JPWO2019173171A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2019173171A5 JPWO2019173171A5 JP2020546104A JP2020546104A JPWO2019173171A5 JP WO2019173171 A5 JPWO2019173171 A5 JP WO2019173171A5 JP 2020546104 A JP2020546104 A JP 2020546104A JP 2020546104 A JP2020546104 A JP 2020546104A JP WO2019173171 A5 JPWO2019173171 A5 JP WO2019173171A5
- Authority
- JP
- Japan
- Prior art keywords
- overlay
- weighing
- weighing system
- tool
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005303 weighing Methods 0.000 claims 98
- 238000005259 measurement Methods 0.000 claims 52
- 230000003287 optical Effects 0.000 claims 34
- 239000002245 particle Substances 0.000 claims 13
- 238000001459 lithography Methods 0.000 claims 3
- 238000003384 imaging method Methods 0.000 claims 2
- 238000007689 inspection Methods 0.000 claims 2
- 238000010884 ion-beam technique Methods 0.000 claims 2
- 238000000926 separation method Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862638900P | 2018-03-05 | 2018-03-05 | |
US62/638,900 | 2018-03-05 | ||
US16/057,498 | 2018-08-07 | ||
US16/057,498 US10533848B2 (en) | 2018-03-05 | 2018-08-07 | Metrology and control of overlay and edge placement errors |
PCT/US2019/020471 WO2019173171A1 (en) | 2018-03-05 | 2019-03-04 | Metrology and control of overlay and edge placement errors |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021516366A JP2021516366A (ja) | 2021-07-01 |
JPWO2019173171A5 true JPWO2019173171A5 (zh) | 2022-03-10 |
JP7177846B2 JP7177846B2 (ja) | 2022-11-24 |
Family
ID=67768073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020546104A Active JP7177846B2 (ja) | 2018-03-05 | 2019-03-04 | オーバレイ及びエッジ配置誤差の計量及び制御 |
Country Status (9)
Country | Link |
---|---|
US (1) | US10533848B2 (zh) |
EP (1) | EP3762780B1 (zh) |
JP (1) | JP7177846B2 (zh) |
KR (1) | KR102450009B1 (zh) |
CN (1) | CN111801625B (zh) |
IL (1) | IL276811B2 (zh) |
SG (1) | SG11202008005WA (zh) |
TW (1) | TWI781298B (zh) |
WO (1) | WO2019173171A1 (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11353799B1 (en) | 2019-07-23 | 2022-06-07 | Kla Corporation | System and method for error reduction for metrology measurements |
US11360397B2 (en) | 2019-09-17 | 2022-06-14 | Kla Corporation | System and method for application of harmonic detectivity as a quality indicator for imaging-based overlay measurements |
EP3842866A1 (en) * | 2019-12-24 | 2021-06-30 | ASML Netherlands B.V. | Metrology method |
US11698251B2 (en) | 2020-01-07 | 2023-07-11 | Kla Corporation | Methods and systems for overlay measurement based on soft X-ray Scatterometry |
US11054753B1 (en) * | 2020-04-20 | 2021-07-06 | Applied Materials Israel Ltd. | Overlay monitoring |
US11353321B2 (en) | 2020-06-12 | 2022-06-07 | Kla Corporation | Metrology system and method for measuring diagonal diffraction-based overlay targets |
TWI788029B (zh) * | 2020-09-28 | 2022-12-21 | 荷蘭商Asml荷蘭公司 | 目標結構及相關聯之方法與裝置 |
TWI795798B (zh) * | 2021-06-02 | 2023-03-11 | 東龍投資股份有限公司 | 對準誤差補償方法及其系統 |
US11703767B2 (en) * | 2021-06-28 | 2023-07-18 | Kla Corporation | Overlay mark design for electron beam overlay |
US11862524B2 (en) * | 2021-06-28 | 2024-01-02 | Kla Corporation | Overlay mark design for electron beam overlay |
US11728192B2 (en) * | 2021-07-22 | 2023-08-15 | Globalfoundries U.S. Inc. | Refining defect detection using process window |
US11922619B2 (en) | 2022-03-31 | 2024-03-05 | Kla Corporation | Context-based defect inspection |
US20230314336A1 (en) | 2022-03-31 | 2023-10-05 | Kla Corporation | Multi-mode optical inspection |
WO2024052061A1 (en) * | 2022-09-08 | 2024-03-14 | Asml Netherlands B.V. | Measuring contrast and critical dimension using an alignment sensor |
