JPWO2019173171A5 - - Google Patents
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- JPWO2019173171A5 JPWO2019173171A5 JP2020546104A JP2020546104A JPWO2019173171A5 JP WO2019173171 A5 JPWO2019173171 A5 JP WO2019173171A5 JP 2020546104 A JP2020546104 A JP 2020546104A JP 2020546104 A JP2020546104 A JP 2020546104A JP WO2019173171 A5 JPWO2019173171 A5 JP WO2019173171A5
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- 238000005303 weighing Methods 0.000 claims 98
- 238000005259 measurement Methods 0.000 claims 52
- 230000003287 optical Effects 0.000 claims 34
- 239000002245 particle Substances 0.000 claims 13
- 238000001459 lithography Methods 0.000 claims 3
- 238000003384 imaging method Methods 0.000 claims 2
- 238000007689 inspection Methods 0.000 claims 2
- 238000010884 ion-beam technique Methods 0.000 claims 2
- 238000000926 separation method Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
Claims (42)
プログラム命令群を実行するよう構成された1個又は複数個のプロセッサを有するコントローラを備え、当該1個又は複数個のプロセッサが、
光可分解フィーチャ群及びデバイススケールフィーチャ群を有するハイブリッドオーバレイターゲットに関する光学ツール誤差調整値を、それら光可分解フィーチャに依拠した光学オーバレイ計測値と、それらデバイススケールフィーチャに依拠したデバイススケールオーバレイ計測値と、の間の差異を計測することで生成し、
そのハイブリッドオーバレイターゲットに関するターゲット対デバイス調整値を、デバイスエリアにおける諸フィーチャの位置に基づき生成し、
これら光学オーバレイ計測値、光学ツール誤差調整値及びターゲット対デバイス調整値のうち少なくとも一つに基づき、そのデバイスエリア内の一個所又は複数個所に関するデバイス関連オーバレイ計測値を求め、且つ
それらデバイス関連オーバレイ計測値に基づき、前記デバイスエリアに関するオーバレイコレクタブルをリソグラフィツールに供給することで、少なくとも1回の後続露出に関する露出条件を修正するよう、
それらプログラム命令が構成されている計量システム。 It ’s a weighing system.
A controller having one or more processors configured to execute a set of program instructions, the one or more processors.
Optical tool error adjustments for hybrid overlay targets with photodegradable features and device scale features, with optical overlay measurements based on those photoresolvable features and device scale overlay measurements based on those device scale features. Generated by measuring the difference between,
Generates target-to-device adjustments for that hybrid overlay target based on the location of features in the device area.
Based on at least one of these optical overlay measurement values, optical tool error adjustment values, and target-to-device adjustment values, device-related overlay measurement values for one or more locations within the device area are obtained, and those device-related overlay measurements are performed. Based on the value, the overlay collectable for the device area is supplied to the lithography tool to correct the exposure condition for at least one subsequent exposure.
A weighing system in which those program instructions are configured.
前記ハイブリッドオーバレイターゲットと前記デバイスエリア内の諸フィーチャとの間のパターン配置距離でありその標本の2個以上の層に関するものが含まれる、計量システム。 The weighing system according to claim 1, wherein the positions of various features in the device area for obtaining the target-to-device adjustment value.
A weighing system that includes a pattern placement distance between the hybrid overlay target and features in the device area, including for two or more layers of the sample.
前記標本を固持する並進ステージであり、そのハイブリッドオーバレイターゲットとそのデバイスエリア内の諸デバイススケールフィーチャとの間の分離間隔に少なくとも等しい可動域を有する並進ステージと、
撮像システムと、
を備えるエッジ配置計量ツールから受け取ったパターン配置距離であり、前記並進ステージにより計測された前記ハイブリッドオーバレイターゲット・前記デバイススケールフィーチャ間の距離が含まれるものである計量システム。 The weighing system according to claim 2, wherein the pattern placement distance between the hybrid overlay target and various features in the device area is determined.
