JPWO2015174195A1 - Conductive particles, conductive materials, and connection structures - Google Patents

Abstract

Provided is a conductive particle capable of effectively enhancing conduction reliability between electrodes when the electrodes are electrically connected. The electroconductive particle which concerns on this invention is equipped with a base particle and the electroconductive part arrange | positioned on the surface of the said base particle, and the compressive elasticity modulus in 3 mN load is 5000 N / mm2 or more and 30000 N / mm2 or less. The rebound energy at a compression speed of 0.33 mN / s and a load of 3 mN (formula: repulsion energy = displacement at load of 3 mN × 3 mN load μm × compression recovery rate at load of 3 mN) is 0.8 or more. 6 or less.

Description

  The present invention relates to a conductive particle in which a conductive portion is arranged on the surface of a base particle. The present invention also relates to a conductive material and a connection structure using the conductive particles.

  Anisotropic conductive materials such as anisotropic conductive pastes and anisotropic conductive films are widely known. In the anisotropic conductive material, a plurality of conductive particles are dispersed in a binder resin.

  In order to obtain various connection structures, the anisotropic conductive material is, for example, a connection between a flexible printed circuit board and a glass substrate (FOG (Film on Glass)) or a connection between a semiconductor chip and a flexible printed circuit board (COF ( Chip on Film)), connection between a semiconductor chip and a glass substrate (COG (Chip on Glass)), connection between a flexible printed circuit board and a glass epoxy substrate (FOB (Film on Board)), and the like.

  For example, when the electrode of the semiconductor chip and the electrode of the glass substrate are electrically connected by the anisotropic conductive material, an anisotropic conductive material containing conductive particles is disposed on the glass substrate. Next, the semiconductor chips are stacked, and heated and pressurized. Accordingly, the anisotropic conductive material is cured, and the electrodes are electrically connected through the conductive particles to obtain a connection structure.

As an example of the conductive particles, Patent Document 1 below discloses conductive particles having polymer particles and a conductive metal layer on the surface of the polymer particles. The breaking point load of the polymer particles is 9.8 mN (1.0 gf) or less. Patent Document 1 describes that the 10% K value of the polymer particles may be 7350 N / mm ² (750 kgf / mm ² ) to 49000 N / mm ² (5000 kgf / mm ² ).

WO2012 / 020799A1

  When the connection structure is obtained by connecting the electrodes using conventional conductive particles as described in Patent Document 1, the initial connection resistance is increased or the conduction reliability is decreased. Sometimes. For example, when the connection structure is exposed to conditions of 85 ° C. and humidity 85% for 500 hours, the connection resistance between the electrodes may increase, and the conduction reliability may be low.

  In recent years, miniaturization of electronic components has progressed. For this reason, in the wiring connected by the conductive particles in the electronic component, L / S indicating the width of the line (L) in which the wiring is formed and the width of the space (S) in which no wiring is formed is reduced. It is coming. When such a fine wiring is formed, it is difficult to ensure sufficient conduction reliability when conducting conductive connection using conventional conductive particles.

  The objective of this invention is providing the electroconductive particle which can improve the conduction | electrical_connection reliability between electrodes effectively, when connecting between electrodes electrically.

  Another object of the present invention is to provide a conductive material and a connection structure using the conductive particles.

According to a wide aspect of the present invention, the apparatus includes a base particle and a conductive part disposed on the surface of the base particle, and a compressive elastic modulus at a load of 3 mN is 5000 N / mm ² or more and 30000 N / mm ² or less. In addition, conductive particles having a repulsion energy of 0.8 or more and 1.6 or less obtained from the following formula at a compression speed of 0.33 mN / s and a load of 3 mN are provided.

  Repulsive energy = Displacement at 3 mN x 3 mN load μm x 3 mN compression recovery at load

  On the specific situation with the electroconductive particle which concerns on this invention, the said base material particle is a resin particle or an organic inorganic hybrid particle.

  On the specific situation with the electroconductive particle which concerns on this invention, the said electroconductive particle has a processus | protrusion on the outer surface of the said electroconductive part.

  On the specific situation with the electroconductive particle which concerns on this invention, the said electroconductive particle is provided with the insulating substance arrange | positioned on the outer surface of the said electroconductive part.

  According to a wide aspect of the present invention, there is provided a conductive material including the above-described conductive particles and a binder resin.

  According to a wide aspect of the present invention, the first connection target member, the second connection target member, the connection portion connecting the first connection target member, and the second connection target member; There is provided a connection structure in which the connection part is formed of the above-described conductive particles or is formed of a conductive material containing the conductive particles and a binder resin.

The conductive particle according to the present invention, the conductive portion on the surface of the base particle is disposed, compression modulus during 3mN load 5000N / mm ² or more and 30000 N / mm ² or less, the compression rate 0. Since the repulsion energy at 33 mN / s and 3 mN load is 0.8 or more and 1.6 or less, when the electrodes are electrically connected using the conductive particles according to the present invention, the conduction reliability between the electrodes Sexually can be enhanced effectively.

FIG. 1 is a cross-sectional view showing conductive particles according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view showing conductive particles according to the second embodiment of the present invention. FIG. 3 is a cross-sectional view showing conductive particles according to the third embodiment of the present invention. FIG. 4 is a front cross-sectional view schematically showing a connection structure using conductive particles according to the first embodiment of the present invention.

Details of the present invention will be described below. In this specification, “(
“Meth) acryl” means one or both of “acryl” and “methacryl”
“Meth) acrylate” means one or both of “acrylate” and “methacrylate”.

(Conductive particles)
The electroconductive particle which concerns on this invention is equipped with base material particle and the electroconductive part arrange | positioned on the surface of this base material particle.

The conductive particle according to the present invention, the compression modulus at 3mN load 5000N / mm ² or more and 30000 N / mm ² or less. In the electroconductive particle which concerns on this invention, the repulsion energy calculated | required from the following formula at the time of 3 mN load at the compression speed of 0.33 mN / s is 0.8 or more and 1.6 or less.

  Repulsive energy = Displacement at 3 mN x 3 mN load μm x 3 mN compression recovery at load

  The conductive particles according to the present invention exhibit low repulsion energy while being relatively hard. The electroconductive particle which concerns on this invention is equipped with the new property which was not equipped conventionally.

  In this invention, since the structure mentioned above is provided, when electrically connecting between electrodes using the electroconductive particle which concerns on this invention, the conduction | electrical_connection reliability between electrodes can be improved effectively. For example, regarding a connection structure in which electrodes are electrically connected using the conductive particles according to the present invention, when the connection structure is exposed to conditions of 85 ° C. and 85% humidity for 500 hours, the connection between the electrodes An increase in resistance can be suppressed.

  The above-described effect is manifested because an increase in resistance value due to springback of the conductive particles can be suppressed when a connection target member such as a semiconductor chip and a glass substrate is thin.

