JPWO2015099177A1 - Magnetic disk substrate and magnetic disk - Google Patents

Abstract

Provided is a magnetic disk substrate in which no foreign matter remains in a magnetic layer on a main surface after film formation. A first inclined surface formed outside the main surface of the substrate; a second inclined surface connecting the first inclined surface and the side wall surface of the substrate; and the first inclined surface and the second inclined surface. And a ridge line formed, wherein the ridge line is provided on the inner side of the main surface in the thickness direction of the substrate.

Description

  The present invention relates to a magnetic disk substrate and a magnetic disk.

  2. Description of the Related Art Today, a personal computer, a DVD (Digital Versatile Disc) recording device, or the like has a built-in hard disk device (HDD: Hard Disk Drive) for data recording. In a hard disk device, a magnetic disk having a magnetic layer provided on a substrate is used, and magnetic recording information is recorded on or read from the magnetic layer by a magnetic head slightly floated on the surface of the magnetic disk.

In order to form a magnetic layer on the substrate, 3 to 4 locations on the end face of the substrate are held and held by a claw-shaped jig, and the substrate is transferred to the film forming chamber as it is, and vacuum deposition or sputtering is performed on the main surface of the substrate. A thin film such as a magnetic layer or a protective layer is formed by a vapor deposition method such as a CVD method, a CVD method, or an IBD method.
When gripping or transporting the substrate, the end surface is rubbed to generate minute chips, and dust may be generated or cracked. For example, Patent Document 1 describes that an angle formed between a main surface of a substrate and a chamfered surface is 48 ° or more and 80 ° or less.

JP-A-11-265506

  When the outer peripheral edge of the substrate chamfered on the outer periphery is held by a jig and a film such as a magnetic film is formed to make a magnetic disk, foreign matter is detected on the main surface near the contact with the jig. It was.

  Accordingly, an object of the present invention is to provide a magnetic disk substrate in which no foreign matter remains on the main surface after film formation.

In the magnetic disk substrate, when the foreign matter detected in the vicinity of the contact portion with the nail-shaped gripping jig (holding jig) used at the time of film formation is analyzed, the component of the foreign matter is a film used for forming a magnetic layer or the like. It was confirmed to be a component of the composition. Since the laminated structure was observed in a part of the foreign matter, the jig was observed closely, and it was confirmed that a part of the film composition component deposited on the surface of the jig was peeled off at the contact portion with the substrate. This is presumably because when the substrate contacts the jig, the magnetic film or the like deposited on the jig is peeled off, and the peeled material adheres (transfers) to the vicinity of the main surface of the substrate as a foreign substance. In recent years, the conveyance speed has been increasing more and more to improve production efficiency. In order to prevent the substrate from dropping during conveyance, the gripping force with the gripping jig is increased, and the tip of the holding jig is made V-shaped. The formation is considered as the background of the above phenomenon.
In addition, a defect having a trace that was scattered radially on the main surface of the magnetic disk starting from the contact portion with the jig was also observed. A detailed analysis revealed that metal components such as a magnetic film and an intermediate layer used in the magnetic disk were mixed. This is caused by the bias voltage applied to the substrate when the diamond-like carbon (DLC) protective film is formed by the plasma CVD method or the ion beam deposition (IBD) method. It was found that the cause was the occurrence of discharge. At present, the above-mentioned film forming method is mainly used to realize a thin protective film, but it is presumed that the bias voltage tends to increase in order to obtain a denser film.
As described above, in the conventional substrate, various troubles may occur when the chamfered portion comes into contact with the holding jig.
In the production of a magnetic disk, a plurality of loaded substrates are sequentially held and transferred to a film forming chamber using a plurality of holding jigs in one film forming apparatus, and film formation is performed. At this time, strictly speaking, the shape of the holding jig is not all the same, and may be slightly different. Further, since the holding jig is repeatedly used, the surface state changes depending on the time from the start of film formation. For example, when the deposition amount of the component of the film composition on the surface of the jig increases as time passes, it becomes easy to peel off as a foreign substance when it comes into contact with the substrate. Due to these complicated factors, the position of the contact point with the holding jig and the foreign matter to be peeled vary for each substrate. When the contact point is near the main surface of the substrate, the inventors have found that the above problem becomes significant, and by devising the shape of the end portion, the probability fluctuation of the position of the contact point is eliminated, It has been found that the above problems can be reduced.