US20240093985A1 (en) * | 2022-09-16 | 2024-03-21 | Kla Corporation | System and method for acquiring alignment measurements of structures of a bonded sample |
US20240119626A1 (en) * | 2022-09-27 | 2024-04-11 | Kla Corporation | Image pre-processing for overlay metrology using decomposition techniques |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5617340A (en) | 1994-04-28 | 1997-04-01 | The United States Of America As Represented By The Secretary Of Commerce | Method and reference standards for measuring overlay in multilayer structures, and for calibrating imaging equipment as used in semiconductor manufacturing |
US5757507A (en) * | 1995-11-20 | 1998-05-26 | International Business Machines Corporation | Method of measuring bias and edge overlay error for sub-0.5 micron ground rules |
US6484060B1 (en) | 2000-03-24 | 2002-11-19 | Micron Technology, Inc. | Layout for measurement of overlay error |
TW588414B (en) * | 2000-06-08 | 2004-05-21 | Toshiba Corp | Alignment method, overlap inspecting method and mask |
US7068833B1 (en) | 2000-08-30 | 2006-06-27 | Kla-Tencor Corporation | Overlay marks, methods of overlay mark design and methods of overlay measurements |
US6982793B1 (en) | 2002-04-04 | 2006-01-03 | Nanometrics Incorporated | Method and apparatus for using an alignment target with designed in offset |
TW200507229A (en) * | 2003-04-08 | 2005-02-16 | Aoti Operating Co Inc | Overlay metrology mark |
DE10345466A1 (de) | 2003-09-30 | 2005-04-28 | Infineon Technologies Ag | Verfahren zur Erfassung von Plazierungsfehlern von Schaltungsmustern bei der Übertragung mittels einer Maske in Schichten eines Substrats eines Halbleiterwafers |
US6937337B2 (en) | 2003-11-19 | 2005-08-30 | International Business Machines Corporation | Overlay target and measurement method using reference and sub-grids |
TW200538704A (en) * | 2004-05-21 | 2005-12-01 | Zetetic Inst | Apparatus and methods for overlay, alignment mark, and critical dimension metrologies based on optical interferometry |
KR20070033106A (ko) | 2005-09-20 | 2007-03-26 | 삼성전자주식회사 | 반도체 소자의 오버레이 측정 방법 및 오버레이 측정시스템 |
DE102007033815A1 (de) | 2007-05-25 | 2008-11-27 | Carl Zeiss Sms Gmbh | Verfahren und Vorrichtung zum Bestimmen der relativen Overlay-Verschiebung von übereinander liegenden Schichten |
DE102007046850B4 (de) | 2007-09-29 | 2014-05-22 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Verfahren zum Bestimmen einer Überlagerungsgenauigkeit |
US7879515B2 (en) | 2008-01-21 | 2011-02-01 | International Business Machines Corporation | Method to control semiconductor device overlay using post etch image metrology |
EP2694983B1 (en) * | 2011-04-06 | 2020-06-03 | KLA-Tencor Corporation | Method and system for providing a quality metric for improved process control |
US10107621B2 (en) * | 2012-02-15 | 2018-10-23 | Nanometrics Incorporated | Image based overlay measurement with finite gratings |
JP6002480B2 (ja) | 2012-07-06 | 2016-10-05 | 株式会社日立ハイテクノロジーズ | オーバーレイ誤差測定装置、及びパターン測定をコンピューターに実行させるコンピュータープログラム |
US9329033B2 (en) * | 2012-09-05 | 2016-05-03 | Kla-Tencor Corporation | Method for estimating and correcting misregistration target inaccuracy |
US9093458B2 (en) | 2012-09-06 | 2015-07-28 | Kla-Tencor Corporation | Device correlated metrology (DCM) for OVL with embedded SEM structure overlay targets |
TWI470378B (zh) | 2012-11-01 | 2015-01-21 | Ind Tech Res Inst | 量測堆疊對位誤差的方法與系統 |
KR102312241B1 (ko) | 2012-11-21 | 2021-10-13 | 케이엘에이 코포레이션 | 프로세스 호환 세그먼팅된 타겟들 및 설계 방법들 |
US9390492B2 (en) | 2013-03-14 | 2016-07-12 | Kla-Tencor Corporation | Method and system for reference-based overlay measurement |
US9201312B2 (en) | 2013-04-16 | 2015-12-01 | Kla-Tencor Corporation | Method for correcting position measurements for optical errors and method for determining mask writer errors |
