JPWO2014156689A1 - レーザ加工装置及びレーザ加工方法 - Google Patents
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/001—Axicons, waxicons, reflaxicons
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
Description
なお、「アキシコンレンズパターン」とは、アキシコンレンズの作用を実現するように生成された変調パターンを意味している(以下、同じ)。
変調パターンの表示無し :抗折強度 75.3MPa
アキシコンレンズパターンを表示 :抗折強度 109.6MPa
Claims (4)
- 加工対象物にレーザ光を集光させることにより、切断予定ラインに沿って前記加工対象物の内部に改質領域を形成するレーザ加工装置であって、
前記レーザ光を出射するレーザ光源と、
前記レーザ光源により出射された前記レーザ光を変調する空間光変調器と、
前記空間光変調器により変調された前記レーザ光を前記加工対象物に集光する集光光学系と、を備え、
前記空間光変調器は、アキシコンレンズパターンを変調パターンとして表示することにより、レーザ光照射方向に沿って近接して並ぶ複数位置に集光点が形成されるように前記レーザ光を集光させる、レーザ加工装置。 - 前記レーザ加工装置は、前記切断予定ラインに沿って前記加工対象物の内部に改質スポットを複数形成し、複数の前記改質スポットによって前記改質領域を形成するものであって、
前記空間光変調器は、前記レーザ光照射方向に沿って近接して並ぶ前記複数位置のぞれぞれに改質ドットを形成させ、
複数の前記改質ドットは、前記レーザ光照射方向に長尺形状の前記改質スポットを構成する、請求項1記載のレーザ加工装置。 - 前記空間光変調器の表示部において、
前記アキシコンレンズパターンは、入射する前記レーザ光に対し中心に位置する円領域と、前記円領域の周囲に画設され当該円領域と同心の複数の円環領域と、を有しており、
前記円領域及び複数の前記円環領域では、径方向外側から内側に行くに従って明度が徐々に明るくなるように設定されている、請求項1又は2記載のレーザ加工装置。 - 加工対象物にレーザ光を集光させることにより、切断予定ラインに沿って前記加工対象物の内部に改質領域を形成するレーザ加工方法であって、
レーザ光源から出射された前記レーザ光を空間光変調器によって変調し、前記空間光変調器で変調された前記レーザ光を前記加工対象物に集光する工程を備え、
前記レーザ光を集光する工程は、
前記空間光変調器にアキシコンレンズパターンを変調パターンとして表示することにより、レーザ光照射方向に沿って近接して並ぶ複数位置に集光点が形成されるように前記レーザ光を集光させる工程を含む、レーザ加工方法。
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JP2013065987 | 2013-03-27 | ||
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PCT/JP2014/056725 WO2014156689A1 (ja) | 2013-03-27 | 2014-03-13 | レーザ加工装置及びレーザ加工方法 |
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US (1) | US9914183B2 (ja) |
JP (1) | JP6272302B2 (ja) |
KR (1) | KR102219653B1 (ja) |
CN (1) | CN105189025B (ja) |
DE (1) | DE112014001688B4 (ja) |
TW (1) | TWI651145B (ja) |
WO (1) | WO2014156689A1 (ja) |
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JP6620976B2 (ja) * | 2015-09-29 | 2019-12-18 | 株式会社東京精密 | レーザー加工装置及びレーザー加工方法 |
US11471976B2 (en) | 2016-03-10 | 2022-10-18 | Hamamatsu Photonics K.K. | Laser light radiation device and laser light radiation method |
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DE112014001688T5 (de) | 2015-12-17 |
CN105189025A (zh) | 2015-12-23 |
WO2014156689A1 (ja) | 2014-10-02 |
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US20160052085A1 (en) | 2016-02-25 |
KR102219653B1 (ko) | 2021-02-25 |
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TW201505744A (zh) | 2015-02-16 |
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