JPWO2018168400A1 - 炭化ケイ素系複合体の製造方法 - Google Patents
炭化ケイ素系複合体の製造方法 Download PDFInfo
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- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 74
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 239000002131 composite material Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 50
- 239000011159 matrix material Substances 0.000 claims abstract description 24
- 238000009835 boiling Methods 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 10
- 239000004917 carbon fiber Substances 0.000 claims abstract description 10
- 229920001558 organosilicon polymer Polymers 0.000 claims abstract description 10
- 229920003257 polycarbosilane Polymers 0.000 claims abstract description 10
- 239000011184 SiC–SiC matrix composite Substances 0.000 claims abstract description 9
- 239000000835 fiber Substances 0.000 claims abstract description 9
- 229920000548 poly(silane) polymer Polymers 0.000 claims abstract description 9
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- 238000004458 analytical method Methods 0.000 description 14
- 239000005055 methyl trichlorosilane Substances 0.000 description 11
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 239000000460 chlorine Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000002994 raw material Substances 0.000 description 9
- 238000005262 decarbonization Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000007168 polymer infiltration and pyrolysis Methods 0.000 description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000005481 NMR spectroscopy Methods 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- INFDPOAKFNIJBF-UHFFFAOYSA-N paraquat Chemical compound C1=C[N+](C)=CC=C1C1=CC=[N+](C)C=C1 INFDPOAKFNIJBF-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 238000004453 electron probe microanalysis Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920000555 poly(dimethylsilanediyl) polymer Polymers 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
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- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000005133 29Si NMR spectroscopy Methods 0.000 description 1
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910008045 Si-Si Inorganic materials 0.000 description 1
- 229910003923 SiC 4 Inorganic materials 0.000 description 1
- 229910006411 Si—Si Inorganic materials 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-YPZZEJLDSA-N carbane Chemical compound [10CH4] VNWKTOKETHGBQD-YPZZEJLDSA-N 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
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- 239000000446 fuel Substances 0.000 description 1
- 238000005087 graphitization Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000012844 infrared spectroscopy analysis Methods 0.000 description 1
- 239000012705 liquid precursor Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
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- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
