JPWO2016104659A1 - 弾性表面波デバイス - Google Patents
弾性表面波デバイス Download PDFInfo
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- JPWO2016104659A1 JPWO2016104659A1 JP2016566479A JP2016566479A JPWO2016104659A1 JP WO2016104659 A1 JPWO2016104659 A1 JP WO2016104659A1 JP 2016566479 A JP2016566479 A JP 2016566479A JP 2016566479 A JP2016566479 A JP 2016566479A JP WO2016104659 A1 JPWO2016104659 A1 JP WO2016104659A1
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- acoustic wave
- surface acoustic
- propagation
- plane
- wave device
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 139
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 229910001678 gehlenite Inorganic materials 0.000 claims abstract description 19
- 239000013078 crystal Substances 0.000 claims abstract description 17
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 claims abstract 2
- 239000000463 material Substances 0.000 abstract description 12
- 230000008878 coupling Effects 0.000 description 21
- 238000010168 coupling process Methods 0.000 description 21
- 238000005859 coupling reaction Methods 0.000 description 21
- 230000005284 excitation Effects 0.000 description 11
- 238000005520 cutting process Methods 0.000 description 10
- 230000004044 response Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 244000126211 Hericium coralloides Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005404 monopole Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/22—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using measurement of acoustic effects
- G01K11/26—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using measurement of acoustic effects of resonant frequencies
- G01K11/265—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using measurement of acoustic effects of resonant frequencies using surface acoustic wave [SAW]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/32—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using change of resonant frequency of a crystal
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6406—Filters characterised by a particular frequency characteristic
- H03H9/6416—SAW matched filters, e.g. surface acoustic wave compressors, chirped or coded surface acoustic wave filters
- H03H9/642—SAW transducers details for remote interrogation systems, e.g. surface acoustic wave transducers details for ID-tags
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/095—Forming inorganic materials by melting
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (14)
- ゲーレナイト(CAS:Ca2Al(AlSi)O7)単結晶からなる圧電基板と、
前記圧電基板の弾性表面波伝播面に形成された櫛型電極と、を有する弾性表面波デバイス。 - 前記弾性表面波伝播面は、(001)面を[110]方向に関して角度θだけ回転させた面であり、弾性表面波進行方向は、[110]方向であって、0°≦θ≦80°である請求項1に記載の弾性表面波デバイス。
- 前記弾性表面波伝播面は、(001)面を[110]方向に関して角度θだけ回転させた面であり、弾性表面波進行方向は、[110]方向であって、60°≦θ≦90°である請求項1に記載の弾性表面波デバイス。
- 前記弾性表面波伝播面は、(001)面を[100]方向に関して角度θだけ回転させた面であり、弾性表面波進行方向は、[100]方向であって、40°≦θ≦75°である請求項1に記載の弾性表面波デバイス。
- 前記弾性表面波伝播面は、(001)面を[100]方向に関して角度θだけ回転させた面であり、弾性表面波進行方向は、[100]方向であって、45°≦θ≦80°である請求項1に記載の弾性表面波デバイス。
- 前記弾性表面波伝播面は、(100)面を[001]方向に関して角度θだけ回転させた面であり、弾性表面波進行方向は、[001]方向であって、20°≦θ≦70°である請求項1に記載の弾性表面波デバイス。
- 前記弾性表面波伝播面は、(001)面である請求項1に記載の弾性表面波デバイス。
- 前記弾性表面波伝播面は、45°Y面であり、弾性表面波進行方向は、45°Z方向を0°として、−45°〜45°の範囲にある請求項1に記載の弾性表面波デバイス。
- 弾性表面波進行方向は、前記弾性表面波伝播面内において、伝播角度に対する音速の値が極値を示す伝播角度であるか、又はその近辺である請求項1に記載の弾性表面波デバイス。
- 前記弾性表面波デバイスは、センサである請求項1〜10のいずれか1項に記載の弾性表面波デバイス。
- 前記櫛型電極に接続されたアンテナを有し、無線による遠隔センシング可能な請求項11に記載の弾性表面波デバイス。
- 前記櫛型電極に接続された端子を有し、有線によるセンシング可能な請求項11に記載の弾性表面波デバイス。
- 前記弾性表面波デバイスは、フィルタである請求項1〜10のいずれか1項に記載の弾性表面波デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014261044 | 2014-12-24 | ||
JP2014261044 | 2014-12-24 | ||
