JPWO2019208298A1 - 基板処理システム及び基板処理方法 - Google Patents
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Abstract
Description
これに対して、本実施形態では、被処理ウェハWの内部に改質層Mを形成することで、当該改質層MとクラックCを基点に周縁部Weを除去することができる。かかる場合、支持ウェハSの接合面Sjが研削等によるダメージを被ることがない。
これに対して、本実施形態では、被処理ウェハWの内部に形成した改質層MとクラックCを基点に周縁部Weを剥離させて除去するので、パーティクルが発生しない。
これに対して、本実施形態では、レーザを用いて被処理ウェハWの内部に改質層Mを形成するので、例えば1μm未満の高い精度を確保できる。このため、改質層Mを基点として除去される周縁部Weの幅(トリム幅)の精度も向上する。
これに対して、本実施形態では、高周波のレーザを用いて被処理ウェハWの内部に改質層Mを形成するので、チャック91の回転速度を速くすることができ、極めて短時間で処理を行うことができる。したがって、ウェハ処理のスループットを向上させることができる。
これに対して、本実施形態では、第1のレーザヘッド94自体が経時的に劣化することはなく、メンテナンス頻度を低減することができる。また、レーザを用いたドライプロセスであるため、研削水や廃水処理が不要となる。このため、ランニングコストを低廉化することができる。
これに対して、本実施形態では、例えば処理ユニット90において、被処理ウェハWとレーザ光を相対的に動作制御することにより、改質層Mをノッチの形状に合わせて形成することができ、ノッチの形状を残したまま、周縁部Weを容易に除去することもできる。
これに対して、本実施形態では、第2の被処理ウェハW2の内部に改質層Mを形成することで、当該改質層MとクラックCを基点に周縁部Weを容易に除去することができる。
これに対して、本実施形態では、レーザを用いて第2の被処理ウェハW2の内部に改質層Mを形成するので、高い精度を確保することができ、第2の被処理ウェハW2を適切に積層することができる。
50 加工装置
60 制御装置
90 処理ユニット
130 粗研削ユニット
S 支持ウェハ
T 重合ウェハ
W 被処理ウェハ
Claims (14)
- 基板を処理する基板処理システムであって、
第1の基板における除去対象の周縁部と中央部との境界に沿って当該第1の基板の内部に改質層を形成する改質層形成装置と、
前記周縁部において、前記第1の基板と第2の基板とが接合される界面に所定の処理を行う界面処理装置と、
前記改質層を基点に前記周縁部を除去する周縁除去装置と、
前記改質層形成装置で形成された前記改質層の位置、又は、前記界面処理装置で処理された前記界面の位置を検出する位置検出装置と、
前記改質層形成装置と前記界面処理装置を制御する制御装置と、を有し、
前記制御装置は、
前記位置検出装置で検出された前記改質層の位置に基づいて、前記界面処理装置で処理される前記界面の位置を制御し、
又は、前記位置検出装置で検出された前記界面の位置に基づいて、前記改質層形成装置で形成する前記改質層の位置を制御する。 - 請求項1に記載の基板処理システムにおいて、
前記位置検出装置は、赤外線を用いて、前記改質層形成装置で形成された前記改質層の位置、又は、前記界面処理装置で処理された前記界面の位置を検出する。 - 請求項1に記載の基板処理システムにおいて、
前記改質層形成装置は、前記界面処理装置で処理された前記界面の端部に対応する位置よりも径方向内側に前記改質層を形成する。 - 請求項3に記載の基板処理システムにおいて、
前記改質層形成装置は、前記界面の端部に対応する位置から径方向内側に500μm以内の位置に前記改質層を形成する。 - 請求項1に記載の基板処理システムにおいて、
前記界面処理装置は、前記界面を改質することを特徴とする。 - 請求項1に記載の基板処理システムにおいて、
前記界面処理装置は、
前記第2の基板の表面に形成された膜を第1のエッチング液でエッチングする第1の液供給部と、
前記膜がエッチングされた前記第2の基板の表面を第2のエッチング液でエッチングする第2の液供給部と、を有する。 - 請求項1に記載の基板処理システムにおいて、
前記界面処理装置は、前記第1の基板の表面に形成された膜又は前記第2の基板の表面に形成された膜を研磨する。 - 基板を処理する基板処理方法であって、
第1の基板における除去対象の周縁部と中央部との境界に沿って当該第1の基板の内部に改質層を形成する改質層形成工程と、
前記周縁部において、前記第1の基板と第2の基板とが接合される界面に所定の処理を行う界面処理工程と、
前記改質層形成工程で形成された前記改質層の位置、又は、前記界面処理工程で処理された前記界面の位置を検出する位置検出工程と、
前記改質層を基点に前記周縁部を除去する周縁除去工程と、を有し、
前記改質層形成工程が前記界面処理工程の前に行われる場合、前記位置検出工程で検出された前記改質層の位置に基づいて、前記界面処理工程において処理する前記界面の位置を制御し、
又は、前記界面処理工程が前記改質層形成工程の前に行われる場合、前記位置検出工程で検出された前記界面の位置に基づいて、前記改質層形成工程において形成する前記改質層の位置を制御する。 - 請求項8に記載の基板処理方法において、
前記位置検出工程では、赤外線を用いて、前記改質層形成工程で形成された前記改質層の位置、又は、前記界面処理工程で処理された前記界面の位置を検出する。 - 請求項8に記載の基板処理方法において、
前記改質層形成工程は前記界面処理工程の後に行われ、
前記改質層形成工程において、前記界面処理工程で処理された前記界面の端部に対応する位置よりも径方向内側に前記改質層を形成する。 - 請求項10に記載の基板処理方法において、
前記改質層形成工程において、前記界面の端部に対応する位置から径方向内側に500μm以内の位置に前記改質層を形成する。 - 請求項8に記載の基板処理方法において、
前記界面処理工程において、前記界面を改質することを特徴とする。 - 請求項8に記載の基板処理方法において、
前記界面処理工程は、
前記第2の基板の表面に形成された膜を第1のエッチング液でエッチングする第1のエッチング工程と、
前記膜がエッチングされた前記第2の基板の表面を第2のエッチング液でエッチングする第2のエッチング工程と、を有する。 - 請求項8に記載の基板処理方法において、
前記界面処理工程において、前記第1の基板の表面に形成された膜又は前記第2の基板の表面に形成された膜を研磨する。
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