WO2014194095A1 (en) * | 2013-05-30 | 2014-12-04 | Kla-Tencor Corporation | Combined imaging and scatterometry metrology |
US10152654B2 (en) * | 2014-02-20 | 2018-12-11 | Kla-Tencor Corporation | Signal response metrology for image based overlay measurements |
US10151986B2 (en) * | 2014-07-07 | 2018-12-11 | Kla-Tencor Corporation | Signal response metrology based on measurements of proxy structures |
CN106575630B (zh) * | 2014-07-13 | 2021-05-25 | 科磊股份有限公司 | 使用叠加及成品率关键图案的度量 |
KR102512180B1 (ko) * | 2015-04-28 | 2023-03-20 | 케이엘에이 코포레이션 | 계산 효율적인 x 선 기반의 오버레이 측정 |
US10018919B2 (en) * | 2016-05-29 | 2018-07-10 | Kla-Tencor Corporation | System and method for fabricating metrology targets oriented with an angle rotated with respect to device features |
EP3475972A4 (en) | 2016-06-27 | 2020-02-26 | KLA-Tencor Corporation | APPARATUS AND METHOD FOR MEASURING PATTERN PLACEMENT AND PATTERN SIZE, AND CORRESPONDING COMPUTER PROGRAM |
US10303153B2 (en) | 2016-08-04 | 2019-05-28 | Kla-Tencor Corporation | Method and computer program product for controlling the positioning of patterns on a substrate in a manufacturing process |
US10141156B2 (en) | 2016-09-27 | 2018-11-27 | Kla-Tencor Corporation | Measurement of overlay and edge placement errors with an electron beam column array |
US10565697B2 (en) | 2017-10-22 | 2020-02-18 | Kla-Tencor Corporation | Utilizing overlay misregistration error estimations in imaging overlay metrology |
-
2018
- 2018-08-07 US US16/057,498 patent/US10533848B2/en active Active
-
2019
- 2019-03-04 SG SG11202008005WA patent/SG11202008005WA/en unknown
- 2019-03-04 KR KR1020207028542A patent/KR102450009B1/ko active IP Right Grant
- 2019-03-04 CN CN201980016789.0A patent/CN111801625B/zh active Active
- 2019-03-04 EP EP19764334.9A patent/EP3762780B1/en active Active
- 2019-03-04 TW TW108107028A patent/TWI781298B/zh active
- 2019-03-04 JP JP2020546104A patent/JP7177846B2/ja active Active
- 2019-03-04 WO PCT/US2019/020471 patent/WO2019173171A1/en unknown
-
2020
- 2020-08-19 IL IL276811A patent/IL276811B2/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL276811B2 (en) | Metrology and control of coverage and end position errors | |
TWI673472B (zh) | 檢測裝置、檢測方法及製造方法 | |
JPWO2019173171A5 (zh) | ||
JP4839127B2 (ja) | 校正用標準部材及びこれを用いた校正方法および電子ビーム装置 | |
US11133148B2 (en) | Scanning electron microscope | |
KR20170093931A (ko) | 패턴 측정 장치 및 결함 검사 장치 | |
CN101169594B (zh) | 一种光刻机成像质量测量方法 | |
US10809631B2 (en) | Method of monitoring and device manufacturing method | |
JP2016021008A (ja) | マルチパターニング用マスクのパターン評価方法およびパターン評価装置 | |
US10684557B2 (en) | Method for adjusting actuation of a lithographic apparatus | |
JP4902806B2 (ja) | 校正用標準部材 | |
JP7339826B2 (ja) | マーク位置決定方法、リソグラフィー方法、物品製造方法、プログラムおよびリソグラフィー装置 | |
US10831107B2 (en) | Method for of measuring a parameter relating to a structure formed using a lithographic process | |
US9257262B2 (en) | Lithography apparatus, lithography method, and method of manufacturing article | |
KR20000076936A (ko) | 전자 빔 리소그라피 방법 및 그 제조장치 | |
CN113168112A (zh) | 测量与使用光刻过程形成的结构有关的聚焦参数的方法 | |
US10438771B2 (en) | Measurement device, calibration method of measurement device, and calibration member | |
US11662669B2 (en) | Apparatus and method for measuring substrate height | |
EP4060409A1 (en) | Novel interface definition for lithographic apparatus | |
US20040027553A1 (en) | Method for the characterization of an illumination source in an exposure apparatus | |
US20240111214A1 (en) | Novel interface definition for lithographic apparatus | |
EP3376290A1 (en) | Metrology method and method of device manufacture | |
KR20230104889A (ko) | 계측 시스템 및 리소그래피 시스템 | |
JP2002270494A (ja) | 位置検出方法および露光方法 | |
JP2020008762A (ja) | パターニング支援システム、パターニング方法、及びプログラム |