In order to solve the above problems, a first aspect of the present invention is a magnetic disk substrate,
A first inclined surface connected to the outer contour of the main surface of the substrate;
A second inclined surface connecting the first inclined surface and the side wall surface of the substrate;
A ridge formed by the first inclined surface and the second inclined surface;
With
The ridgeline is provided on the inner side in the thickness direction of the substrate than the main surface.

When the obtuse angle between the main surface and the first inclined surface and the theta _1, is _{130 ° ≦ θ 1 ≦ 170 °} , it is preferable.
When the obtuse angle between the first inclined surface and the second inclined surface and theta _3, which is _{110 ° ≦ θ 3 ≦ 170 °} , it is preferable.
It is preferable that 130 ° ≦ θ ₃ ≦ 170 °, where θ ₄ is an obtuse angle between the second inclined surface and the side wall surface of the substrate.

  The radial distance from the outer contour line of the main surface to the ridge line is preferably 10 μm or more.

  The distance from the main surface of the ridgeline in the thickness direction of the substrate is preferably 10 μm or more.

Another aspect of the present invention is a magnetic disk substrate,
The main surface,
A side wall surface orthogonal to the main surface;
A chamfered surface having two straight portions connecting the main surface and the side wall surface in a cross section perpendicular to the main surface and the side wall surface;
Have
The boundary between the two straight portions has a convex shape outward on the surface of the substrate.

Another aspect of the present invention is a magnetic disk comprising:
It is characterized in that at least a magnetic layer is provided above the main surface of any one of the above magnetic disk substrates.

  The board | substrate of this invention contact | abuts a jig in the ridgeline formed by the two-step chamfering surface of a 1st inclined surface and a 2nd inclined surface. Even if a stripped object occurs at the contact portion between the ridge line and the jig, the first inclined surface exists between the ridge line and the main surface, so the distance of the stripped object is the distance from the ridge line to the outer contour line of the main surface. If it does not exceed, the exfoliation object does not reach the main surface, and adhesion of the exfoliation object to the main surface can be prevented. On the other hand, even when the flying distance of the stripped object exceeds the distance from the ridge line to the outer contour line of the main surface, the ridge line is provided on the inner side of the main surface in the thickness direction, and the first inclined surface is the main surface. Since there is no main surface on the expected path or moving direction of the peeled object, it is possible to prevent the peeled object from adhering to the main surface.

It is a side view of the substrate for magnetic disks of this embodiment. It is an enlarged view of the II section of FIG. It is an enlarged view of the contact part with the jig of the board | substrate for magnetic discs. FIG. 6 is an enlarged view similar to FIG. 2 for a magnetic disk substrate of Comparative Example 2.

Hereinafter, a magnetic disk substrate according to an embodiment of the present invention will be described in detail.
The magnetic disk substrate has a disk shape and a ring shape in which a circular center hole concentric with the outer periphery is cut out. A magnetic disk is formed by forming magnetic layers (recording areas) in the annular areas on both sides of the magnetic disk substrate. As the magnetic disk substrate, a metal substrate (aluminum alloy substrate or an aluminum alloy substrate plated with a NiP alloy) or a glass substrate can be used. In particular, a glass substrate having a property that is less likely to be plastically deformed than a metal substrate or the like is preferably used. In the following description, the case where glass is used as the magnetic disk substrate will be described. However, the magnetic disk substrate may be a metal substrate.