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Abstract
Description
また、MTSが塩素を含み反応排気ガスに塩化水素(HCl)が含まれるので、設備が腐食されて老朽化し易く、これを回避するために、頻繁な中和処理や排ガス処理設備が必要となり、運転コストや設備コストが増大するという問題もあった。
また、MI法は、工期が短く比較的製造処理も簡便であるが、金属Siと炭素繊維、炭化ケイ素繊維との反応を抑えるのが難しい。繊維強度を保持するには、予め高コストのCVI処理を施しておく必要がある。
塩素を含まないポリシラン骨格及び/又はポリカルボシラン骨格を有する有機ケイ素ポリマーを用い、膜沸騰法を行うことを特徴とする。
これに対し、この過剰量のCは脱炭素処理により低減可能であり、例えば、脱炭素処理によりSi:C比率=1:1.08程度まで低減できる。
上述のように、本発明の炭化ケイ素系複合体の製造方法は、C/SiC複合体又はSiC/SiC複合体を製造する方法であって、塩素を含まないポリシラン骨格及び/又はポリカルボシラン骨格を有する有機ケイ素ポリマー(LPS)を用い、FB法を行う。
ここで、LPSの代表例としては、ポリジメチルシラン(PDMS)を挙げることができ、これらは−SiMe2−(Me:−CH3)単位が50個程度つながったポリマーである。
平均分子量は分析結果より400程度と考えられることから、図1の式中のm5〜6程度であり、低分子量であるため室温で液体である。よって、このポリマーをLPS(liquid polysilanes)と称することができる。
このポリマーの末端には、おそらく他のポリシラン中のメチル基から水素を引き抜くなどしてSi−H結合が生成している。これ以下の分子量のポリシランは蒸気圧が高く、反応系外へ気体として揮散する。この分解で生成する低分子量物を、直ちに系外に蒸留操作で分離したものがLPSである。
構造式は、H(SiMe2)5〜6H(但し、Meはメチル基を示す)と表すことができるが、分子量に分布があるため厳密ではない。
図2にLPSの分子量分布を示す。平均分子量は、ポリスチレン換算で400程度と推定された。分子量は133〜3437の範囲にある。
図3にLPSの赤外線吸収スペクトルを示す。LPSは、図3に示す構造を持つ有機ケイ素ポリマーであることが分かる。
図4にLPSの29−Si−NMRによる分子構造分析結果を示す。
赤外分光分析及び29−Si−NMR分析結果からは、主に29Si−NMRでSi原子が7個ぐらいで構成される分子で、構造単位の比がSiC4:SiC3H:SiC3Si=1:3.31:1.08が妥当なところと推定される。このことは、FT−IR他の分析結果ともさほど矛盾しない。
MTS(メチルトリクロロシラン)を原料として形成されたSiCマトリックスに塩素(Cl)が残存するか否かは、SIMS分析で確認することができる。
図5にSIMS分析の結果を示す。図5に示したように、SIMS分析によりClが検出された。よって、MTSを原料に用いるとSiCマトリックス内にClが残存することが分かる。よって、MTSを原料にするとClが残存するため、LPSを原料としたSiCマトリックスと判別できる。
また、上述のようにSMP−10をFB法に適用することは困難なので、炭素繊維や炭化ケイ素繊維周りに形成するSiCマトリックス用原料としては、LPSが好適であることが明らかである。
なお、ポリカルボシラン骨格を有するCVD−742、CVD−4000、CVD−2000はFB法に適用可能な処理剤である。
膜沸騰(FB)は化学工学分野では伝熱に関する問題として取り扱われる現象である。
図6は、固液界面での伝熱による膜沸騰現象の変化を熱流束(固相から液相への単位面積当たりの伝熱量)と表面過熱度(固相/液相界面の温度差)との関係で表した膜沸騰曲線の模式図である。
C/C化プロセスに膜沸騰現象を利用する場合、炭素繊維と液相(処理溶液:シクロヘキサン等の炭化水素系溶媒)の界面が均一に沸騰蒸気膜で覆われ、高濃度蒸気の熱分解によって炭素マトリックスが析出していく.液中のために連続的に高濃度蒸気膜が生成されることから、緻密化が高速で進行していく。
FB法の特徴として、以下の知見が得られている。
(1)緻密化の進行が速くプロセス時間がCVI法の1/50程度である。
(2)原料使用量をCVI法の1/10程度に削減できる。
(3)繊維とマトリックスの結合が強固である。
(4)得られる炭素マトリックスがCVI炭素マトリックスと同質である。
(5)マトリックス生成速度は、温度が高いほど、圧力が高いほど速まる。
(6)マトリックス生成速度は、炭素含有率が高く乖離エネルギーが低い溶媒の方が速まる。
まず第一に、脱炭素処理がどの程度進んでいるのかを知るには、残存しているC成分量を正確に把握する必要がある。一般的には、EPMA分析で成分量を把握できると言われているが、この方法ではC成分量を正確に把握することは難しい。
そこで、本発明では、炭素(C)、水素(H)、酸素(O)及びケイ素(Si)の含有量を表1に示す手法で分析する。
脱炭素処理はPCS(有機セラミックスポリマー)がSiCセラミックス化する過程で行われることから、このセラミックス化過程での焼成条件を変えることで、脱炭素挙動を確認する。
ディスク形状のC/SiC複合体を、図7に示す工程フローに従って製造した。
すなわち、まず、日本バイリーン社製のフェルトを使用してディスク形状のプリフォームを形成した。この際、当該フェルトはPAN系炭素繊維(HTA)をベースに90質量%炭素繊維と10質量%アクリル繊維で構成されるものであり、Vfは約10%である。
次に、成型を行った。Vf30%となるまでボルト締めして成型を行い、成型寸法φ100(外径)、φ30(孔径)×25t(厚み)の孔開きディスク状の成型体を得た。
X線CT画像からは全体の密度は低いものの均質であることが分かった。
また、図11に示したX線回折より、SiC結合を示す高いピークが確認でき、図12に示したEPMA分析より、SiCの化学量論比に対してC量が過剰であることも分かった。
Claims (3)
- 炭素繊維強化/炭化ケイ素複合体(C/SiC複合体)又は炭化ケイ素繊維強化/炭化ケイ素複合体(SiC/SiC複合体)から成る炭化ケイ素系複合体を製造するに当たり、
塩素を含まないポリシラン骨格及び/又はポリカルボシラン骨格を有する有機ケイ素ポリマーを用い、膜沸騰法を行うことを特徴とする炭化ケイ素系複合体の製造方法。 - 上記有機ケイ素ポリマーが、室温で液体状であることを特徴とする請求項1に記載の炭化ケイ素系複合体の製造方法。
- 上記C/SiC複合体又は上記SiC/SiC複合体のマトリックスにおけるSiとCとの組成比(モル比)が、Si:C=1:1.08〜1:1.43であることを特徴とする請求項1又は2に記載の炭化ケイ素系複合体の製造方法。
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