスを試験するための装置および方法

Family Applications After (1)

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JP2024046321A Pending JP2024081706A (ja) 2018-08-06 2024-03-22 半導体デバイスを試験するための装置および方法

Country Status (5)

Country Link
US (1) US11237208B2 (enExample)
JP (2) JP2021534382A (enExample)
CN (1) CN113196070B (enExample)
TW (2) TWI851590B (enExample)
WO (1) WO2020033335A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220137132A1 (en) * 2018-08-06 2022-05-05 Testmetrix, Inc. Apparatus and Method for Testing Semiconductor Devices
US11293974B2 (en) * 2019-09-27 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for semiconductor device testing
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
US11549981B2 (en) * 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US12320841B2 (en) 2020-11-19 2025-06-03 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11609266B2 (en) 2020-12-04 2023-03-21 Advantest Test Solutions, Inc. Active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
CN115878390B (zh) * 2021-09-27 2025-10-14 长鑫存储技术有限公司 一种用于测试内存信号的测试板
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
WO2023137100A1 (en) * 2022-01-12 2023-07-20 Testmetrix, Inc. Apparatus and method for testing semiconductor devices
CN120743051B (zh) * 2025-08-29 2025-11-04 苏州元脑智能科技有限公司 叠层装置、叠层方法及服务器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6040691A (en) * 1997-05-23 2000-03-21 Credence Systems Corporation Test head for integrated circuit tester arranging tester component circuit boards on three dimensions
JP2005017301A (ja) * 2002-03-29 2005-01-20 Toshiba Corp 半導体装置試験用コンタクト基板
JP2006186130A (ja) * 2004-12-28 2006-07-13 Matsushita Electric Ind Co Ltd 半導体検査装置
JP2011169670A (ja) * 2010-02-17 2011-09-01 Advanced Systems Japan Inc プローブ装置
US20140306727A1 (en) * 2013-04-15 2014-10-16 Samsung Electronics Co., Ltd. Facility and a method for testing semiconductor devices
JP2015014556A (ja) * 2013-07-08 2015-01-22 株式会社日本マイクロニクス 電気的接続装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5986447A (en) * 1997-05-23 1999-11-16 Credence Systems Corporation Test head structure for integrated circuit tester
US6218910B1 (en) * 1999-02-25 2001-04-17 Formfactor, Inc. High bandwidth passive integrated circuit tester probe card assembly
ATE311604T1 (de) * 2000-06-20 2005-12-15 Nanonexus Inc Testsystem von integrierten schaltungen
US6822469B1 (en) * 2000-07-31 2004-11-23 Eaglestone Partners I, Llc Method for testing multiple semiconductor wafers
US7385385B2 (en) * 2001-10-03 2008-06-10 Nextest Systems Corporation System for testing DUT and tester for use therewith
EP1454153A2 (en) * 2001-12-14 2004-09-08 Intest IP Corporation Flexible interface for a test head
US6864698B2 (en) * 2003-03-24 2005-03-08 Teradyne, Inc. Hybrid cooling system for automatic test equipment
DE10342869B4 (de) * 2003-09-15 2005-07-21 Voith Turbo Gmbh & Co. Kg Kraftfahrzeugantrieb mit einem Wasserretarder
US7019546B1 (en) * 2004-06-25 2006-03-28 Credence Systems Corporation Test head for integrated circuit tester
KR100720122B1 (ko) * 2005-03-30 2007-05-22 주식회사 세지 반도체 웨이퍼 검사기의 프로브 장치
US7528617B2 (en) * 2006-03-07 2009-05-05 Testmetrix, Inc. Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6040691A (en) * 1997-05-23 2000-03-21 Credence Systems Corporation Test head for integrated circuit tester arranging tester component circuit boards on three dimensions
JP2005017301A (ja) * 2002-03-29 2005-01-20 Toshiba Corp 半導体装置試験用コンタクト基板
JP2006186130A (ja) * 2004-12-28 2006-07-13 Matsushita Electric Ind Co Ltd 半導体検査装置
JP2011169670A (ja) * 2010-02-17 2011-09-01 Advanced Systems Japan Inc プローブ装置
US20140306727A1 (en) * 2013-04-15 2014-10-16 Samsung Electronics Co., Ltd. Facility and a method for testing semiconductor devices
JP2015014556A (ja) * 2013-07-08 2015-01-22 株式会社日本マイクロニクス 電気的接続装置

Also Published As

Publication number Publication date
CN113196070B (zh) 2024-10-25
CN113196070A (zh) 2021-07-30
US11237208B2 (en) 2022-02-01
US20200041564A1 (en) 2020-02-06
WO2020033335A1 (en) 2020-02-13
JP2024081706A (ja) 2024-06-18
TW202509503A (zh) 2025-03-01
TWI851590B (zh) 2024-08-11
TW202026651A (zh) 2020-07-16

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