JPWO2013132638A1 - 電子部品検査装置及び方法 - Google Patents
電子部品検査装置及び方法 Download PDFInfo
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- JPWO2013132638A1 JPWO2013132638A1 JP2014503385A JP2014503385A JPWO2013132638A1 JP WO2013132638 A1 JPWO2013132638 A1 JP WO2013132638A1 JP 2014503385 A JP2014503385 A JP 2014503385A JP 2014503385 A JP2014503385 A JP 2014503385A JP WO2013132638 A1 JPWO2013132638 A1 JP WO2013132638A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/70—Testing of connections between components and printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
12 はんだボール端子
12A はんだ接合部
20 回路基板
22 接続パッド
24A,24B LED接続用電極
26 埋め込み穴
30 LED
32 支持体
40,40A ラインイメージセンサ
41R−n,41G−n,41B−n セル
42 カラーフィルタ
44 マイクロプリズムアレイ
50 テーブル
52 回転機構
54a,54b 貫通孔
60 LSI
62 回路基板
64 半導体チップ
66 はんだボール端子
100 検査装置
110 検査装置本体
112 制御部
120 判定結果表示装置
130 移動装置
200 被検査体
Claims (11)
- 基板に実装された電子部品の実装領域内に配置された光源と、
該実装領域外に配置され、該光源からの光を受けて光の強度を検出する受光センサと、
該受光センサが検出した光の強度分布と、予め取得してある強度分布とを比較した結果に基づいて、前記実装領域内の接合部の状態を判定する制御部と
を有する電子部品検査装置。 - 請求項1記載の電子部品検査装置であって、
前記受光センサは、前記光源から照射される光が前記接合部により回折された回折光を所定の波長領域の光に分光し、該分光の強度を検出する電子部品検査装置。 - 請求項1又は2記載の電子部品検査装置であって、
前記電子部品が実装された前記基板を載置する載置台と、
該載置台を回転させる回転機構と
をさらに有する電子部品検査装置。 - 請求項1乃至3のうちいずれか一項記載の電子部品検査装置であって、
前記受光センサは、前記電子部品の一辺の長さに対応した長さのラインイメージセンサである電子部品検査装置。 - 請求項1乃至3のうちいずれか一項記載の電子部品検査装置であって、
前記受光センサは、前記電子部品の外周を囲む枠状のラインイメージセンサである電子部品検査装置。 - 請求項1乃至5のうちいずれか一項記載の電子部品検査装置であって、
前記光源は、前記基板を貫通する貫通孔に挿入された支持体の先端に設けられる電子部品検査装置。 - 請求項1乃至6のうちいずれか一項記載の電子部品検査装置であって、
前記光源は白色光発光ダイオードであり、前記受光センサは所定の色の光を選択的に透過させるカラーフィルタを含む電子部品検査装置。 - 請求項1乃至6のうちいずれか一項記載の電子部品検査装置であって、
前記光源は単色光発光ダイオードである電子部品検査装置。 - 基板と該基板に実装した電子部品との間の実装領域の内部から光を周囲に照射し、
該実装領域から出てくる光を前記電子部品の外側で受光して、光の強度分布を取得し、
取得した強度分布と予め取得しておいた強度分布とを比較して前記実装領域内の接合部の状態を判定する
電子部品検査方法。 - 請求項9記載の電子部品検査方法であって、
前記実装領域から出てきた光を分光分析して所定の波長帯域の光の強度分布を取得し、
前記所定の波長帯域の光の強度分布と、予め取得しておいた前記所定の波長帯域の光の強度分布とを比較して前記接合部の状態を判定する電子部品検査方法。 - 基板に実装された電子部品の実装領域に光を照射する光源と、
該実装領域から出てくる光を受けて、該光の強度を検出する受光センサと、
該受光センサが検出した光の強度分布と、予め取得してある強度分布とを比較した結果に基づいて、前記実装領域内の接合部の状態を判定する制御部と
を有し、
前記受光センサは、前記光源から照射される光の回折光を所定の波長領域の光に分光し、該分光の光の強度を検出する
電子部品検査装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/056028 WO2013132638A1 (ja) | 2012-03-08 | 2012-03-08 | 電子部品検査装置及び方法 |
Publications (2)
Publication Number | Publication Date |
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JPWO2013132638A1 true JPWO2013132638A1 (ja) | 2015-07-30 |
JP5930021B2 JP5930021B2 (ja) | 2016-06-08 |
Family
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Family Applications (1)