A translational stage that holds the sample and has a range of motion that is at least equal to the separation interval between its hybrid overlay target and the device scale features within its device area.
Imaging system and
A weighing system that is a pattern placement distance received from an edge placement weighing tool comprising the distance between the hybrid overlay target and the device scale feature measured by the translational stage.
そのデバイスエリアにおけるオーバレイ計測値が含まれる計量システム。 The weighing system according to claim 1, wherein the positions of various features in the device area for obtaining the target-to-device adjustment value.
A weighing system that contains overlay measurements in that device area.
そのデバイスエリア内の諸デバイスフィーチャのオーバレイ計測値が含まれる計量システム。 The weighing system according to claim 5, wherein the overlay measurement value in the device area is used.
A weighing system that contains overlay measurements of various device features within that device area.
そのデバイスエリア内の諸デバイススケールオーバレイターゲットのオーバレイ計測値が含まれる計量システム。 The weighing system according to claim 5, wherein the overlay measurement value in the device area is used.
A weighing system that contains overlay measurements of various device scale overlay targets within that device area.
走査型電子顕微鏡計量ツールを備える計量システム。 The particle beam weighing tool according to claim 13, wherein the particle beam weighing tool is used.
Weighing system with scanning electron microscope weighing tool.
限界寸法走査型電子顕微鏡を備える計量システム。 The weighing system according to claim 14, wherein the scanning electron microscope weighing tool is used.
Weighing system with marginal dimension scanning electron microscope.
集束イオンビーム式計量ツールを備える計量システム。 The particle beam weighing tool according to claim 13, wherein the particle beam weighing tool is used.
Weighing system with focused ion beam weighing tool.
現像後検査データを含む計量システム。 The weighing system according to claim 1, which is an optical overlay measurement value of the hybrid overlay target, a device scale overlay measurement value of the hybrid overlay target, and a measurement value of the positions of various features in the device area, and is a target pair. At least one of the things to find the device adjustment value is
Weighing system containing post-development inspection data.
エッチング後検査データを含む計量システム。 The weighing system according to claim 1, which is an optical overlay measurement value of the hybrid overlay target, a device scale overlay measurement value of the hybrid overlay target, and a measurement value of the positions of various features in the device area, and is the target pair. At least one of the things to find the device adjustment value is
Weighing system containing post-etching inspection data.
そのハイブリッドオーバレイターゲットのデバイススケールフィーチャ群に依拠しデバイススケールオーバレイ計測値を生成するよう構成された粒子ビーム式計量ツールと、
そのハイブリッドオーバレイターゲットを基準として前記標本のデバイスエリアにおける諸フィーチャの位置を計測するよう構成されたエッジ配置計量ツールと、
前記光学計量ツール及び前記粒子ビーム式計量ツールに可通信結合されたコントローラと、
を備え、そのコントローラが、プログラム命令群を実行するよう構成された1個又は複数個のプロセッサを有し、当該1個又は複数個のプロセッサが、
前記光学計量ツールにより得られた前記光学オーバレイ計測値と、前記粒子ビーム式計量ツールにより得られた前記デバイススケールオーバレイ計測値と、の間の差異に基づき、前記ハイブリッドオーバレイターゲットに関する光学ツール誤差調整値を生成し、
そのハイブリッドオーバレイターゲットに関するターゲット対デバイス調整値を、前記デバイスエリアにおける諸フィーチャの位置であり前記エッジ配置計量ツールにより得られたものに基づき生成し、
そのデバイスエリア内の一個所又は複数個所に関するデバイス関連オーバレイ計測値を、前記光学オーバレイ計測値、前記光学ツール誤差調整値及び前記ターゲット対デバイス調整値のうち少なくとも一つに基づいて求め、且つ
それらデバイス関連オーバレイ計測値に基づき、そのデバイスエリアに関するオーバレイコレクタブルをリソグラフィツールに供給することで、少なくとも1回の後続露出に関する露出条件を修正するよう、
それらプログラム命令が構成されている計量システム。 An optical weighing tool configured to rely on the photoresolvable features of a hybrid overlay target on a specimen to generate optical overlay measurements, and
A particle beam weighing tool configured to rely on the device scale features of its hybrid overlay target to generate device scale overlay measurements.
