JPWO2018025637A1 - 真空蒸着装置 - Google Patents
真空蒸着装置 Download PDFInfo
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- JPWO2018025637A1 JPWO2018025637A1 JP2018531821A JP2018531821A JPWO2018025637A1 JP WO2018025637 A1 JPWO2018025637 A1 JP WO2018025637A1 JP 2018531821 A JP2018531821 A JP 2018531821A JP 2018531821 A JP2018531821 A JP 2018531821A JP WO2018025637 A1 JPWO2018025637 A1 JP WO2018025637A1
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- 238000001771 vacuum deposition Methods 0.000 title claims description 12
- 238000007740 vapor deposition Methods 0.000 claims abstract description 81
- 239000000463 material Substances 0.000 claims abstract description 48
- 238000000151 deposition Methods 0.000 claims abstract description 20
- 230000008021 deposition Effects 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 31
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 69
- 230000000694 effects Effects 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 50
- 238000007738 vacuum evaporation Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
真空チャンバ1内に配置される蒸着源3と蒸着源に対して基板Sを一方向に相対移動させる移動手段とマスク材4とを備える。蒸着源と基板との相対移動方向をX軸方向、基板の幅方向をY軸方向とし、蒸着源の収容箱31に、噴出ノズル32がY軸方向に所定の間隔で列設される。Y軸方向両端に夫々位置する噴出ノズル相互の間の間隔が、噴出ノズルと被成膜物との距離NSに応じて基板の幅Wsより短く設定される。Y軸方向中央領域に位置する各噴出ノズルを主ノズル32m、それよりY軸方向各側の外方に位置する噴出ノズルを副ノズル32sとして、主ノズルのノズル孔が基板Sに交差する孔軸33を持ち、副ノズルのノズル孔が、主ノズルの孔軸に対してY軸方向外方に傾いた孔軸34を持つ。
Description
Claims (4)
- 真空チャンバ内に配置される蒸着源と、この蒸着源に対して被成膜物を真空チャンバ内の一方向に相対移動させる移動手段とを備え、蒸着源と被成膜物との間に介在されて蒸着源で蒸発させた蒸着物質の被成膜物に対する付着範囲を制限するマスク材を更に有する真空蒸着装置であって、
蒸着源に対する被成膜物の相対移動方向をX軸方向、X軸方向に直交する被成膜物の幅方向をY軸方向として、蒸着源が蒸着物質を収容する収容箱を有し、この収容箱の被成膜物との対向面に、昇華または気化させた蒸発物質の噴出ノズルがY軸方向に所定の間隔で列設されるものにおいて、
Y軸方向両端に夫々位置する噴出ノズル相互の間の間隔が、噴出ノズルの先端と被成膜物との間の距離に応じて被成膜物の幅より短く設定され、
収容箱の対向面のY軸方向中央領域に位置する各噴出ノズルを主ノズル、当該中央領域よりY軸方向各側の外方に位置する少なくとも1個の噴出ノズルを副ノズルとして、主ノズルのノズル孔が被成膜物に交差する孔軸を持つと共に、副ノズルのノズル孔が、主ノズルの孔軸に対してY軸方向外方に傾いた孔軸を持つことを特徴とする真空蒸着装置。 - 前記副ノズルのノズル孔の孔径を前記主ノズルのノズル孔の孔径より大きくしたことを特徴とする請求項1記載の真空蒸着装置。
- 請求項2記載の真空蒸着装置であって、前記Y軸方向中央領域よりY軸方向各側の外方に前記副ノズルが複数設けられているものにおいて、
副ノズルのノズル孔の孔径をY軸方向外方に向かうに従い大きくしたことを特徴とする真空蒸着装置。 - 請求項1または請求項3記載の真空蒸着装置であって、前記Y軸方向中央領域よりY軸方向各側の外方に前記副ノズルが複数設けられているものにおいて、
副ノズル相互の間隔を主ノズル相互の間隔より短くしたことを特徴とする真空蒸着装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016152340 | 2016-08-02 | ||
JP2016152340 | 2016-08-02 | ||
PCT/JP2017/026065 WO2018025637A1 (ja) | 2016-08-02 | 2017-07-19 | 真空蒸着装置 |
Publications (2)
Publication Number | Publication Date |
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JPWO2018025637A1 true JPWO2018025637A1 (ja) | 2018-10-18 |
JP6620244B2 JP6620244B2 (ja) | 2019-12-11 |
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JP2018531821A Active JP6620244B2 (ja) | 2016-08-02 | 2017-07-19 | 真空蒸着装置 |
Country Status (5)
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JP (1) | JP6620244B2 (ja) |
KR (1) | KR102155099B1 (ja) |
CN (1) | CN109328244B (ja) |
TW (1) | TW201814771A (ja) |
WO (1) | WO2018025637A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7297449B2 (ja) * | 2019-01-10 | 2023-06-26 | 株式会社アルバック | 蒸着装置及びノズル用アダプタ |
WO2020144894A1 (ja) | 2019-01-10 | 2020-07-16 | 株式会社アルバック | 蒸着装置 |
