JPWO2018199254A1 - 中空封止構造体 - Google Patents

中空封止構造体 Download PDF

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Publication number
JPWO2018199254A1
JPWO2018199254A1 JP2019514634A JP2019514634A JPWO2018199254A1 JP WO2018199254 A1 JPWO2018199254 A1 JP WO2018199254A1 JP 2019514634 A JP2019514634 A JP 2019514634A JP 2019514634 A JP2019514634 A JP 2019514634A JP WO2018199254 A1 JPWO2018199254 A1 JP WO2018199254A1
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JP
Japan
Prior art keywords
electronic component
substrate
sealing portion
sealing
hollow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019514634A
Other languages
English (en)
Japanese (ja)
Inventor
裕介 渡瀬
裕介 渡瀬
野村　豊
豊 野村
紘之 石毛
紘之 石毛
鈴木　雅彦
雅彦 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2018199254A1 publication Critical patent/JPWO2018199254A1/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2019514634A 2017-04-28 2018-04-26 中空封止構造体 Pending JPWO2018199254A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017089949 2017-04-28
JP2017089949 2017-04-28
PCT/JP2018/017042 WO2018199254A1 (fr) 2017-04-28 2018-04-26 Structure d'étanchéité creuse

Publications (1)

Publication Number Publication Date
JPWO2018199254A1 true JPWO2018199254A1 (ja) 2020-03-12

Family

ID=63920106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019514634A Pending JPWO2018199254A1 (ja) 2017-04-28 2018-04-26 中空封止構造体

Country Status (6)

Country Link
JP (1) JPWO2018199254A1 (fr)
KR (1) KR20200002883A (fr)
CN (1) CN110574155A (fr)
SG (1) SG11201909972TA (fr)
TW (1) TWI756415B (fr)
WO (1) WO2018199254A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102486856B1 (ko) * 2017-04-28 2023-01-09 쇼와덴코머티리얼즈가부시끼가이샤 봉지용 필름, 봉지 구조체 및 봉지 구조체의 제조 방법
TWI774184B (zh) * 2020-03-18 2022-08-11 日商日本航空電子工業股份有限公司 可薄型化半導體裝置及其製造方法
JP2022028180A (ja) 2020-08-03 2022-02-16 日本航空電子工業株式会社 デバイス及びデバイスの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005130412A (ja) * 2003-10-27 2005-05-19 Toyo Commun Equip Co Ltd 圧電デバイスとその製造方法
JP2014209567A (ja) * 2013-03-28 2014-11-06 日東電工株式会社 中空封止用樹脂シート及び中空パッケージの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109831A (ja) * 2005-10-13 2007-04-26 Towa Corp 電子部品の樹脂封止成形方法
JP6883937B2 (ja) 2015-03-19 2021-06-09 日東電工株式会社 封止用シートおよび中空パッケージの製造方法
JP6620989B2 (ja) * 2015-05-25 2019-12-18 パナソニックＩｐマネジメント株式会社 電子部品パッケージ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005130412A (ja) * 2003-10-27 2005-05-19 Toyo Commun Equip Co Ltd 圧電デバイスとその製造方法
JP2014209567A (ja) * 2013-03-28 2014-11-06 日東電工株式会社 中空封止用樹脂シート及び中空パッケージの製造方法

Also Published As

Publication number Publication date
CN110574155A (zh) 2019-12-13
KR20200002883A (ko) 2020-01-08
WO2018199254A1 (fr) 2018-11-01
TWI756415B (zh) 2022-03-01
SG11201909972TA (en) 2019-11-28
TW201843777A (zh) 2018-12-16

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