  In addition, since the conductive particles according to the present invention are relatively hard, an appropriate indentation can be formed on the electrode after the conductive connection. This also makes it possible to reduce the initial connection resistance and further improve the conduction reliability.

From the viewpoint of further reducing the connection resistance and further improving the conduction reliability between the electrodes, the compressive elastic modulus (K value) of the conductive particles at a load of 3 mN is preferably 7000 N / mm ² or more, more preferably. Is 9000 N / mm ² or more, preferably 25000 N / mm ² or less, more preferably 20000 N / mm ² or less.

  From the viewpoint of further reducing the connection resistance and further improving the conduction reliability between the electrodes, the repulsive energy of the conductive particles is preferably 0.9 or more, more preferably 1.0 or more, preferably 1. 5 or less, more preferably 1.4 or less.

  The displacement at 3 mN load in the conductive particles and the compressive elastic modulus at 3 mN load in the conductive particles can be measured as follows.

  Using a micro-compression tester, one conductive particle is compressed on a smooth indenter end face of a cylinder (diameter 50 μm, made of diamond) at 25 ° C. under the condition of applying a maximum test load of 90 mN over 30 seconds. The load value (N) and compression displacement (mm) at this time are measured. From the measured value obtained, the compression elastic modulus can be obtained by the following formula. As the micro compression tester, for example, “Fischer Scope H-100” manufactured by Fischer is used.

K value (N / mm ² ) = (3/2 ^1/2 ) · F · S ⁻³ / ² · R ^−1/2
F: Load value, 0.003 (N)
S: Compression displacement (mm) when the conductive particles are compressed at 3 mN
R: radius of conductive particles (mm)

  The compression elastic modulus universally and quantitatively represents the hardness of the conductive particles. By using the compression elastic modulus, the hardness of the conductive particles can be expressed quantitatively and uniquely.

  The compression recovery rate for obtaining the rebound energy can be measured as follows.

  Spread conductive particles on the sample stage. Using a micro compression tester for each dispersed conductive particle, a 3 mN load is applied to the conductive particle in the center direction of the conductive particle at 25 ° C. on the end face of a cylindrical (diameter 100 μm, made of diamond). (Reverse load value) is given. Thereafter, unloading is performed up to the origin load value (0.40 mN). The load-compression displacement during this period is measured, and the compression recovery rate can be obtained from the following equation. The load speed is 0.33 mN / sec. As the micro compression tester, for example, “Fischer Scope H-100” manufactured by Fischer is used.

Compression recovery rate (%) = [(L1-L2) / L1] × 100
L1: Compression displacement from the load value for origin to the reverse load value when applying a load L2: Unloading displacement from the reverse load value to the load value for origin when releasing the load

  Particles that are relatively hard but exhibit low repulsion energy, such as the conductive particles according to the present invention, can be obtained by appropriately adjusting the polymerization conditions of the base particles and the hardness of the conductive portion.

  With respect to the base particles, for example, when the base particles are inorganic particles or organic-inorganic hybrid particles excluding metals described later, the condensation reaction conditions, oxygen partial pressure during firing, firing temperature, and firing time are adjusted. Thus, the radical polymerization reaction can be performed in the firing step while suppressing the radical polymerization reaction during the condensation reaction, and as a result, conductive particles exhibiting low repulsion energy while being relatively hard are obtained. Can be easily obtained.

  Regarding the conductive part, by appropriately adjusting the metal species that is the material of the conductive part and the thickness of the conductive part, the physical properties of the conductive particles can be combined with the physical properties of the substrate particles to obtain desired repulsive energy physical properties. .

  Examples of the metal species include a material containing nickel, and besides nickel, a nickel phosphorus alloy, a nickel boron alloy, an alloy of nickel, boron and tungsten, and a combination thereof can be given.

  Hereinafter, the present invention will be specifically described with reference to the drawings. In addition, this invention is not limited only to the following embodiment, The following embodiment may be suitably changed, improved, etc. to such an extent that the characteristic of this invention is not impaired.

  FIG. 1 is a cross-sectional view showing conductive particles according to the first embodiment of the present invention.

  The conductive particles 1 shown in FIG. 1 have base material particles 2 and conductive portions 3. The conductive portion 3 is disposed on the surface of the base particle 2. In the first embodiment, the conductive portion 3 is in contact with the surface of the base particle 2. The conductive particle 1 is a coated particle in which the surface of the base particle 2 is coated with the conductive portion 3. In the conductive particle 1, the conductive part 3 is a single-layer conductive part (conductive layer).

  Unlike the conductive particles 11 and 21 described later, the conductive particles 1 do not have a core substance. The conductive particles 1 do not have protrusions on the conductive surface, and do not have protrusions on the outer surface of the conductive portion 3. The conductive particles 1 are spherical.

  As described above, the conductive particles according to the present invention may not have protrusions on the conductive surface, may not have protrusions on the outer surface of the conductive portion, and may be spherical. . Moreover, the electroconductive particle 1 does not have an insulating substance unlike the electroconductive particles 11 and 21 mentioned later. However, the conductive particles 1 may have an insulating substance disposed on the outer surface of the conductive portion 3.

  FIG. 2 is a cross-sectional view showing conductive particles according to the second embodiment of the present invention.

  A conductive particle 11 shown in FIG. 2 includes a base particle 2, a conductive portion 12, a plurality of core substances 13, and a plurality of insulating substances 14. The conductive portion 12 is disposed on the surface of the base particle 2 so as to be in contact with the base particle 2. In the conductive particles 11, the conductive portion 12 is a single-layer conductive portion (conductive layer).

  The conductive particles 11 have a plurality of protrusions 11a on the conductive surface. As for the electroconductive particle 11, the electroconductive part 12 has several protrusion 12a in the outer surface. A plurality of core substances 13 are arranged on the surface of the base particle 2. The plurality of core materials 13 are embedded in the conductive portion 12. The core substance 13 is disposed inside the protrusions 11a and 12a. The conductive portion 12 covers a plurality of core substances 13. The outer surface of the conductive portion 12 is raised by the plurality of core materials 13, and protrusions 11 a and 12 a are formed.

  The conductive particles 11 have an insulating substance 14 disposed on the outer surface of the conductive portion 12. At least a part of the outer surface of the conductive portion 12 is covered with the insulating material 14. The insulating substance 14 is made of an insulating material and is an insulating particle. Thus, the electroconductive particle which concerns on this invention may have the insulating substance arrange | positioned on the outer surface of an electroconductive part. However, the conductive particles according to the present invention do not necessarily have an insulating substance.

  FIG. 3 is a cross-sectional view showing conductive particles according to the third embodiment of the present invention.

  The conductive particles 21 shown in FIG. 3 include base material particles 2, conductive portions 22, a plurality of core materials 13, and a plurality of insulating materials 14. The conductive part 22 as a whole has a first conductive part 22A on the base particle 2 side and a second conductive part 22B on the side opposite to the base particle 2 side.

