JPWO2016129700A1 - 硬質研磨対象物における凹面の研磨方法 - Google Patents
硬質研磨対象物における凹面の研磨方法 Download PDFInfo
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- JPWO2016129700A1 JPWO2016129700A1 JP2016574878A JP2016574878A JPWO2016129700A1 JP WO2016129700 A1 JPWO2016129700 A1 JP WO2016129700A1 JP 2016574878 A JP2016574878 A JP 2016574878A JP 2016574878 A JP2016574878 A JP 2016574878A JP WO2016129700 A1 JPWO2016129700 A1 JP WO2016129700A1
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- Prior art keywords
- polishing
- space
- abrasive
- instrument
- recessed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 title claims description 138
- 238000000034 method Methods 0.000 title claims description 43
- 239000000463 material Substances 0.000 claims abstract description 46
- 230000003746 surface roughness Effects 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims description 6
- 239000003082 abrasive agent Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000012535 impurity Substances 0.000 abstract description 7
- 229910052594 sapphire Inorganic materials 0.000 description 22
- 239000010980 sapphire Substances 0.000 description 22
- 239000011521 glass Substances 0.000 description 20
- 239000004570 mortar (masonry) Substances 0.000 description 20
- 239000006061 abrasive grain Substances 0.000 description 14
- 238000010298 pulverizing process Methods 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 238000011109 contamination Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 9
- 238000000227 grinding Methods 0.000 description 8
- 238000003754 machining Methods 0.000 description 8
- 229910052500 inorganic mineral Inorganic materials 0.000 description 6
- 239000011707 mineral Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 241000894006 Bacteria Species 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910052571 earthenware Inorganic materials 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C19/00—Other disintegrating devices or methods
- B02C19/08—Pestle and mortar
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Food Science & Technology (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Disintegrating Or Milling (AREA)
Abstract
Description
また、凹んだ部分の内面は、表面粗さ(Ra)を0.004以下に形成している。よって表面における凹凸が無くなり、凸部が損壊して試料中に混入するなどの問題がない。また微細に粉砕した試料が当該凹部に圧入され、これが次の実験におけるコンタミネーションの原因となるなどの問題を解消できる。
11 乳鉢
12 乳棒
13 坩堝
14 蓋
20' 初期(研磨前)の実験器具
21 研磨材
22 砥粒
23 加工液
Claims (6)
- 凹んだ部分を有する実験器具であって、
少なくとも前記凹んだ部分は、ビッカース硬度2000HV以上の材料を用いて形成されると共に、前記凹んだ部分の内面は曲面又は曲面と平面で構成されており、
当該内面は、研磨加工によって、表面粗さ(Ra)が0.004以下に形成され、
前記曲面は、曲率半径が1mm以上であることを特徴とする、実験器具。
- 凹んだ空間又は区画された空間を備えた研磨対象物における、当該空間を区画している内面を研磨する研磨方法であって、
当該凹んだ空間又は区画された空間内に研磨材を投入する研磨材投入工程と、
研磨材を投入した空間を閉塞する閉塞工程と、
前記研磨材を充填した空間を密閉した状態において、当該研磨対象物を動かすことにより、前記空間内の研磨材を撹拌させて、当該凹んだ空間又は区画された空間の内面を研磨する研磨工程とからなる、内面の研磨方法。
- 前記閉塞工程は、凹んだ空間の開口径が同じ研磨対象物同士を突き合せて、当該空間同士を連通させることにより、何れかの研磨対象物の凹んだ空間を、他の研磨対象物の凹んだ空間で閉塞する、請求項2に記載の研磨方法。
- 前記研磨工程では、閉塞工程で閉塞した空間内に研磨材を収容した研磨対象物を、円を描くように公転移動させると共に、当該器具自体を自転させて動かす、請求項2に記載の研磨方法。
- 前記研磨材投入工程で投入する研磨材の容量は、閉塞工程で閉塞される空間の容積の10%以上且つ80%以下である、請求項2に記載の研磨方法。
- 請求項2に記載の研磨方法によって、試料を収容する為の凹んだ部分を研磨加工した実験器具であって、
