JPWO2016047682A1 - 樹脂フィルム及び積層フィルム - Google Patents

樹脂フィルム及び積層フィルム Download PDF

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Publication number
JPWO2016047682A1
JPWO2016047682A1 JP2016550357A JP2016550357A JPWO2016047682A1 JP WO2016047682 A1 JPWO2016047682 A1 JP WO2016047682A1 JP 2016550357 A JP2016550357 A JP 2016550357A JP 2016550357 A JP2016550357 A JP 2016550357A JP WO2016047682 A1 JPWO2016047682 A1 JP WO2016047682A1
Authority
JP
Japan
Prior art keywords
resin
resin film
compound
film
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016550357A
Other languages
English (en)
Japanese (ja)
Inventor
達史 林
達史 林
貴至 西村
貴至 西村
俊章 田中
俊章 田中
白波瀬　和孝
和孝 白波瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2016047682A1 publication Critical patent/JPWO2016047682A1/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2016550357A 2014-09-25 2015-09-24 樹脂フィルム及び積層フィルム Pending JPWO2016047682A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014195017 2014-09-25
JP2014195017 2014-09-25
PCT/JP2015/076914 WO2016047682A1 (ja) 2014-09-25 2015-09-24 樹脂フィルム及び積層フィルム

Publications (1)

Publication Number Publication Date
JPWO2016047682A1 true JPWO2016047682A1 (ja) 2017-07-06

Family

ID=55581205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016550357A Pending JPWO2016047682A1 (ja) 2014-09-25 2015-09-24 樹脂フィルム及び積層フィルム

Country Status (3)

Country Link
JP (1) JPWO2016047682A1 (zh)
TW (1) TW201619282A (zh)
WO (1) WO2016047682A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7082496B2 (ja) * 2017-02-27 2022-06-08 株式会社Adeka 繊維強化プラスチック用樹脂組成物、その硬化物、及び該硬化物を含有する繊維強化プラスチック
JP7076263B2 (ja) * 2018-03-30 2022-05-27 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
CN113675529B (zh) * 2021-08-19 2022-10-25 安徽今希新材料科技有限公司 一种新能源汽车用锂离子电池隔膜材料及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5085125B2 (ja) * 2004-03-29 2012-11-28 住友ベークライト株式会社 樹脂組成物、樹脂付き金属箔、基材付き絶縁シートおよび多層プリント配線板
MY150055A (en) * 2007-01-16 2013-11-29 Sumitomo Bakelite Co Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate
CN101977984B (zh) * 2008-03-25 2014-03-26 住友电木株式会社 环氧树脂组合物、树脂片、半固化片、多层印刷布线板及半导体装置
JP2011032330A (ja) * 2009-07-30 2011-02-17 Sekisui Chem Co Ltd 樹脂組成物、ｂステージフィルム、積層フィルム、銅張り積層板及び多層基板
JP4938910B1 (ja) * 2011-03-31 2012-05-23 積水化学工業株式会社 予備硬化物、粗化予備硬化物及び積層体
JP2013010899A (ja) * 2011-06-30 2013-01-17 Sekisui Chem Co Ltd 樹脂ワニス、ろ過処理樹脂ワニス及びその製造方法、積層フィルム並びに多層基板
JP2013040298A (ja) * 2011-08-18 2013-02-28 Sekisui Chem Co Ltd エポキシ樹脂材料及び多層基板
JP2012054573A (ja) * 2011-10-11 2012-03-15 Sumitomo Bakelite Co Ltd 多層プリント配線板用絶縁樹脂組成物、基材付き絶縁シート、多層プリント配線板及び半導体装置
JP2012019240A (ja) * 2011-10-12 2012-01-26 Sumitomo Bakelite Co Ltd 樹脂組成物、基材付き絶縁シート、及び、多層プリント配線板
JP5752071B2 (ja) * 2012-03-02 2015-07-22 積水化学工業株式会社 Ｂステージフィルム及び多層基板

Also Published As

Publication number Publication date
TW201619282A (zh) 2016-06-01
WO2016047682A1 (ja) 2016-03-31

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