  The conductive particles 11 and the conductive particles 21 differ only in the conductive part. That is, the conductive particle 11 has a single-layered conductive portion, whereas the conductive particle 21 has a two-layered first conductive portion 22A and a second conductive portion 22B. Yes. The first conductive portion 22A and the second conductive portion 22B are formed as separate conductive portions.

  The first conductive portion 22 </ b> A is disposed on the surface of the base particle 2. 22 A of 1st electroconductive parts are arrange | positioned between the base particle 2 and the 2nd electroconductive part 22B. The first conductive portion 22 </ b> A is in contact with the base material particle 2. Accordingly, the first conductive portion 22A is disposed on the surface of the base particle 2, and the second conductive portion 22B is disposed on the surface of the first conductive portion 22A. The conductive particles 21 have a plurality of protrusions 21a on the conductive surface. As for the electroconductive particle 21, the electroconductive part 22 has the some protrusion 22a in the outer surface. The first conductive portion 22A has a protrusion 22Aa on the outer surface. The second conductive portion 22B has a plurality of protrusions 22Ba on the outer surface. In the conductive particles 21, the conductive portion 22 is a two-layer conductive portion (conductive layer).

  Hereinafter, other details of the conductive particles will be described.

[Base material particles]
Examples of the substrate particles include resin particles, inorganic particles excluding metal particles, organic-inorganic hybrid particles, and metal particles. The base particle may be a core-shell particle including a core and a shell disposed on the surface of the core. The core may be an organic core. The shell may be an inorganic shell. Of these, substrate particles excluding metal particles are preferable, and resin particles, inorganic particles excluding metal particles, or organic-inorganic hybrid particles are more preferable. Resin particles or organic-inorganic hybrid particles are particularly preferred because they are more excellent due to the effects of the present invention.

  The substrate particles are preferably resin particles formed of a resin. When connecting between electrodes using the said electroconductive particle, after arrange | positioning the said electroconductive particle between electrodes, the said electroconductive particle is compressed by crimping | bonding. When the substrate particles are resin particles, the conductive particles are easily deformed during the pressure bonding, and the contact area between the conductive particles and the electrode is increased. For this reason, the conduction | electrical_connection reliability between electrodes becomes high.

  Various organic materials are suitably used as the resin for forming the resin particles. Examples of the resin for forming the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, and polybutadiene; acrylic resins such as polymethyl methacrylate and polymethyl acrylate; Alkylene terephthalate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polysulfone, polyphenylene Oxide, polyacetal, polyimide, polyamideimide, polyether ether Ketones, polyether sulfones, and polymers such as obtained by a variety of polymerizable monomer having an ethylenically unsaturated group is polymerized with one or more thereof. Since the hardness of the substrate particles can be easily controlled within a suitable range, the resin for forming the resin particles is obtained by polymerizing one or more polymerizable monomers having a plurality of ethylenically unsaturated groups. A polymer is preferred.

  When the resin particles are obtained by polymerizing a monomer having an ethylenically unsaturated group, the monomer having an ethylenically unsaturated group includes a non-crosslinkable monomer and a crosslinkable monomer. And so on.

  Examples of the non-crosslinkable monomer include styrene monomers such as styrene and α-methylstyrene; carboxyl group-containing monomers such as (meth) acrylic acid, maleic acid, and maleic anhydride; (Meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl ( Alkyl (meth) acrylates such as meth) acrylate and isobornyl (meth) acrylate; oxygen such as 2-hydroxyethyl (meth) acrylate, glycerol (meth) acrylate, polyoxyethylene (meth) acrylate and glycidyl (meth) acrylate Child-containing (meth) acrylates; Nitrile-containing monomers such as (meth) acrylonitrile; Vinyl ethers such as methyl vinyl ether, ethyl vinyl ether, and propyl vinyl ether; Vinyl acetates such as vinyl acetate, vinyl butyrate, vinyl laurate, and vinyl stearate Esters; Unsaturated hydrocarbons such as ethylene, propylene, isoprene and butadiene; Halogen-containing monomers such as trifluoromethyl (meth) acrylate, pentafluoroethyl (meth) acrylate, vinyl chloride, vinyl fluoride and chlorostyrene Is mentioned.

  Examples of the crosslinkable monomer include tetramethylolmethane tetra (meth) acrylate, tetramethylolmethane tri (meth) acrylate, tetramethylolmethane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, and dipenta Erythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, glycerol tri (meth) acrylate, glycerol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) Polyfunctional (meth) acrylates such as acrylate, (poly) tetramethylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate; triallyl (iso) cyanure And silane-containing monomers such as triallyl trimellitate, divinylbenzene, diallyl phthalate, diallylacrylamide, diallyl ether, γ- (meth) acryloxypropyltrimethoxysilane, trimethoxysilylstyrene, vinyltrimethoxysilane It is done.

  The resin particles can be obtained by polymerizing the polymerizable monomer having an ethylenically unsaturated group by a known method. Examples of this method include a method of suspension polymerization in the presence of a radical polymerization initiator, and a method of polymerizing by swelling a monomer together with a radical polymerization initiator using non-crosslinked seed particles.

  In the case where the substrate particles are inorganic particles or organic-inorganic hybrid particles excluding metal, examples of the inorganic material for forming the substrate particles include silica and carbon black. The particles formed from the silica are not particularly limited. For example, after forming a crosslinked polymer particle by hydrolyzing a silicon compound having two or more hydrolyzable alkoxysilyl groups, firing may be performed as necessary. The particle | grains obtained by performing are mentioned. Examples of the organic / inorganic hybrid particles include organic / inorganic hybrid particles formed of a crosslinked alkoxysilyl polymer and an acrylic resin.

  When the substrate particles are metal particles, examples of the metal that is a material of the metal particles include silver, copper, nickel, silicon, gold, and titanium. However, the substrate particles are preferably not metal particles, and preferably not copper particles.

  The particle diameter of the substrate particles is preferably 0.1 μm or more, more preferably 1 μm or more, still more preferably 1.5 μm or more, particularly preferably 2 μm or more, preferably 1000 μm or less, more preferably 500 μm or less, and even more preferably. Is not more than 300 μm, more preferably not more than 50 μm, still more preferably not more than 30 μm, particularly preferably not more than 5 μm, most preferably not more than 3 μm. When the particle diameter of the substrate particles is equal to or greater than the lower limit, the contact area between the conductive particles and the electrodes is increased, so that the conduction reliability between the electrodes is further increased and the conductive particles are connected via the conductive particles. The connection resistance between the electrodes is further reduced. Further, when the conductive portion is formed on the surface of the base particle by electroless plating, it becomes difficult to aggregate, and the aggregated conductive particles are hardly formed. When the particle diameter of the substrate particles is not more than the above upper limit, the conductive particles are easily compressed, the connection resistance between the electrodes is further reduced, and the interval between the electrodes is further reduced.