FIG. 1 is a side view of a substrate according to an embodiment of the present invention, and FIG. 2 is an enlarged view of a portion II in FIG.
The substrate 1 of this embodiment is provided with a two-step chamfered surface at a portion connected to the main surface of the end surface. That is, the substrate 1 has a main surface 10 and an end surface 20, and the end surface 20 has a side surface 21, a first inclined surface 22, and a second inclined surface 23. As shown in FIG. 2, in the cross section perpendicular to the main surface 10 and the side wall surface 21, the chamfered surface includes two straight portions (the first inclined surface 22 and the second inclined surface) that connect the main surface 10 and the side wall surface 21. 23).

As shown in FIG. 2, the first inclined surface 22 is connected to a contour line C (outer contour line) on the radially outer side of the main surface 10. That is, the contour line C is a boundary line (boundary portion) between the main surface 10 and the first inclined surface 22. First inclined surface 22 has a straight portion in a cross section perpendicular to main surface 10 and side wall surface 21.
The second inclined surface 23 connects the first inclined surface 22 and the side wall surface 21. Second inclined surface 23 has a straight portion in a cross section perpendicular to main surface 10 and side wall surface 21.
A ridge line E is formed in an annular shape by the first inclined surface 22 and the second inclined surface 23. The ridge line E is a connecting portion that connects the first inclined surface 22 and the second inclined surface 23, and is a boundary portion between the first inclined surface 22 and the second inclined surface 23. The ridge line E is provided on the inner side of the main surface 10 in the thickness direction of the substrate 1. The ridge line E has a convex shape on the outer surface of the substrate 1.

The substrate 1 is held by the jig 30 (see FIG. 3) on the end face 20 when the magnetic layer is formed. FIG. 3 is an enlarged view showing a contact portion between the substrate 1 and the jig 30 when the magnetic layer is formed. As shown in FIG. 3, the substrate 1 contacts the jig 30 at the ridge line E. Even if the foreign matter adhering to the jig 30 is peeled off at the abutting portion of the substrate 1 with the jig 30 and a fallen object is generated, the first inclined surface 22 exists between the ridge line E and the main surface 10. If the flying distance of the stripped object does not exceed the distance from the ridge line E to the outer contour line C of the main surface 10, the stripped object does not reach the main surface 10. For this reason, it is possible to prevent the peeled material from adhering to the main surface 10. On the other hand, even when the flying distance of the stripped object exceeds the distance from the ridge line E to the outer contour line C of the main surface 10, the ridge line E is provided on the inner side in the thickness direction of the substrate 1 than the main surface 10. Since the one inclined surface 22 is inclined with respect to the main surface 10, the main surface 10 does not exist on the locus of the peeled object, and adhesion of the peeled object to the main surface 10 can be prevented.
In addition, as shown in FIG. 4, when the chamfered portion between the main surface 10 and the side wall surface 21 is a round type, the contact with the jig of the substrate is an arbitrary portion of the chamfered portion due to the variation in the relative position between the substrate and the jig. Therefore, the contact point between the chamfered portion and the gripping jig may be in the vicinity of the main surface 10 in some cases. When the contact with the jig of the chamfered part is in the vicinity of the main surface 10, in the manufactured magnetic disk substrate, there is a possibility that foreign matter adheres to the main surface starting from this contact or a defect is formed. is there.
On the other hand, in this embodiment, even if the relative position between the substrate 1 and the jig 30 varies, the contact point between the substrate 1 and the jig 30 is always at the position of the ridge line E. For this reason, the contact point between the substrate 1 and the jig 30 can be sufficiently separated from the main surface 10, and adhesion of foreign matters to the main surface 10 and formation of defects can be suppressed.