少なくとも前記凹んだ部分は、ビッカース硬度2000HV以上の材料を用いて形成されると共に、
前記凹んだ部分の内面は曲面又は曲面と平面で構成されており、
当該内面は、研磨加工によって、表面粗さ(Ra)が0.004以下に形成されており、
前記曲面は、曲率半径が1mm以上であることを特徴とする、実験器具。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015027058 | 2015-02-15 | ||
JP2015027058 | 2015-02-15 | ||
PCT/JP2016/054206 WO2016129700A1 (ja) | 2015-02-15 | 2016-02-14 | 硬質研磨対象物における凹面の研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016129700A1 true JPWO2016129700A1 (ja) | 2017-06-08 |
JP6271774B2 JP6271774B2 (ja) | 2018-01-31 |
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JP2016574878A Active JP6271774B2 (ja) | 2015-02-15 | 2016-02-14 | 硬質研磨対象物における凹面の研磨方法 |
Country Status (2)
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---|---|
JP (1) | JP6271774B2 (ja) |
WO (1) | WO2016129700A1 (ja) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1090888A (en) * | 1965-11-17 | 1967-11-15 | Ass Elect Ind | Improvements relating to polishing mirrors and reflectors |
JPS517559A (ja) * | 1974-07-10 | 1976-01-21 | Hitachi Ltd | Kakuhanraikaiki |
JPH02107359A (ja) * | 1988-10-17 | 1990-04-19 | Shin Etsu Chem Co Ltd | 粉砕器具 |
JPH0597514A (ja) * | 1991-03-29 | 1993-04-20 | Nitsukatoo:Kk | 耐摩耗性ジルコニア質焼結体 |
JP2000071164A (ja) * | 1998-08-31 | 2000-03-07 | Nomura Mekki:Kk | 中空体の内面研磨方法 |
JP2001328831A (ja) * | 2000-03-13 | 2001-11-27 | Toshiba Ceramics Co Ltd | シリコン単結晶引上げ用石英ガラスルツボの製造方法 |
JP2004294125A (ja) * | 2003-03-25 | 2004-10-21 | Tdk Corp | 試料調整器具、試料調整方法、元素分析方法 |
JP2006169085A (ja) * | 2004-12-15 | 2006-06-29 | Furuya Kinzoku:Kk | ガラス製造に用いる白金または白金合金製装置および器具 |
JP2014031291A (ja) * | 2012-08-02 | 2014-02-20 | Sharp Corp | 単結晶サファイアインゴット及び坩堝 |
JP2015013325A (ja) * | 2013-07-03 | 2015-01-22 | 三島光産株式会社 | 精密研磨方法 |
-
2016
- 2016-02-14 JP JP2016574878A patent/JP6271774B2/ja active Active
- 2016-02-14 WO PCT/JP2016/054206 patent/WO2016129700A1/ja active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1090888A (en) * | 1965-11-17 | 1967-11-15 | Ass Elect Ind | Improvements relating to polishing mirrors and reflectors |
JPS517559A (ja) * | 1974-07-10 | 1976-01-21 | Hitachi Ltd | Kakuhanraikaiki |
JPH02107359A (ja) * | 1988-10-17 | 1990-04-19 | Shin Etsu Chem Co Ltd | 粉砕器具 |
JPH0597514A (ja) * | 1991-03-29 | 1993-04-20 | Nitsukatoo:Kk | 耐摩耗性ジルコニア質焼結体 |
JP2000071164A (ja) * | 1998-08-31 | 2000-03-07 | Nomura Mekki:Kk | 中空体の内面研磨方法 |
JP2001328831A (ja) * | 2000-03-13 | 2001-11-27 | Toshiba Ceramics Co Ltd | シリコン単結晶引上げ用石英ガラスルツボの製造方法 |
JP2004294125A (ja) * | 2003-03-25 | 2004-10-21 | Tdk Corp | 試料調整器具、試料調整方法、元素分析方法 |
JP2006169085A (ja) * | 2004-12-15 | 2006-06-29 | Furuya Kinzoku:Kk | ガラス製造に用いる白金または白金合金製装置および器具 |
JP2014031291A (ja) * | 2012-08-02 | 2014-02-20 | Sharp Corp | 単結晶サファイアインゴット及び坩堝 |
JP2015013325A (ja) * | 2013-07-03 | 2015-01-22 | 三島光産株式会社 | 精密研磨方法 |
Non-Patent Citations (1)
Title |
---|
ロシア国特許登録第2014137号公報, JPN6017027597, 15 June 1994 (1994-06-15), RU, pages 全文, 全図, ISSN: 0003655850 * |
Also Published As
Publication number | Publication date |
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WO2016129700A1 (ja) | 2016-08-18 |
JP6271774B2 (ja) | 2018-01-31 |
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