  The particle diameter of the base particle indicates a diameter when the base particle is a true sphere, and indicates a maximum diameter when the base particle is not a true sphere.

  The particle diameter of the substrate particles is particularly preferably 1 μm or more and 5 μm or less. When the particle diameter of the substrate particles is in the range of 1 to 5 μm, even when the distance between the electrodes is small and the thickness of the conductive part is increased, small conductive particles can be obtained.

[Conductive part]
The metal for forming the conductive part is not particularly limited. Examples of the metal include gold, silver, palladium, ruthenium, rhodium, osmium, iridium, copper, platinum, zinc, iron, tin, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, and thallium. , Germanium, cadmium, silicon, and alloys thereof. Examples of the metal include tin-doped indium oxide (ITO) and solder. Especially, since the connection resistance between electrodes can be made still lower, an alloy containing tin, nickel, palladium, copper or gold is preferable, and nickel or palladium is preferable.

  Like the conductive particles 1 and 11, the conductive part may be formed of one layer. Like the electroconductive particle 21, the electroconductive part may be formed of the some layer. That is, the conductive part may have a laminated structure of two or more layers. When the conductive portion is formed of a plurality of layers, the outermost layer is preferably a gold layer, a nickel layer, a palladium layer, a copper layer, or an alloy layer containing tin and silver, and is a gold layer. Is more preferable. When the outermost layer is these preferred conductive layers, the connection resistance between the electrodes is further reduced. Moreover, when the outermost layer is a gold layer, the corrosion resistance is further enhanced.

  The method for forming the conductive part on the surface of the substrate particle is not particularly limited. As a method for forming the conductive portion, for example, a method by electroless plating, a method by electroplating, a method by physical vapor deposition, and a method of coating the surface of base particles with metal powder or a paste containing metal powder and a binder Etc. Especially, since formation of an electroconductive part is simple, the method by electroless plating is preferable. Examples of the method by physical vapor deposition include methods such as vacuum vapor deposition, ion plating, and ion sputtering.

  The particle diameter of the conductive particles is preferably 0.5 μm or more, more preferably 1 μm or more, preferably 520 μm or less, more preferably 500 μm or less, still more preferably 100 μm or less, still more preferably 50 μm or less, and particularly preferably 20 μm. It is as follows. When the particle diameter of the conductive particles is not less than the above lower limit and not more than the above upper limit, when the electrodes are connected using the conductive particles, the contact area between the conductive particles and the electrode becomes sufficiently large, and the conductive part When forming the conductive particles, it becomes difficult to form aggregated conductive particles. Further, the distance between the electrodes connected via the conductive particles does not become too large, and the conductive portion is difficult to peel from the surface of the base particle. Further, when the particle diameter of the conductive particles is not less than the above lower limit and not more than the above upper limit, the conductive particles can be suitably used for the use of the conductive material.

  The particle diameter of the conductive particles means the diameter when the conductive particles are true spherical, and means the maximum diameter when the conductive particles have a shape other than the true spherical shape.

  The thickness of the conductive part (total thickness of the conductive part) is preferably 0.005 μm or more, more preferably 0.01 μm or more, preferably 10 μm or less, more preferably 1 μm or less, still more preferably 0.5 μm or less, particularly preferably Is 0.3 μm or less. The thickness of the conductive portion is the thickness of the entire conductive layer when the conductive portion is a multilayer. When the thickness of the conductive part is not less than the above lower limit and not more than the above upper limit, sufficient conductivity can be obtained, and the conductive particles are not too hard, and the conductive particles are sufficiently deformed when connecting the electrodes. .

  When the conductive part is formed of a plurality of layers, the thickness of the outermost conductive layer is preferably 0.001 μm or more, more preferably 0.01 μm or more, preferably 0.5 μm or less, more preferably 0. .1 μm or less. When the thickness of the outermost conductive layer is not less than the above lower limit and not more than the above upper limit, the coating with the outermost conductive layer becomes uniform, the corrosion resistance becomes sufficiently high, and the connection resistance between the electrodes is further increased. Lower. Further, when the outermost layer is a gold layer, the thinner the gold layer, the lower the cost.

  The thickness of the conductive portion can be measured by observing the cross section of the conductive particles using, for example, a transmission electron microscope (TEM).

  From the viewpoint of effectively increasing the conductivity, the conductive particles preferably have a conductive portion containing nickel. In 100% by weight of the conductive part containing nickel, the nickel content is preferably 50% by weight or more, more preferably 65% by weight or more, still more preferably 70% by weight or more, still more preferably 75% by weight or more, and even more preferably. Is 80% by weight or more, particularly preferably 85% by weight or more, and most preferably 90% by weight or more. In 100% by weight of the conductive part containing nickel, the content of nickel is preferably 100% by weight (total amount) or less, 99% by weight or less, or 95% by weight or less. When the nickel content is at least the above lower limit, the connection resistance between the electrodes is further reduced. Moreover, when there are few oxide films in the surface of an electrode or an electroconductive part, there exists a tendency for the connection resistance between electrodes to become low, so that there is much content of nickel.

  The measuring method of content of the metal contained in the said electroconductive part can use various known analytical methods, and is not specifically limited. Examples of this measuring method include absorption spectrometry or spectrum analysis. In the above-mentioned absorption analysis method, a flame absorptiometer, an electric heating furnace absorptiometer or the like can be used. Examples of the spectrum analysis method include a plasma emission analysis method and a plasma ion source mass spectrometry method.

  When measuring the average content of the metal contained in the conductive part, it is preferable to use an ICP emission analyzer. Examples of commercially available ICP emission analyzers include ICP emission analyzers manufactured by HORIBA.

  The conductive part may contain phosphorus or boron in addition to nickel. The conductive portion may contain a metal other than nickel. In the conductive part, when a plurality of metals are included, the plurality of metals may be alloyed.

  In 100% by weight of the conductive part containing nickel and phosphorus or boron, the content of phosphorus or boron is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 10% by weight or less, more preferably 5%. % By weight or less. When the content of phosphorus or boron is not more than the above lower limit and the above upper limit, the resistance of the conductive portion is further reduced, and the conductive portion contributes to the reduction of connection resistance.

[Core material]
The conductive particles preferably have protrusions on the conductive surface. The conductive particles preferably have protrusions on the outer surface of the conductive part. It is preferable that there are a plurality of protrusions. An oxide film is often formed on the surface of the electrode connected by the conductive particles. Furthermore, an oxide film is often formed on the surface of the conductive part of the conductive particles. By using the conductive particles having the protrusions, the oxide film is effectively eliminated by the protrusions by placing the conductive particles between the electrodes and then pressing them. For this reason, an electrode and electroconductive particle can be contacted still more reliably and the connection resistance between electrodes can be made low. Furthermore, when the conductive particles have an insulating material on the surface, or when the conductive particles are dispersed in a binder resin and used as a conductive material, the conductive particles and the electrodes are separated by protrusions of the conductive particles. The resin in between can be effectively eliminated. For this reason, the conduction | electrical_connection reliability between electrodes becomes still higher.