When the obtuse angle formed by the main surface 10 and the first inclined surface 22 is θ ₁ , it is preferable that 130 ° ≦ θ ₁ ≦ 170 °.
When θ ₁ <110 °, the substrate 1 is hardly held by the jig 30 at the ridgeline E. When the substrate 1 is not held by the ridge line E but is held by the first inclined surface 22 or the outer contour line C of the main surface 10, the foreign matter attached to the jig 30 is peeled off at the contact portion with the jig 30, When a fallen thing arises, there exists a possibility that a fallen thing may reach to the main surface 10. FIG.
On the other hand, if θ ₁ > 170 °, the locus of the peeled object from the ridge line E where the substrate 1 and the jig 30 abut cannot be sufficiently separated from the main surface 10, and the peeled object adheres to the main surface 10. There is a fear.
Here, the first inclined surface 22 is provided along the outer contour line C of the circular main surface 10, the main surface 10 is the upper bottom, the plane including the ridge line E is the lower bottom, and the central axis is the substrate 10. The side shape of the truncated cone coincides with the central axis. The obtuse angle θ ₁ is an obtuse angle formed between the generatrix on the side surface of the truncated cone and the main surface 10. That is, the obtuse angle θ ₁ is an angle formed by the first inclined surface 22 and the main surface 10 in the radial cross section of the substrate 1 (a plane including the central axis of the substrate 1).

When the main surface 10 and the obtuse angle between the second inclined surface 23 and the theta _2, a θ ₂ <θ _1. If θ ₂ ≧ θ ₁ , the ridge line E is not formed.
Here, the second inclined surface 23 has a plane including the ridge line E as an upper base, a plane including a ridge line F formed by the second inclined surface 23 and the side wall surface 21 as a lower bottom, and the central axis is the central axis of the substrate 10. The conical frustum has a side surface shape, and the obtuse angle θ ₂ is an obtuse angle formed between the generatrix of the side surface of the frustum and the main surface 10. That is, the obtuse angle θ ₂ is an angle formed by the second inclined surface 23 and the main surface 10 in the radial cross section (plane including the central axis) of the substrate 1.

When the obtuse angle formed by the first inclined surface 22 and the second inclined surface 23 is θ ₃ , it is preferable that 110 ° ≦ θ ₃ ≦ 170 °. If θ ₃ <110 °, the substrate 1 may be chipped when the substrate 1 is held by the jig 30 at the ridge line E. On the other hand, if θ ₃ > 170 °, the substrate 1 may be difficult to be held by the jig 30 at the ridge line E.
Here, θ ₃ is an obtuse angle formed by the generatrix of the side surface of the truncated cone forming the first inclined surface 22 and the generatrix of the side surface of the truncated cone forming the second inclined surface 23. That is, the obtuse angle θ ₃ is an angle formed by the first inclined surface 22 and the second inclined surface 23 in the radial cross section of the substrate 1 (a plane including the central axis of the substrate 1). At this time, θ ₃ + θ ₁ −θ ₂ = 180 °.

When the obtuse angle formed by the second inclined surface 23 and the side wall surface 21 is θ ₄ , it is preferable that 130 ° ≦ θ ₃ ≦ 170 °. If θ ₄ <110 °, the ridgeline E may make it difficult to hold the substrate 1 by the jig 30. On the other hand, if θ ₄ > 170 °, the substrate 1 may be chipped when the substrate 1 is held by the jig 30 at the ridgeline E.
Here, θ ₄ is an obtuse angle formed between the generatrix of the side surface of the truncated cone forming the second inclined surface 23 and the side wall surface 21. That is, the obtuse angle θ ₄ is an angle formed by the second inclined surface 23 and the side wall surface 21 in the radial section of the substrate 1 (a plane including the central axis of the substrate 1). At this time, θ ₁ + θ ₃ + θ ₄ = 450 °.

  The radial distance W (see FIG. 2) of the substrate 1 from the outer contour line C to the ridge line E of the main surface 10 is preferably 10 μm or more. If W is less than 10 μm, the effect of preventing the peeled material from adhering to the main surface 10 may be reduced.

  Moreover, it is preferable that the distance H (refer FIG. 2) from the main surface 10 of the ridgeline E in the thickness direction of the board | substrate 1 is 10 micrometers or more. If H is less than 10 μm, the effect of preventing the peeled material from adhering to the main surface 10 may be reduced.

  Next, a method for manufacturing a magnetic disk substrate according to an embodiment of the present invention will be described in detail.