An edge placement weighing tool configured to measure the position of features in the device area of the sample relative to the hybrid overlay target.
A controller communicatively coupled to the optical weighing tool and the particle beam weighing tool,
The controller comprises one or more processors configured to execute a set of program instructions, said one or more processors.
Optical tool error adjustment value for the hybrid overlay target based on the difference between the optical overlay measurement value obtained by the optical weighing tool and the device scale overlay measurement value obtained by the particle beam type weighing tool. To generate,
Target-to-device adjustment values for the hybrid overlay target are generated based on the positions of the features in the device area and obtained by the edge placement weighing tool.
Device-related overlay measurements for one or more locations within the device area are obtained based on at least one of the optical overlay measurements, the optical tool error adjustments, and the target-to-device adjustments, and the devices. Correct the exposure condition for at least one subsequent exposure by supplying the lithography tool with an overlay collectable for that device area based on the relevant overlay measurements.
A weighing system in which those program instructions are configured.
前記ハイブリッドオーバレイターゲットと前記デバイスエリア内の諸フィーチャとの間のパターン配置距離でありその標本の2個以上の層に関するものが含まれる、計量システム。 The weighing system according to claim 26, which is the position of various features in the device area for obtaining the target-to-device adjustment value.
A weighing system that includes a pattern placement distance between the hybrid overlay target and features in the device area, including for two or more layers of the sample.
前記標本を固持する並進ステージであり、前記ハイブリッドオーバレイターゲットと前記デバイスエリア内の諸デバイススケールフィーチャとの間の分離間隔に少なくとも等しい可動域を有する並進ステージと、
撮像システムと、
を備え、前記パターン配置距離に、この並進ステージにより計測された前記ハイブリッドオーバレイターゲット・前記デバイススケールフィーチャ間の距離が含まれる計量システム。 The weighing system according to claim 27, wherein the edge placement weighing tool is used.
A translational stage that holds the specimen and has a range of motion that is at least equal to the separation interval between the hybrid overlay target and the device scale features within the device area.
Imaging system and
A weighing system comprising: The pattern placement distance includes the distance between the hybrid overlay target and the device scale feature measured by the translational stage.
前記デバイスエリアにおけるオーバレイ計測値であり光学計量ツール及び粒子ビーム式計量ツールのうち少なくとも一方を用い計測されたものが含まれる計量システム。 The weighing system according to claim 26, further comprising the position of features in the device area for obtaining the target-to-device adjustment value.
A weighing system that includes overlay measurements in the device area that are measured using at least one of an optical weighing tool and a particle beam weighing tool.
前記デバイスエリア内の諸デバイスフィーチャのオーバレイ計測値が含まれる計量システム。 The weighing system according to claim 30, wherein the overlay measurement value in the device area is used.
A weighing system that includes overlay measurements of various device features within the device area.
前記デバイスエリア内の諸デバイススケールオーバレイターゲットのオーバレイ計測値が含まれる計量システム。 The weighing system according to claim 30, wherein the overlay measurement value in the device area is used.
A weighing system that includes overlay measurements of various device scale overlay targets within the device area.
走査型電子顕微鏡計量ツールを備える計量システム。 The measuring system according to claim 26, wherein the particle beam type measuring tool is used.
Weighing system with scanning electron microscope weighing tool.
限界寸法走査型電子顕微鏡を備える計量システム。 The weighing system according to claim 37, wherein the scanning electron microscope weighing tool is used.
Weighing system with marginal dimension scanning electron microscope.
集束イオンビーム式計量ツールを備える計量システム。 The measuring system according to claim 26, wherein the particle beam type measuring tool is used.
Weighing system with focused ion beam weighing tool.