  Since the core substance is embedded in the conductive portion, it is easy for the conductive portion to have a plurality of protrusions on the outer surface. However, the core substance is not necessarily used in order to form protrusions on the conductive surface of the conductive particles and the surface of the conductive portion.

  As a method for forming the protrusions, a method of forming a conductive part by electroless plating after attaching a core substance to the surface of the base particle, and a method of forming a conductive part by electroless plating on the surface of the base particle And a method of forming a conductive part by electroless plating, and a method of adding a core substance in the middle of forming the conductive part by electroless plating on the surface of the substrate particles.

  Examples of the material of the core substance include a conductive substance and a non-conductive substance. Examples of the conductive material include conductive non-metals such as metals, metal oxides, and graphite, and conductive polymers. Examples of the conductive polymer include polyacetylene. Examples of the non-conductive substance include silica, alumina, barium titanate, zirconia, and the like. Among them, metal is preferable because conductivity can be increased and connection resistance can be effectively reduced. The core substance is preferably metal particles. As the metal that is the material of the core substance, the metals mentioned as the material of the conductive material can be used as appropriate.

  The shape of the core material is not particularly limited. The shape of the core substance is preferably a lump. Examples of the core substance include a particulate lump, an agglomerate in which a plurality of fine particles are aggregated, and an irregular lump.

  The average diameter (average particle diameter) of the core substance is preferably 0.001 μm or more, more preferably 0.05 μm or more, preferably 0.9 μm or less, more preferably 0.2 μm or less. When the average diameter of the core substance is not less than the above lower limit and not more than the above upper limit, the connection resistance between the electrodes is effectively reduced.

  The “average diameter (average particle diameter)” of the core substance indicates a number average diameter (number average particle diameter). The average diameter of the core material is obtained by observing 50 arbitrary core materials with an electron microscope or an optical microscope and calculating an average value.

  The number of the protrusions per conductive particle is preferably 3 or more, more preferably 5 or more. The upper limit of the number of protrusions is not particularly limited. The upper limit of the number of protrusions can be appropriately selected in consideration of the particle diameter of the conductive particles.

  The average height of the plurality of protrusions is preferably 0.001 μm or more, more preferably 0.05 μm or more, preferably 0.9 μm or less, more preferably 0.2 μm or less. When the average height of the protrusions is not less than the above lower limit and not more than the above upper limit, the connection resistance between the electrodes is effectively reduced.

[Insulating material]
The conductive particles preferably include an insulating material disposed on the outer surface of the conductive part. In this case, when the conductive particles are used for connection between the electrodes, a short circuit between adjacent electrodes can be further prevented. Specifically, when a plurality of conductive particles are in contact with each other, an insulating material is present between the plurality of electrodes, so that it is possible to prevent a short circuit between electrodes adjacent in the lateral direction instead of between the upper and lower electrodes. It should be noted that the insulating material between the conductive portion of the conductive particles and the electrode can be easily removed by pressurizing the conductive particles with the two electrodes when connecting the electrodes. When the conductive particles have a plurality of protrusions on the outer surface of the conductive part, the insulating substance between the conductive part of the conductive particles and the electrode can be more easily removed.

  The insulating substance is preferably an insulating particle because the insulating substance can be more easily removed when the electrodes are pressed.

  Specific examples of the insulating resin that is the material of the insulating material include polyolefins, (meth) acrylate polymers, (meth) acrylate copolymers, block polymers, thermoplastic resins, crosslinked thermoplastic resins, heat Examples thereof include curable resins and water-soluble resins.

  The average diameter (average particle diameter) of the insulating material can be appropriately selected depending on the particle diameter of the conductive particles, the use of the conductive particles, and the like. The average diameter (average particle diameter) of the insulating material is preferably 0.005 μm or more, more preferably 0.01 μm or more, preferably 1 μm or less, more preferably 0.5 μm or less. When the average diameter of the insulating material is equal to or greater than the lower limit, when the conductive particles are dispersed in the binder resin, the conductive portions in the plurality of conductive particles are difficult to contact each other. When the average diameter of the insulating particles is not more than the above upper limit, it is not necessary to increase the pressure too much in order to eliminate the insulating substance between the electrodes and the conductive particles when connecting the electrodes, There is no need to heat to high temperatures.

  The “average diameter (average particle diameter)” of the insulating material indicates a number average diameter (number average particle diameter). The average diameter of the insulating material is determined using a particle size distribution measuring device or the like.

(Conductive material)
The conductive material according to the present invention includes the conductive particles described above and a binder resin. The conductive particles are preferably dispersed in a binder resin and used as a conductive material. The conductive material is preferably an anisotropic conductive material. The conductive particles and the conductive material are each preferably used for electrical connection between electrodes. The conductive material is preferably a circuit connection material.

  The binder resin is not particularly limited. As the binder resin, a known insulating resin is used.

  Examples of the binder resin include vinyl resins, thermoplastic resins, curable resins, thermoplastic block copolymers, and elastomers. As for the said binder resin, only 1 type may be used and 2 or more types may be used together.

  Examples of the vinyl resin include vinyl acetate resin, acrylic resin, and styrene resin. Examples of the thermoplastic resin include polyolefin resins, ethylene-vinyl acetate copolymers, and polyamide resins. Examples of the curable resin include an epoxy resin, a urethane resin, a polyimide resin, and an unsaturated polyester resin. The curable resin may be a room temperature curable resin, a thermosetting resin, a photocurable resin, or a moisture curable resin. The curable resin may be used in combination with a curing agent. Examples of the thermoplastic block copolymer include a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a hydrogenated product of a styrene-butadiene-styrene block copolymer, and a styrene-isoprene. -Hydrogenated product of a styrene block copolymer. Examples of the elastomer include styrene-butadiene copolymer rubber and acrylonitrile-styrene block copolymer rubber.

  The conductive material and the binder resin preferably contain a thermoplastic component or a thermosetting component. The conductive material and the binder resin may contain a thermoplastic component or may contain a thermosetting component. The conductive material and the binder resin preferably contain a thermosetting component. The thermosetting component preferably contains a curable compound that can be cured by heating and a thermosetting agent. The curable compound curable by heating and the thermosetting agent are used in an appropriate blending ratio so that the binder resin is cured.

  In addition to the conductive particles and the binder resin, the conductive material includes, for example, a filler, an extender, a softener, a plasticizer, a polymerization catalyst, a curing catalyst, a colorant, an antioxidant, a heat stabilizer, and a light stabilizer. Various additives such as an agent, an ultraviolet absorber, a lubricant, an antistatic agent and a flame retardant may be contained.