(Method for producing glass substrate for magnetic disk)
Next, a method for manufacturing a magnetic disk glass substrate will be described as an example of the magnetic disk substrate. First, a magnetic disk glass blank, which is a material for a plate-shaped magnetic disk glass substrate having a pair of main surfaces, is produced by press molding (press molding process). Here, the glass blank for magnetic disks (hereinafter simply referred to as glass blank) is a circular glass plate produced by press molding, and is in a form before the center hole is cut out.

  Next, a circular hole is formed in the center part of the produced glass blank, and it is set as a ring-shaped (annular) glass substrate (circular hole formation process). Next, shape processing is performed on the glass substrate in which the circular holes are formed (shape processing processing). In this shape processing, the first inclined surface 22 and the second inclined surface 23 are formed by performing two-step chamfering. Thereby, a glass substrate is produced | generated.

(Shape processing)
In the shape processing according to this embodiment, two-stage chamfering is performed on the end portion of the glass substrate after the circular hole formation processing. Thereby, the end surface of the glass substrate has a side wall surface 21 orthogonal to the main surface 10 and a two-stage chamfered surface (the first inclined surface 22 and the second inclined surface 23) connecting the main surface 10 and the side wall surface 21. ) Is formed.
For example, after forming the second inclined surface 23 in the first-stage chamfering process, the first inclined surface 22 is formed by changing the angle in the second-stage chamfering process. A ridge line E is formed.
Further, after forming the first inclined surface 22 in the first-stage chamfering process, the second inclined surface 23 may be formed by changing the angle in the second-stage chamfering process.

(Process after shape processing)
Next, end-face polishing is performed on the shape-processed glass substrate (end-face polishing process). Grinding with a fixed abrasive is performed on the glass substrate that has been subjected to end surface polishing (grinding treatment). Next, 1st grinding | polishing is performed to the main surface of a glass substrate (1st grinding | polishing process). Next, chemical strengthening is performed on the glass substrate (chemical strengthening treatment). Next, second polishing is performed on the chemically strengthened glass substrate (second polishing treatment). The glass substrate for magnetic disks is obtained through the above processing.

  Thus, since various processes are performed after shape processing, the ridgeline E in the obtained magnetic disk substrate may be rounded with a curvature radius of, for example, 50 μm or less in the cross-sectional shape. If the radius of curvature is larger than 50 μm, the holding position of the magnetic disk substrate by the holding jig may vary greatly. The radius of curvature of the ridge line E is more preferably 20 μm or less. Even if the ridgeline E is rounded to such a degree, the effect of preventing the peeled material from adhering to the main surface 10 is sufficiently obtained. Further, the radius of curvature of the ridge line E is preferably 1 μm or more, and more preferably 5 μm or more. If it is smaller than 1 μm, there is a possibility that chipping will occur when gripped.

  As described above, according to the substrate 1 of the present embodiment, the ridge line E and the main surface 10 are in contact with the jig 30 at the ridge line E, even if a stripped object occurs at the contact portion of the substrate 1 with the jig 30. Since the first inclined surface 22 exists between and the distance between the ridgeline E and the outer contour line C of the main surface 10 does not exceed the distance of the exfoliated object, the exfoliated object does not reach the main surface 10 and peels off. The adhesion of the object to the main surface 10 can be prevented. On the other hand, even when the flying distance of the stripped object exceeds the distance from the ridge line E to the outer contour line C of the main surface 10, the ridge line E is provided on the inner side in the thickness direction of the substrate 1 than the main surface 10. Since the one inclined surface 22 is inclined with respect to the main surface 10, the main surface 10 does not exist on the locus of the peeled object, and adhesion of the peeled object to the main surface 10 can be prevented.

In addition, this invention is not limited to the said embodiment and Example, Of course, you may make a various improvement and change in the range which does not deviate from the main point of this invention.
Hereinafter, experimental examples according to the present invention will be described.