JP2020132985A (ja) * | 2019-02-25 | 2020-08-31 | 株式会社アルバック | 真空処理装置及び真空処理方法 |
CN109868452B (zh) * | 2019-03-19 | 2021-01-01 | 武汉华星光电半导体显示技术有限公司 | 冷却板和真空蒸镀装置 |
WO2020213228A1 (ja) | 2019-04-19 | 2020-10-22 | 株式会社アルバック | 蒸着源及び蒸着装置 |
KR102569822B1 (ko) * | 2021-02-09 | 2023-08-23 | 주식회사 야스 | 플럭스 조절 가능한 노즐을 구비한 증발원 |
CN114318237A (zh) * | 2021-12-29 | 2022-04-12 | 武汉华星光电半导体显示技术有限公司 | 一种蒸镀装置 |
Citations (8)
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JP2006152441A (ja) * | 2004-12-01 | 2006-06-15 | Samsung Sdi Co Ltd | 蒸着ソースおよびそれを備えた蒸着装置 |
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US20140106482A1 (en) * | 2012-10-12 | 2014-04-17 | Sang-Shin Lee | Depositing apparatus and method for manufacturing organic light emitting diode display using the same |
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JP2014201834A (ja) * | 2013-04-01 | 2014-10-27 | 上海和輝光電有限公司Everdisplay Optronics (Shanghai) Limited | 単点リニア蒸発源システム |
KR20150118691A (ko) * | 2014-04-15 | 2015-10-23 | 엘지전자 주식회사 | 증착물질 공급 장치 및 이를 구비한 증착 장치 |
JP2016125091A (ja) * | 2014-12-26 | 2016-07-11 | キヤノントッキ株式会社 | 真空蒸着装置 |
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US20030168013A1 (en) * | 2002-03-08 | 2003-09-11 | Eastman Kodak Company | Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device |
JP5346239B2 (ja) | 2009-05-21 | 2013-11-20 | 株式会社アルバック | 真空蒸着装置 |
KR20120061394A (ko) * | 2010-12-03 | 2012-06-13 | 삼성모바일디스플레이주식회사 | 증발원 및 유기물 증착 방법 |
KR102046440B1 (ko) * | 2012-10-09 | 2019-11-20 | 삼성디스플레이 주식회사 | 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법 |
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2017
- 2017-07-19 JP JP2018531821A patent/JP6620244B2/ja active Active
- 2017-07-19 WO PCT/JP2017/026065 patent/WO2018025637A1/ja active Application Filing
- 2017-07-19 CN CN201780038523.7A patent/CN109328244B/zh active Active
- 2017-07-19 KR KR1020187033456A patent/KR102155099B1/ko active IP Right Grant
- 2017-07-28 TW TW106125454A patent/TW201814771A/zh unknown
Patent Citations (8)
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JP2008518094A (ja) * | 2004-10-25 | 2008-05-29 | イーストマン コダック カンパニー | 複数の開口部を有する蒸着源 |
JP2006152441A (ja) * | 2004-12-01 | 2006-06-15 | Samsung Sdi Co Ltd | 蒸着ソースおよびそれを備えた蒸着装置 |
KR20060101987A (ko) * | 2005-03-22 | 2006-09-27 | 세메스 주식회사 | 유기전계 발광 소자 제조에 사용되는 유기 박박 증착 장치 |
US20140106482A1 (en) * | 2012-10-12 | 2014-04-17 | Sang-Shin Lee | Depositing apparatus and method for manufacturing organic light emitting diode display using the same |
JP2014201833A (ja) * | 2013-04-01 | 2014-10-27 | 上海和輝光電有限公司Everdisplay Optronics (Shanghai) Limited | 蒸発源アセンブリ |
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JP2016125091A (ja) * | 2014-12-26 | 2016-07-11 | キヤノントッキ株式会社 | 真空蒸着装置 |
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Publication number | Publication date |
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KR20180129960A (ko) | 2018-12-05 |
CN109328244A (zh) | 2019-02-12 |
JP6620244B2 (ja) | 2019-12-11 |
KR102155099B1 (ko) | 2020-09-11 |
TW201814771A (zh) | 2018-04-16 |
WO2018025637A1 (ja) | 2018-02-08 |
CN109328244B (zh) | 2021-06-22 |
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