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JP2014503385A Expired - Fee Related JP5930021B2 (ja) | 2012-03-08 | 2012-03-08 | 電子部品検査装置及び方法 |
Country Status (3)
Country | Link |
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US (1) | US9541602B2 (ja) |
JP (1) | JP5930021B2 (ja) |
WO (1) | WO2013132638A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102528016B1 (ko) * | 2018-10-05 | 2023-05-02 | 삼성전자주식회사 | 솔더 부재 실장 방법 및 시스템 |
JP7419879B2 (ja) | 2020-03-02 | 2024-01-23 | 日本電気株式会社 | バンプ接合部検査装置及びバンプ接合部検査方法 |
JP7409178B2 (ja) | 2020-03-18 | 2024-01-09 | 日本電気株式会社 | 電子装置の検査装置及び検査方法 |
Citations (7)
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JPH03199947A (ja) * | 1989-12-27 | 1991-08-30 | Hitachi Ltd | はんだ付部検査方法とその装置並びに電子部品実装状態検査方法 |
JPH03215704A (ja) * | 1990-01-19 | 1991-09-20 | Fujitsu Ltd | バンプ検査装置 |
JPH10122828A (ja) * | 1996-10-23 | 1998-05-15 | Sharp Corp | バンプ外観検査装置 |
JPH11190703A (ja) * | 1997-12-26 | 1999-07-13 | Toshiba Fa Syst Eng Corp | 部品検査装置 |
JP2009170699A (ja) * | 2008-01-17 | 2009-07-30 | Toyota Motor Corp | 半導体装置の検査装置および検査方法 |
JP2010123182A (ja) * | 2008-11-19 | 2010-06-03 | Hitachi High-Technologies Corp | パターン形状検査方法及びその装置 |
JP2011122820A (ja) * | 2008-03-31 | 2011-06-23 | Micro Square Kk | 電子部品の実装部分確認用スコープ |
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JP2012132773A (ja) * | 2010-12-21 | 2012-07-12 | Hitachi High-Technologies Corp | パターンドメディアディスク表面検査装置及び検査方法 |
-
2012
- 2012-03-08 WO PCT/JP2012/056028 patent/WO2013132638A1/ja active Application Filing
- 2012-03-08 JP JP2014503385A patent/JP5930021B2/ja not_active Expired - Fee Related
-
2014
- 2014-08-22 US US14/466,500 patent/US9541602B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03199947A (ja) * | 1989-12-27 | 1991-08-30 | Hitachi Ltd | はんだ付部検査方法とその装置並びに電子部品実装状態検査方法 |
JPH03215704A (ja) * | 1990-01-19 | 1991-09-20 | Fujitsu Ltd | バンプ検査装置 |
JPH10122828A (ja) * | 1996-10-23 | 1998-05-15 | Sharp Corp | バンプ外観検査装置 |
JPH11190703A (ja) * | 1997-12-26 | 1999-07-13 | Toshiba Fa Syst Eng Corp | 部品検査装置 |
JP2009170699A (ja) * | 2008-01-17 | 2009-07-30 | Toyota Motor Corp | 半導体装置の検査装置および検査方法 |
JP2011122820A (ja) * | 2008-03-31 | 2011-06-23 | Micro Square Kk | 電子部品の実装部分確認用スコープ |
JP2010123182A (ja) * | 2008-11-19 | 2010-06-03 | Hitachi High-Technologies Corp | パターン形状検査方法及びその装置 |
Also Published As
Publication number | Publication date |
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JP5930021B2 (ja) | 2016-06-08 |
WO2013132638A1 (ja) | 2013-09-12 |
US20140361782A1 (en) | 2014-12-11 |
US9541602B2 (en) | 2017-01-10 |
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