JPWO2020008662A1 - めっき装置 - Google Patents
めっき装置 Download PDFInfo
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- JPWO2020008662A1 JPWO2020008662A1 JP2020528676A JP2020528676A JPWO2020008662A1 JP WO2020008662 A1 JPWO2020008662 A1 JP WO2020008662A1 JP 2020528676 A JP2020528676 A JP 2020528676A JP 2020528676 A JP2020528676 A JP 2020528676A JP WO2020008662 A1 JPWO2020008662 A1 JP WO2020008662A1
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- 238000007747 plating Methods 0.000 title claims description 112
- 229910052751 metal Inorganic materials 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 63
- 238000012546 transfer Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 238000011144 upstream manufacturing Methods 0.000 claims description 10
- 230000007935 neutral effect Effects 0.000 claims description 9
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 5
- 229910001882 dioxygen Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 239000000243 solution Substances 0.000 description 21
- 238000003780 insertion Methods 0.000 description 20
- 230000037431 insertion Effects 0.000 description 20
- 238000012545 processing Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 239000006259 organic additive Substances 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
- C25D17/04—External supporting frames or structures
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Sustainable Energy (AREA)
- Electromagnetism (AREA)
- Sustainable Development (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
2:ワーク装着部
3:ワーク離脱部
4:前処理部
5:後処理部
6:ローラコンベア
7:ベルトコンベア
8,41:金属クリップ
9:コンベア本体
10:搬送ローラ
11:不溶解性陽極
12:めっき槽
13:イオン透過性中性隔膜
14:ワーク
15:ヘッドプーリ(従動プーリ)
16:テールプーリ(駆動プーリ)
17:ローラシャフト
18:ローラチェーン
19:スプロケット
20:ベルト支持ローラ
21:給電ローラ(給電手段)
22:クリップ係合孔
23:クリップ挿通孔
24:給電係合孔
25:湾曲部
26:係止片部
27:先端可動片部(ワーク挟持部)
28:ベルト端縁部(ワーク挟持部)
30:搬送方向
31:クリップ押圧部
32:ワークガイド部
33:突起
34:ロータリージョイント(給電手段)
40:装置フレーム
42:クリップ基部
43:バネ部
44:ワーク挟持部
Claims (4)
- 板状のワークを上流側から下流側へ移動させて前記ワークに対してめっき処理を施すめっき装置であって、
金属帯状のコンベア本体と、前記コンベア本体に保持される金属クリップとを有し、前記金属クリップのバネ力によって前記ワークの一側の端縁部を挟持可能なベルトコンベアと、
前記ベルトコンベアに挟持された前記ワークの他側の端縁部が載置されて前記ワークを下方から支持し、前記ベルトコンベアと同期して回転する複数の搬送ローラを有するローラコンベアと、を備え、
前記ワークは、前記一側の端縁部が前記ベルトコンベアに挟持され、且つ前記他側の端縁部が前記ローラコンベアに載置されることにより、水平状態で搬送されてめっき処理される
ことを特徴とするめっき装置。 - 請求項1に記載のめっき装置であって、
前記ベルトコンベアに電流を印加する給電手段を備え、
前記ベルトコンベアは、前記ワークを狭持するワーク挟持部を接点として前記ワークを陰極に帯電させる
ことを特徴とするめっき装置。 - 請求項1又は請求項2に記載のめっき装置であって、
めっき液を貯留するめっき槽と、
前記めっき槽に貯留されためっき液中に配置される陽極と、を備え、
前記ベルトコンベア及び前記ローラコンベアによって水平状態で搬送される前記ワークの少なくとも下面は、前記めっき槽のめっき液中を移動し、
前記陽極は、金属基材表面に金属酸化物を焼成した不溶解性陽極である
ことを特徴とするめっき装置。 - 請求項3に記載のめっき装置であって、
前記めっき槽のめっき液を、前記ワークが移動する第1領域と前記陽極が配置される第2領域とに分け、前記陽極から発生する酸素ガスを前記第1領域のめっき液から隔離するイオン透過性中性隔膜を備える
ことを特徴とするめっき装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018128180 | 2018-07-05 | ||
JP2018128180 | 2018-07-05 | ||
PCT/JP2018/047296 WO2020008662A1 (ja) | 2018-07-05 | 2018-12-21 | めっき装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020008662A1 true JPWO2020008662A1 (ja) | 2021-02-15 |