  The conductive material can be used as a conductive paste and a conductive film. When the conductive material is a conductive film, a film that does not include conductive particles may be laminated on a conductive film that includes conductive particles. The conductive paste is preferably an anisotropic conductive paste. The conductive film is preferably an anisotropic conductive film.

  In 100% by weight of the conductive material, the content of the binder resin is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 50% by weight or more, particularly preferably 70% by weight or more, preferably 99.% or more. It is 99 weight% or less, More preferably, it is 99.9 weight% or less. When the content of the binder resin is not less than the above lower limit and not more than the above upper limit, the conductive particles are efficiently arranged between the electrodes, and the conduction reliability of the connection target member connected by the conductive material is further increased.

  In 100% by weight of the conductive material, the content of the conductive particles is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 40% by weight or less, more preferably 20% by weight or less, More preferably, it is 10 weight% or less. When the content of the conductive particles is not less than the above lower limit and not more than the above upper limit, the conduction reliability between the electrodes is further enhanced.

(Connection structure)
A connection structure can be obtained by connecting the connection object members using the conductive particles or using a conductive material containing the conductive particles and a binder resin.

  The connection structure includes a first connection target member, a second connection target member, and a connection portion connecting the first and second connection target members, and the connection portion is a conductive member of the present invention. It is preferable that the connection structure be formed of conductive particles or formed of a conductive material containing the conductive particles and a binder resin. In the case where conductive particles are used, the connection portion itself is conductive particles. That is, the first and second connection target members are connected by the conductive particles.

  In FIG. 4, the connection structure using the electroconductive particle which concerns on the 1st Embodiment of this invention is typically shown with front sectional drawing.

  4 includes a first connection target member 52, a second connection target member 53, and a connection portion 54 that connects the first and second connection target members 52 and 53. Prepare. The connection portion 54 is formed by curing a conductive material including the conductive particles 1. In FIG. 4, the conductive particles 1 are schematically shown for convenience of illustration. Instead of the conductive particles 1, conductive particles 11, 21, etc. may be used.

  The first connection target member 52 has a plurality of first electrodes 52a on the surface (upper surface). The second connection target member 53 has a plurality of second electrodes 53a on the surface (lower surface). The first electrode 52 a and the second electrode 53 a are electrically connected by one or a plurality of conductive particles 1. Therefore, the first and second connection target members 52 and 53 are electrically connected by the conductive particles 1.

The manufacturing method of the connection structure is not particularly limited. As an example of the manufacturing method of the connection structure, the conductive material is disposed between the first connection target member and the second connection target member to obtain a multilayer body, and then the multilayer body is heated. And a method of applying pressure. The pressure of the said pressurization is about 9.8 * 10 < ⁴ > -4.9 * 10 < ⁶ > Pa. The temperature of the said heating is about 120-220 degreeC.

  Specific examples of the connection target member include electronic components such as semiconductor chips, capacitors, and diodes, and electronic components such as printed boards, flexible printed boards, glass epoxy boards, and glass boards. The connection target member is preferably an electronic component. The conductive particles are preferably used for electrical connection of electrodes in an electronic component.

  Examples of the electrode provided on the connection target member include metal electrodes such as a gold electrode, a nickel electrode, a tin electrode, an aluminum electrode, a copper electrode, a silver electrode, a molybdenum electrode, and a tungsten electrode. When the connection object member is a flexible printed board, the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, or a copper electrode. When the connection target member is a glass substrate, the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, or a tungsten electrode. In addition, when the said electrode is an aluminum electrode, the electrode formed only with aluminum may be sufficient and the electrode by which the aluminum layer was laminated | stacked on the surface of the metal oxide layer may be sufficient. Examples of the material for the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, Al, and Ga.

  Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. The present invention is not limited only to the following examples.

Example 1
In a 500 mL reaction vessel equipped with a stirrer and a thermometer, 300 g of a 0.13% by weight aqueous ammonia solution was placed. Next, 3.8 g of methyltrimethoxysilane, 10.8 g of vinyltrimethoxysilane, silicone alkoxy oligomer A (“X-41-1053” manufactured by Shin-Etsu Chemical Co., Ltd., methoxy group) in an aqueous ammonia solution in the reaction vessel And a mixture of ethoxy groups, epoxy groups, and alkyl groups directly bonded to silicon atoms, weight average molecular weight: about 1600) 0.4 g was slowly added. After the hydrolysis and condensation reaction proceeded with stirring, 1.6 mL of a 25% by weight aqueous ammonia solution was added, then the particles were isolated from the aqueous ammonia solution, and the resulting particles were subjected to an oxygen partial pressure of 10 ⁻¹⁰ atm, Firing was performed at 450 ° C. (firing temperature) for 2 hours (firing time) to obtain organic-inorganic hybrid particles (base material particles). The obtained organic-inorganic hybrid particles had a particle size of 3.00 μm.

  Using the obtained organic / inorganic hybrid particles, a nickel layer was formed on the surface of the organic / inorganic hybrid particles by electroless plating. The thickness of the nickel layer was 0.10 μm.

(Examples 2 to 5)
The conditions of the method for producing the conductive particles of Example 1 were changed to the conditions shown in Table 2 to produce organic-inorganic hybrid particles, and the same physical property values as shown in Table 1 below were obtained. Thus, conductive particles of Examples 2 to 5 were obtained.

(Example 6)
Base material particles similar to those in Example 1 were prepared. After dispersing 10 parts by weight of the base material particles in 100 parts by weight of an alkaline solution containing 5% by weight of a palladium catalyst solution using an ultrasonic disperser, the base material particles were taken out by filtering the solution. Next, the base particles were added to 100 parts by weight of a 1% by weight dimethylamine borane solution to activate the surface of the base particles. The substrate particles whose surface was activated were sufficiently washed with water, and then added to 500 parts by weight of distilled water and dispersed to obtain a suspension. Next, 1 g of metallic nickel particle slurry (average particle size 100 nm) was added to the dispersion over 3 minutes to obtain base particles to which the core substance was adhered. Suspension was obtained by adding the base material particle | grains to which the core substance was adhered to 500 weight part of distilled water, and making it disperse | distribute. Conductive particles were obtained in the same manner as in Example 1 except that the substrate particles were changed to the substrate particles to which the core substance was attached to obtain the physical property values shown in Table 1 below.

(Example 7)
To a 1000 mL separable flask equipped with a four-neck separable cover, stirring blade, three-way cock, condenser and temperature probe, 100 mmol of methyl methacrylate and N, N, N-trimethyl-N-2-methacryloyloxyethyl A monomer composition containing 1 mmol of ammonium chloride and 1 mmol of 2,2′-azobis (2-amidinopropane) dihydrochloride was weighed in ion-exchanged water so that the solid content was 5% by weight, and then at 200 rpm. The mixture was stirred and polymerized at 70 ° C. for 24 hours under a nitrogen atmosphere. After completion of the reaction, it was freeze-dried to obtain insulating particles having an ammonium group on the surface, an average particle size of 220 nm, and a CV value of 10%.