そのハイブリッドオーバレイターゲットのデバイススケールオーバレイを、そのハイブリッドオーバレイターゲットのデバイススケール要素群に依拠して計測するステップと、
それら光学オーバレイ・デバイススケールオーバレイ間の差異に基づき、そのハイブリッドオーバレイターゲットに関する光学ツール誤差調整値を決めるステップと、
そのハイブリッドオーバレイターゲットを基準として、デバイスエリア内の1個又は複数個のフィーチャに関するターゲット対デバイス配置誤差を計測するステップと、
それらターゲット対デバイス配置誤差に基づき、そのデバイスエリアに関する1個又は複数個のターゲット対デバイス調整値を生成するステップと、
そのデバイスエリア内の1個又は複数個の位置に関するデバイス関連オーバレイ計測値を、前記光学オーバレイ、前記光学ツール誤差調整値及び前記ターゲット対デバイス調整値に基づいて求めるステップと、
それらデバイス関連オーバレイ計測値に基づき、そのデバイスエリアに関するオーバレイコレクタブルをリソグラフィツールに供給することで、少なくとも1個の後続標本に関する露出条件を修正するステップと、
を有する計量方法。 A step to measure the optical overlay of a hybrid overlay target on a specimen by relying on the photodegradable elements of the hybrid overlay target.
The steps to measure the device scale overlay of the hybrid overlay target depending on the device scale elements of the hybrid overlay target, and
Based on the differences between these optical overlays and device scale overlays, the steps to determine the optical tool error adjustment values for the hybrid overlay target, and
A step of measuring the target-to-device placement error for one or more features in the device area relative to the hybrid overlay target.
A step of generating one or more target-to-device adjustment values for the device area based on those target-to-device placement errors.
A step of obtaining device-related overlay measurements for one or more positions within the device area based on the optical overlay, the optical tool error adjustment value, and the target-to-device adjustment value.
Steps to modify the exposure conditions for at least one subsequent sample by supplying the lithography tool with overlay collectables for that device area based on those device-related overlay measurements.
Weighing method with.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US201862638900P | 2018-03-05 | 2018-03-05 | |
US62/638,900 | 2018-03-05 | ||
US16/057,498 | 2018-08-07 | ||
US16/057,498 US10533848B2 (en) | 2018-03-05 | 2018-08-07 | Metrology and control of overlay and edge placement errors |
PCT/US2019/020471 WO2019173171A1 (en) | 2018-03-05 | 2019-03-04 | Metrology and control of overlay and edge placement errors |
Publications (3)
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JP2021516366A JP2021516366A (en) | 2021-07-01 |
JPWO2019173171A5 true JPWO2019173171A5 (en) | 2022-03-10 |
JP7177846B2 JP7177846B2 (en) | 2022-11-24 |
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JP2020546104A Active JP7177846B2 (en) | 2018-03-05 | 2019-03-04 | Quantification and control of overlay and edge placement errors |
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US (1) | US10533848B2 (en) |
EP (1) | EP3762780B1 (en) |
JP (1) | JP7177846B2 (en) |
KR (1) | KR102450009B1 (en) |
CN (1) | CN111801625B (en) |
IL (1) | IL276811B2 (en) |
SG (1) | SG11202008005WA (en) |
TW (1) | TWI781298B (en) |
WO (1) | WO2019173171A1 (en) |
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2018
- 2018-08-07 US US16/057,498 patent/US10533848B2/en active Active
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2019
- 2019-03-04 JP JP2020546104A patent/JP7177846B2/en active Active
- 2019-03-04 SG SG11202008005WA patent/SG11202008005WA/en unknown
- 2019-03-04 EP EP19764334.9A patent/EP3762780B1/en active Active
- 2019-03-04 TW TW108107028A patent/TWI781298B/en active
- 2019-03-04 CN CN201980016789.0A patent/CN111801625B/en active Active
- 2019-03-04 WO PCT/US2019/020471 patent/WO2019173171A1/en unknown
- 2019-03-04 KR KR1020207028542A patent/KR102450009B1/en active IP Right Grant
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2020
- 2020-08-19 IL IL276811A patent/IL276811B2/en unknown
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