JP6910600B2 JP6910600B2 (ja) | 2021-07-28 |
Family
ID=69059515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020528676A Active JP6910600B2 (ja) | 2018-07-05 | 2018-12-21 | めっき装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20210332494A1 (ja) |
JP (1) | JP6910600B2 (ja) |
CN (1) | CN110892096A (ja) |
WO (1) | WO2020008662A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN215925113U (zh) * | 2021-01-18 | 2022-03-01 | 厦门海辰新能源科技有限公司 | 一种镀膜机及电镀生产线 |
CN113981512B (zh) * | 2021-10-29 | 2023-09-22 | 安吉周铁艺家具有限公司 | 一种用于金属家具表面镀层的一体化装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0631476B2 (ja) * | 1986-07-19 | 1994-04-27 | シエ−リング・アクチエンゲゼルシヤフト | 板状物体の電解処理装置 |
JPH10513504A (ja) * | 1995-02-11 | 1998-12-22 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 水平連続設備においてプレート形状の処理材料を電気めっきするための方法及び装置 |
JP2007131869A (ja) * | 2005-11-08 | 2007-05-31 | C Uyemura & Co Ltd | めっき槽 |
JP2011068492A (ja) * | 2009-08-27 | 2011-04-07 | Marunaka Kogyo Kk | 表面処理装置における板状被処理物の搬送装置、この搬送装置の挟持チャック |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8900229A (nl) * | 1989-01-31 | 1990-08-16 | Meco Equip Eng | Inrichting voor het behandelen van strookvormige elementen. |
KR100683268B1 (ko) * | 1998-09-08 | 2007-02-15 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판도금장치 |
US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
NL2005480C2 (nl) * | 2010-10-07 | 2012-04-11 | Meco Equip Eng | Inrichting voor het eenzijdig elektrolytisch behandelen van een vlak substraat. |
JP3170766U (ja) * | 2011-07-16 | 2011-09-29 | 丸仲工業株式会社 | クランプ搬送による薄板状被処理物の水平連続メッキ処理装置 |
DE102012221012B4 (de) * | 2012-11-16 | 2023-01-19 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zur Behandlung von flachem Behandlungsgut |
JP2017014553A (ja) * | 2015-06-29 | 2017-01-19 | 丸仲工業株式会社 | クランプ搬送による薄板状被処理物の表面処理装置、及びこの表面処理装置のクランプ治具 |
-
2018
- 2018-12-21 JP JP2020528676A patent/JP6910600B2/ja active Active
- 2018-12-21 US US16/624,807 patent/US20210332494A1/en not_active Abandoned
- 2018-12-21 CN CN201880044279.XA patent/CN110892096A/zh active Pending
- 2018-12-21 WO PCT/JP2018/047296 patent/WO2020008662A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0631476B2 (ja) * | 1986-07-19 | 1994-04-27 | シエ−リング・アクチエンゲゼルシヤフト | 板状物体の電解処理装置 |
JPH10513504A (ja) * | 1995-02-11 | 1998-12-22 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 水平連続設備においてプレート形状の処理材料を電気めっきするための方法及び装置 |
JP2007131869A (ja) * | 2005-11-08 | 2007-05-31 | C Uyemura & Co Ltd | めっき槽 |
JP2011068492A (ja) * | 2009-08-27 | 2011-04-07 | Marunaka Kogyo Kk | 表面処理装置における板状被処理物の搬送装置、この搬送装置の挟持チャック |
Also Published As
Publication number | Publication date |
---|---|
US20210332494A1 (en) | 2021-10-28 |
WO2020008662A1 (ja) | 2020-01-09 |
JP6910600B2 (ja) | 2021-07-28 |
CN110892096A (zh) | 2020-03-17 |
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