  The insulating particles were dispersed in ion exchange water under ultrasonic irradiation to obtain a 10 wt% aqueous dispersion of insulating particles.

  10 g of the conductive particles obtained in Example 6 were dispersed in 500 mL of ion exchange water, 4 g of an aqueous dispersion of insulating particles was added, and the mixture was stirred at room temperature for 6 hours. After filtration through a 0.3 μm mesh filter, the particles were further washed with methanol and dried to obtain conductive particles having insulating particles attached thereto.

  When observed with a scanning electron microscope (SEM), only one coating layer of insulating particles was formed on the surface of the conductive particles. The coverage of the insulating particles with respect to the area of 2.5 μm from the center of the conductive particles by image analysis (that is, the projected area of the particle diameter of the insulating particles) was calculated to be 40%.

(Example 8)
Conductive particles were obtained in the same manner as in Example 1 except that the particle size of the organic-inorganic hybrid particles was changed to 2.25 μm and the physical property values shown in Table 1 below were used.

Example 9
Conductive particles were obtained in the same manner as in Example 1 except that methyltrimethoxysilane was changed to phenyltrimethoxysilane when the organic-inorganic hybrid particles were produced, and the physical property values shown in Table 1 below were obtained. .

(Example 10)
At the time of preparing the organic / inorganic hybrid particles, the silicone alkoxy oligomer A was changed to a silicone alkoxy oligomer B (“KR-513” manufactured by Shin-Etsu Chemical Co., Ltd.) having an organic substituent of methyl / acryloyl group and an alkoxy group of methoxy group, Conductive particles were obtained in the same manner as in Example 1 except that the physical property values shown in Table 1 below were used.

(Comparative Example 1)
In a four-necked flask equipped with a cooling tube, a thermometer, and a dropping port, 804 parts by weight of ion-exchanged water, 1.2 parts by weight of 25% ammonia water, and 336.6 parts by weight of methanol are added dropwise with stirring. Hydrolysis of 3-methacryloxypropyltrimethoxysilane by adding a mixed solution of 80 parts by weight of 3-methacryloxypropyltrimethoxysilane (“KBM503” manufactured by Shin-Etsu Chemical Co., Ltd.) and 59.4 parts by weight of methanol from the mouth, A condensation reaction was performed to prepare an emulsion of polysiloxane particles having a methacryloyl group (polymerizable polysiloxane particles). Two hours after the start of the reaction, the obtained emulsion of polysiloxane particles was sampled and the particle size was measured. The particle size was 2.25 μm.

  Next, 2 parts by weight of 20% aqueous solution of polyoxyethylene styrenated ammonium sulfate ester ammonium salt (“HITENOL (registered trademark) NF-08” manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) as an emulsifier is dissolved in 80 parts by weight of ion-exchanged water. In this solution, 56 parts by weight of triallyl cyanurate (TAC) and 1.6 parts by weight of 2,2′-azobis (2,4-dimethylvaleronitrile) (“V-65” manufactured by Wako Pure Chemical Industries, Ltd.) were dissolved. The solution was added and emulsified and dispersed to prepare an emulsion of monomer components.

  The obtained emulsion was added to an emulsion of polymerizable polysiloxane particles and further stirred. One hour after the addition of the emulsified liquid, the mixed liquid was sampled and observed with a microscope. As a result, it was confirmed that the polymerizable polysiloxane particles absorbed the monomer and were enlarged.

  Next, 8 parts by weight of 20% aqueous solution of polyoxyethylene styrenated phenyl ether sulfate ammonium salt and 20.6 parts by weight of ion-exchanged water were added, and the reaction solution was heated to 65 ° C. in a nitrogen atmosphere. Holding for 2 hours, radical polymerization of the monomer component was performed. The emulsion after radical polymerization was subjected to solid-liquid separation, and the obtained cake was washed with ion-exchanged water and methanol, and then vacuum-dried at 120 ° C. for 2 hours to obtain base particles as polymer particles. The obtained base particles had a particle size of 3.00 μm.

  Conductive particles were obtained in the same manner as in Example 1 except that the substrate particles were used.

(Comparative Example 2)
In a four-necked flask equipped with a cooling tube, a thermometer, and a dropping port, 680 parts by weight of ion-exchanged water, 1.2 parts by weight of 25% aqueous ammonia, and 520 parts by weight of methanol were kept at 25 ° C. 60 parts by weight of vinyltrimethoxysilane (“KBM1003” manufactured by Shin-Etsu Chemical Co., Ltd.), which is a crosslinkable silane monomer, was dropped therein, and the internal temperature was maintained at 25 ° C. for 15 minutes, and then polyoxyethylene styrenation was performed. Hydrolysis and condensation reaction of vinyltrimethoxysilane by adding 32 parts by weight of a 20% aqueous solution of phenyl ether sulfate ammonium salt (Daiichi Kogyo Seiyaku "Hytenol NF-08") and stirring for 15 minutes. Then, an emulsion of polysiloxane particles having a vinyl group (polymerizable polysiloxane particles) was prepared. The obtained emulsion of polysiloxane particles was sampled and the particle diameter was measured. As a result, the particle diameter was 2.25 μm.

  Subsequently, 1.0 part by weight of 20% aqueous solution of polyoxyethylene styrenated phenyl ether sulfate ammonium salt (Daiichi Kogyo Seiyaku "Hytenol NF-08") as an emulsifier was dissolved in 42 parts by weight of ion-exchanged water. In the solution, 24 parts by weight of DVB960 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., divinylbenzene content 96% by weight) and 2,2′-azobis (2,4-dimethylvaleronitrile) (Wako Pure Chemical Industries, Ltd.) as a polymerization initiator A solution in which 1.0 part by weight of “V-65” (manufactured) was dissolved was added, and the mixture was emulsified and dispersed at 8000 rpm for 5 minutes with a TK homomixer (manufactured by Tokushu Kika Kogyo Co., Ltd.) to prepare a monomer emulsion. This monomer emulsion was added to an emulsion of polysiloxane particles and further stirred. One hour after the addition of the monomer emulsion, the reaction solution was sampled and observed with a microscope. As a result, it was confirmed that the specific polysiloxane particles were enlarged by absorbing the monomer composition.

  Next, the reaction solution was heated to 65 ° C. under a nitrogen atmosphere and kept at 65 ° C. for 2 hours to perform radical polymerization. After cooling the reaction solution, the obtained emulsion was subjected to solid-liquid separation, and the obtained cake was washed with ion-exchanged water and then methanol, then dried at 120 ° C. for 2 hours, and further at 350 ° C. under a nitrogen atmosphere. By performing a heat treatment for 3 hours, base material particles which are polymer particles were obtained. The obtained base particles had a particle size of 3.00 μm.

