JPWO2019199822A5 - - Google Patents

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Publication number
JPWO2019199822A5
JPWO2019199822A5 JP2020555056A JP2020555056A JPWO2019199822A5 JP WO2019199822 A5 JPWO2019199822 A5 JP WO2019199822A5 JP 2020555056 A JP2020555056 A JP 2020555056A JP 2020555056 A JP2020555056 A JP 2020555056A JP WO2019199822 A5 JPWO2019199822 A5 JP WO2019199822A5
Authority
JP
Japan
Prior art keywords
degrees
processing chamber
ring
substrate
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020555056A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021521326A5 (https=
JP2021521326A (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/US2019/026576 external-priority patent/WO2019199822A2/en
Publication of JP2021521326A publication Critical patent/JP2021521326A/ja
Publication of JP2021521326A5 publication Critical patent/JP2021521326A5/ja
Publication of JPWO2019199822A5 publication Critical patent/JPWO2019199822A5/ja
Pending legal-status Critical Current

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JP2020555056A 2018-04-10 2019-04-09 高温アモルファスカーボン堆積の厚膜堆積中の自発的アークの解決 Pending JP2021521326A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862655599P 2018-04-10 2018-04-10
US62/655,599 2018-04-10
US201962795242P 2019-01-22 2019-01-22
US62/795,242 2019-01-22
PCT/US2019/026576 WO2019199822A2 (en) 2018-04-10 2019-04-09 Resolving spontaneous arcing during thick film deposition of high temperature amorphous carbon deposition

Publications (3)

Publication Number Publication Date
JP2021521326A JP2021521326A (ja) 2021-08-26
JP2021521326A5 JP2021521326A5 (https=) 2022-04-19
JPWO2019199822A5 true JPWO2019199822A5 (https=) 2022-04-19

Family

ID=68164867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020555056A Pending JP2021521326A (ja) 2018-04-10 2019-04-09 高温アモルファスカーボン堆積の厚膜堆積中の自発的アークの解決

Country Status (6)

Country Link
US (1) US20210017645A1 (https=)
JP (1) JP2021521326A (https=)
KR (1) KR20200130745A (https=)
CN (1) CN112041480A (https=)
SG (1) SG11202009444QA (https=)
WO (1) WO2019199822A2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260025374A (ko) * 2023-06-16 2026-02-24 램 리써치 코포레이션 포커스 링에 의해 향상된 탄소 막 에지 두께 프로파일 조정가능성

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000040694A (ja) * 1998-07-23 2000-02-08 Advanced Display Inc ドライエッチング装置及びドライエッチング方法
US20030106646A1 (en) * 2001-12-11 2003-06-12 Applied Materials, Inc. Plasma chamber insert ring
US20040083976A1 (en) * 2002-09-25 2004-05-06 Silterra Malaysia Sdn. Bhd. Modified deposition ring to eliminate backside and wafer edge coating
US7501161B2 (en) * 2004-06-01 2009-03-10 Applied Materials, Inc. Methods and apparatus for reducing arcing during plasma processing
JP4507120B2 (ja) * 2005-11-11 2010-07-21 エルピーダメモリ株式会社 半導体集積回路装置の製造方法
JP2007250967A (ja) * 2006-03-17 2007-09-27 Tokyo Electron Ltd プラズマ処理装置および方法とフォーカスリング
US20070283884A1 (en) * 2006-05-30 2007-12-13 Applied Materials, Inc. Ring assembly for substrate processing chamber
US9245717B2 (en) * 2011-05-31 2016-01-26 Lam Research Corporation Gas distribution system for ceramic showerhead of plasma etch reactor
US8562785B2 (en) * 2011-05-31 2013-10-22 Lam Research Corporation Gas distribution showerhead for inductively coupled plasma etch reactor
US9236305B2 (en) * 2013-01-25 2016-01-12 Applied Materials, Inc. Wafer dicing with etch chamber shield ring for film frame wafer applications
KR101605721B1 (ko) * 2014-05-29 2016-03-23 세메스 주식회사 베이크 장치 및 기판 처리 장치
US9412753B2 (en) * 2014-09-30 2016-08-09 Sandisk Technologies Llc Multiheight electrically conductive via contacts for a multilevel interconnect structure
CN107112275B (zh) * 2014-12-19 2020-10-30 应用材料公司 用于基板处理腔室的边缘环
US10950477B2 (en) * 2015-08-07 2021-03-16 Applied Materials, Inc. Ceramic heater and esc with enhanced wafer edge performance
WO2017127233A1 (en) * 2016-01-20 2017-07-27 Applied Materials, Inc. Hybrid carbon hardmask for lateral hardmask recess reduction
KR102632725B1 (ko) * 2016-03-17 2024-02-05 에이에스엠 아이피 홀딩 비.브이. 기판 지지 플레이트 및 이를 포함하는 박막 증착 장치 및 박막 증착 방법
US10249495B2 (en) * 2016-06-28 2019-04-02 Applied Materials, Inc. Diamond like carbon layer formed by an electron beam plasma process

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