〔Example〕
In Examples 1 to 3, two-stage chamfering was performed on the substrate to manufacture the substrate. In Examples 1 to 3, as shown in Table 1, the substrates were manufactured by changing θ ₁ , θ ₂ , θ ₃ , and θ ₄ . The obtained substrate was held with a jig as shown in FIG. 3, and a base layer, a magnetic layer, and a protective layer were sequentially formed using a film forming apparatus provided with a plurality of vacuum chambers. The underlayer and magnetic layer were formed by sputtering, and the DLC protective layer was formed by plasma CVD while applying a bias to the substrate. 10,000 magnetic disks were manufactured each.
[Comparative Example]
In Comparative Example 1, only an inclined surface having a chamfering angle of θ _{2 with} respect to the main surface and an angle of θ ₄ with respect to the side wall surface was formed by one-step chamfering.
In Comparative Example 2, as shown in FIG. 4, the substrate was chamfered using a general grindstone formed so that the chamfered portion had a cross-sectional shape and had a curvature radius R of 150 μm.

[Measurement of foreign matter and defects]
The main surface of the substrate after forming the underlayer, magnetic layer, and protective layer is inspected using a laser-type surface defect inspection device, and the foreign matter and defects detected on the main surface of the magnetic disk are visually observed and SEM is used. Thus, the number of substrates on which foreign matter (specific foreign matter) due to peeling of the film deposited on the holding jig or radial defect (specific defect) due to arc discharge was observed was measured.
The results are shown in Table 1.

In Examples 1-9, compared with Comparative Examples 1-2, the number of foreign matters could be reduced.
In Comparative Example 1, it is considered that the substrate and the gripping tool are in contact with each other at the boundary between the main surface and the chamfered surface, and foreign matters adhere to the main surface or defects are formed from this contact point.
In Comparative Example 2, the number of substrates having foreign matters or defects was significantly increased as compared with Examples. If the chamfered portion is a round type as in Comparative Example 2, the contact point with the substrate gripping jig can be at an arbitrary position of the chamfered portion, so the gripping jig for the chamfered portion is caused by variations in the relative position between the substrate and the gripping jig. May be in the vicinity of the main surface 10. For this reason, in the magnetic disk substrate in which the contact with the gripping jig in the chamfered portion is in the vicinity of the main surface 10, it is considered that foreign matters have adhered to the main surface or defects have been formed starting from this contact. It is done.
On the other hand, in Examples 1 to 9, even if there is a variation in the relative position between the substrate and the holding jig, the contact point between the chamfered portion and the holding jig is always at the position of the ridge line E. It is considered that the surface could be separated from the surface by a sufficient distance, and adhesion of foreign matters and formation of defects could be suppressed.

Claims (8)

A magnetic disk substrate,
A first inclined surface formed outside the main surface of the substrate;
A second inclined surface connecting the first inclined surface and the side wall surface of the substrate;
A ridge formed by the first inclined surface and the second inclined surface;
With
The ridgeline is a magnetic disk substrate provided on the inner side in the thickness direction of the substrate than the main surface. 2. The magnetic disk substrate according to claim 1, wherein an obtuse angle between the main surface and the first inclined surface is θ ₁ , wherein 130 ° ≦ θ ₁ ≦ 170 °. When the obtuse angle between the first inclined surface and the second inclined surface and theta _3, which is _{110 ° ≦ θ 3 ≦ 170 °} , the magnetic disk substrate according to claim 1 or 2. 4. The magnetic disk substrate according to claim 1, wherein an obtuse angle formed by the second inclined surface and the side wall surface of the substrate is θ ₄ , wherein 130 ° ≦ θ ₃ ≦ 170 °.   The magnetic disk substrate according to claim 1, wherein a radial distance from an outer contour line of the main surface to the ridge line is 10 μm or more.   The magnetic disk substrate according to claim 1, wherein a distance from the main surface of the ridge line in the thickness direction of the substrate is 10 μm or more. A magnetic disk substrate,
The main surface,
A side wall surface orthogonal to the main surface;
A cross-section perpendicular to the main surface and the side wall surface, and a chamfered surface having two straight portions connecting the main surface and the side wall surface;
A magnetic disk substrate in which a boundary portion between the two straight portions has a convex shape outward on the surface of the substrate. A magnetic disk, wherein at least a magnetic layer is provided above the main surface of the magnetic disk substrate according to claim 1.

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