(Evaluation)
(1) Compression elastic modulus at 3 mN load (K value), displacement at 3 mN load, and compression recovery rate Compression elastic modulus at 3 mN load of conductive particles (K value), displacement of conductive particles at 3 mN load The compression recovery rate of the conductive particles was measured at 23 ° C. by the method described above. The repulsive energy was calculated from the displacement of the conductive particles at 3 mN load and the compression recovery rate of the conductive particles.

(2) Indentation state Fabrication of connection structure:
10 parts by weight of an epoxy compound that is a thermosetting compound (“EP-3300P” manufactured by Nagase ChemteX Corporation), 10 parts by weight of an epoxy compound that is a thermosetting compound (“EPICLON HP-4032D” manufactured by DIC), and heat 15 parts by weight of a curable compound (Epogosei PT, polytetramethylene glycol diglycidyl ether manufactured by Yokkaichi Gosei Co., Ltd.) and a thermal cation generator (Sun Aid “SI-60” manufactured by Sanshin Chemical Co., Ltd.) 5 parts by weight and 20 parts by weight of silica (average particle diameter of 0.25 μm) as a filler are blended, and the resulting conductive particles are contained in 100% by weight of the blend so that the content becomes 10% by weight. Then, an anisotropic conductive paste was obtained by stirring at 2000 rpm for 5 minutes using a planetary stirrer.

  A glass substrate having an Al—Ti 4% electrode pattern (Al—Ti 4% electrode thickness 1 μm) having an L / S of 20 μm / 20 μm on the upper surface was prepared. A semiconductor chip having a gold electrode pattern (gold electrode thickness 20 μm) with L / S of 20 μm / 20 μm on the lower surface was prepared.

  On the upper surface of the glass substrate, the anisotropic conductive paste immediately after fabrication was applied to a thickness of 20 μm to form an anisotropic conductive material layer. Next, the semiconductor chip was stacked on the upper surface of the anisotropic conductive material layer so that the electrodes face each other. Then, while adjusting the temperature of the head so that the temperature of the anisotropic conductive material layer becomes 170 ° C., a pressure heating head is placed on the upper surface of the semiconductor chip and a pressure of 2.5 MPa is applied to apply the anisotropic conductive material. The material layer was cured at 170 ° C. to obtain a connection structure.

  Using a differential interference microscope, the electrode provided on the glass substrate was observed from the glass substrate side of the obtained connection structure, and the presence or absence of formation of the indentation of the electrode in contact with the conductive particles was observed. The state of the indentation was determined according to the following criteria.

[Criteria for indentation state]
OO: Before the reliability test (initial stage), there are 0 spots where no particle indentation appears clearly in 50 bumps. After the reliability test, 0 places where the particle indentation does not appear clearly in 50 bumps OO: Before the reliability test (initial stage), 0 places where the particle indentation does not appear clearly. Less than 5 places where particle indentation does not appear clearly in 50 bumps after the reliability test is conducted. ○: Before the reliability test (initial stage), 0 places where no particle indentation appears clearly in 50 bumps. 5 or more and 10 or less places where particle indentation does not appear clearly in 50 bumps after the reliability test is conducted. 1 or more and less than 5 locations ×: 5 or more locations where particle pressure does not appear clearly in 50 bumps before (initial) reliability test

  The reliability test means that the connection structure is exposed to conditions of an air temperature of 85 ° C. and a humidity of 85% for 500 hours.

(3) Initial connection resistance A
Connection resistance measurement:
The connection resistance A between the opposing electrodes of the connection structure obtained by the above (2) evaluation of the presence or absence of indentation formation was measured by a four-terminal method. The initial connection resistance A was determined according to the following criteria.

[Evaluation criteria for initial connection resistance A]
○○○: Connection resistance A is 2.0Ω or less ○○: Connection resistance A exceeds 2.0Ω, 3.0Ω or less ○: Connection resistance A exceeds 3.0Ω, 5.0Ω or less Δ: Connection resistance A Exceeds 5.0Ω and 10Ω or less ×: Connection resistance A exceeds 10Ω

(4) Connection resistance after exposure to 85 ° C and 85% humidity for 500 hours (long-term reliability)
The connection structure obtained by the above (2) evaluation of the presence or absence of indentation was left for 500 hours at 85 ° C. and 85% humidity. In the connection structure after being left, the connection resistance B between the opposing electrodes of the connection structure was measured by a four-terminal method. Moreover, the connection resistance after being exposed to the conditions of 85 ° C. and humidity 85% for 500 hours was determined according to the following criteria.

[Evaluation criteria for connection resistance after exposure to 85 ° C and 85% humidity for 500 hours]
○ ○ ○: Connection resistance B is less than 1 time of connection resistance A ○ ○: Connection resistance B is 1 time or more and less than 1.5 times of connection resistance A ○: Connection resistance B is 1.5 times or more of connection resistance A Less than 2 times Δ: Connection resistance B is 2 times or more than connection resistance A, and less than 5 times ×: Connection resistance B is 5 times or more of connection resistance A

  The results are shown in Tables 1 and 2 below.

DESCRIPTION OF SYMBOLS 1 ... Conductive particle 2 ... Base material particle 3 ... Conductive part 11 ... Conductive particle 11a ... Protrusion 12 ... Conductive part 12a ... Protrusion 13 ... Core substance 14 ... Insulating substance 21 ... Conductive particle 21a ... Protrusion 22 ... Conductive part 22a ... Projection 22A ... First conductive portion 22Aa ... Projection

Claims (6)

Comprising substrate particles and a conductive portion disposed on the surface of the substrate particles,
The compression elastic modulus at 3 mN load is 5000 N / mm ² or more and 30000 N / mm ² or less,
The electroconductive particle whose repulsion energy calculated | required from the following formula at the time of 3 mN load at the compression rate of 0.33 mN / s is 0.8 or more and 1.6 or less.
Repulsive energy = Displacement at 3 mN x 3 mN load μm x 3 mN Compression recovery rate at 3 mN load   The conductive particles according to claim 1, wherein the substrate particles are resin particles or organic-inorganic hybrid particles.   The electroconductive particle of Claim 1 or 2 which has a processus | protrusion on the outer surface of the said electroconductive part.   The electroconductive particle of any one of Claims 1-3 provided with the insulating substance arrange | positioned on the outer surface of the said electroconductive part.   The electrically-conductive material containing the electroconductive particle of any one of Claims 1-4, and binder resin. A first connection target member;
A second connection target member;
A connecting portion connecting the first connection target member and the second connection target member;
The connection structure in which the said connection part is formed with the electroconductive particle of any one of Claims 1-4, or is formed with the electrically-conductive material containing the said electroconductive particle and binder resin.

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