PCT/JP2015/086141 WO2016104659A1 (ja) | 2014-12-24 | 2015-12-24 | 弾性表面波デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016104659A1 true JPWO2016104659A1 (ja) | 2017-10-05 |
JP6633544B2 JP6633544B2 (ja) | 2020-01-22 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016566479A Active JP6633544B2 (ja) | 2014-12-24 | 2015-12-24 | 弾性表面波デバイス |
Country Status (4)
Country | Link |
---|---|
US (1) | US10648868B2 (ja) |
JP (1) | JP6633544B2 (ja) |
CN (1) | CN107112978B (ja) |
WO (1) | WO2016104659A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10727741B2 (en) * | 2016-06-29 | 2020-07-28 | Win Semiconductors Corp. | Thermal sensing acoustic wave resonator and acoustic wave filter having thermal sensing acoustic wave resonator |
US10571431B2 (en) | 2017-06-02 | 2020-02-25 | Ssi Technologies, Llc | Combination sensor |
CN112965162A (zh) * | 2021-03-04 | 2021-06-15 | 山东大学 | 一种基于单晶光纤声学各向异性和掺杂调制的高灵敏单晶光纤测温方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004242044A (ja) * | 2003-02-06 | 2004-08-26 | Toyo Commun Equip Co Ltd | 弾性表面波フィルタ |
JP2008267847A (ja) * | 2007-04-17 | 2008-11-06 | Shinko Electric Co Ltd | 検出装置及び検出システム |
JP2012255706A (ja) * | 2011-06-08 | 2012-12-27 | National Univ Corp Shizuoka Univ | 無給電ワイヤレス式センサモジュールおよびワイヤレス式物理量検出システム |
JP2014011327A (ja) * | 2012-06-29 | 2014-01-20 | Tokyo Institute Of Technology | 圧電材料、圧電部材、圧電素子及び圧力センサ |
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US4232240A (en) * | 1979-05-31 | 1980-11-04 | The United States Of America As Represented By The Secretary Of The Air Force | High piezoelectric coupling X-cuts of lead potassium niobate, Pb2 Knb5 O15 , for surface acoustic wave applications |
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EP0810725A3 (en) * | 1996-05-29 | 1999-10-27 | Santech Company, Limited | Wafer and surface acoustic wave device |
JP2000278085A (ja) * | 1999-03-24 | 2000-10-06 | Yamaha Corp | 弾性表面波素子 |
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JP2002118442A (ja) * | 2000-10-04 | 2002-04-19 | Tdk Corp | 弾性表面波装置及びこれに用いる圧電基板 |
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JP3841053B2 (ja) * | 2002-07-24 | 2006-11-01 | 株式会社村田製作所 | 弾性表面波装置及びその製造方法 |
JP2004129185A (ja) | 2002-08-01 | 2004-04-22 | Sony Corp | Sawセンサ、sawセンサを用いた個体識別装置、およびsawセンサの製造方法 |
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JP2006148622A (ja) * | 2004-11-22 | 2006-06-08 | Seiko Epson Corp | 弾性表面波装置および電子機器 |
JP2010011440A (ja) * | 2008-05-30 | 2010-01-14 | Hitachi Ltd | 弾性波装置及びそれを用いた高周波フィルタ |
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-
2015
- 2015-12-24 CN CN201580071137.9A patent/CN107112978B/zh not_active Expired - Fee Related
- 2015-12-24 WO PCT/JP2015/086141 patent/WO2016104659A1/ja active Application Filing
- 2015-12-24 JP JP2016566479A patent/JP6633544B2/ja active Active
- 2015-12-24 US US15/539,157 patent/US10648868B2/en active Active
Patent Citations (4)
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JP2004242044A (ja) * | 2003-02-06 | 2004-08-26 | Toyo Commun Equip Co Ltd | 弾性表面波フィルタ |
JP2008267847A (ja) * | 2007-04-17 | 2008-11-06 | Shinko Electric Co Ltd | 検出装置及び検出システム |
JP2012255706A (ja) * | 2011-06-08 | 2012-12-27 | National Univ Corp Shizuoka Univ | 無給電ワイヤレス式センサモジュールおよびワイヤレス式物理量検出システム |
JP2014011327A (ja) * | 2012-06-29 | 2014-01-20 | Tokyo Institute Of Technology | 圧電材料、圧電部材、圧電素子及び圧力センサ |
Also Published As
Publication number | Publication date |
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CN107112978B (zh) | 2020-10-02 |
JP6633544B2 (ja) | 2020-01-22 |
US20170350769A1 (en) | 2017-12-07 |
CN107112978A (zh) | 2017-08-29 |
US10648868B2 (en) | 2020-05-12 |
WO2016104659A1 (ja) | 2016-06-30 |
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