JPWO2013027828A1 - 非接触搬送装置 - Google Patents
非接触搬送装置 Download PDFInfo
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- JPWO2013027828A1 JPWO2013027828A1 JP2013530072A JP2013530072A JPWO2013027828A1 JP WO2013027828 A1 JPWO2013027828 A1 JP WO2013027828A1 JP 2013530072 A JP2013530072 A JP 2013530072A JP 2013530072 A JP2013530072 A JP 2013530072A JP WO2013027828 A1 JPWO2013027828 A1 JP WO2013027828A1
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- fluid
- plate
- cylindrical chamber
- flow forming
- contact
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G25/00—Conveyors comprising a cyclically-moving, e.g. reciprocating, carrier or impeller which is disengaged from the load during the return part of its movement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
Abstract
Description
(1)第1実施形態
図1は、本発明の第1実施形態に係る非接触搬送装置1の構成を示す斜視図である。また、図2(a)は、非接触搬送装置1の上面図であり、図2(b)は、非接触搬送装置1の側面図である。また、図3は、非接触搬送装置1が備えるセンタリング機構13について説明する図である。非接触搬送装置1は、半導体ウェーハやガラス基板等の板状部材Wを非接触で保持して搬送するための装置である。
旋回流形成体2は、その端面22と反対側の面が基部111及び腕部112に固定されている。また、各旋回流形成体2の端面22は、基部111又は腕部112の表面からの高さが同じになっている。
図11は、本発明の第2実施形態に係る非接触搬送装置3の構成を示す斜視図である。また、図12(a)は、非接触搬送装置3の上面図であり、図12(b)は、非接触搬送装置3の側面図であり、図12(c)は、非接触搬送装置3の下面図である。また、図13は、非接触搬送装置3が備えるセンタリング機構32について説明する図である。
なお、以下の説明においては、上述の第1実施形態と同じ構成要素については、同一の符号を付し、その説明を省略する。
旋回流形成体2aは、その端面22と反対側の面が基底部31に固定されている。また、各旋回流形成体2の端面22は、基底部31の表面からの高さが同じになっている。
上記の実施形態は、以下のように変形してもよい。また、以下の変形例は、互いに組み合わせてもよい。
(3−1)変形例1
上記の実施形態では、非接触搬送装置に対して6個の旋回流形成体が設置されているが、設置される旋回流形成体の個数は2以上であれば、6以外であってもよい。仮に2個の旋回流形成体が設置される場合には、それらの旋回流形成体は、例えば板状部材Wの重心を挟んで対向するように配置される。また、旋回流形成体は、円柱形状ではなく、角柱形状であってもよい。
上記の実施形態では、非接触搬送装置に対してセンタリング機構が設置されているが、このセンタリング機構を設置しない態様としてもよい。また、第1実施形態において、センタリングガイド113の設置を省略してもよい。
上記の実施形態では、旋回流形成体に対して2つの噴出口が設けられ、2本の流体通路が形成されているが、この噴出口及び流体通路の数はそれぞれ1であっても、また3以上であってもよい。
上記の実施形態では、板状部材Wが円形の形状を有するものと想定しているが、この形状は多角形状であってもよい。この場合、各旋回流形成体の流体通路は、多角形状の板状部材Wの重心からその外周に向かって延びる線と平行に円筒室21から流体が流出するように配置される。
上記の実施形態では、旋回流形成体の円筒室から流出する流体の方向が、板状部材Wの重心から半径方向に延びる線に対して完全に平行になるように流体通路を配置することを想定しているが、完全に平行な関係とならなくてもよい。完全に平行とならなくても、それに近い関係になることにより、板状部材Wをその接線方向に回転させる力が弱まり、板状部材Wの回転を抑制するという本発明の目的は達成される。
上記の実施形態において、非接触搬送装置1の基体11と旋回流形成体2とは、一体に成型されてもよい。同様に、非接触搬送装置3の基底部31と旋回流形成体2aとは、一体に成型されてもよい。
Claims (1)
- 板状部材を非接触で搬送する非接触搬送装置であって、
板状の基体と、
前記基体に設けられる複数の旋回流形成体と
を備え、
前記複数の旋回流形成体は、それぞれ、
柱状の本体と、
前記本体の内部に形成され、その一端が開口している円筒室と、
前記本体の、前記円筒室が開口する側の面に形成される平坦状の端面と、
前記円筒室の内周面に設けられる噴出口と、
前記本体の外面に設けられる流体導入口と、
前記噴出口と前記流体導入口とを連結する流体通路と
を備え、
前記流体通路は、前記円筒室から前記端面に沿って流出する流体の方向が、前記搬送される板状部材の重心から外周に向かって延びる線と略平行になるように配置されることを特徴とする非接触搬送装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011182978 | 2011-08-24 | ||
JP2011182978 | 2011-08-24 | ||
PCT/JP2012/071446 WO2013027828A1 (ja) | 2011-08-24 | 2012-08-24 | 非接触搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013027828A1 true JPWO2013027828A1 (ja) | 2015-03-19 |
JP5918771B2 JP5918771B2 (ja) | 2016-05-18 |
Family
ID=47746563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013530072A Active JP5918771B2 (ja) | 2011-08-24 | 2012-08-24 | 非接触搬送装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9187256B2 (ja) |
EP (1) | EP2750175B1 (ja) |
JP (1) | JP5918771B2 (ja) |
KR (1) | KR20140036316A (ja) |
CN (1) | CN103733323B (ja) |
MY (1) | MY181832A (ja) |
TW (1) | TWI481542B (ja) |
WO (1) | WO2013027828A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2014165217A (ja) * | 2013-02-21 | 2014-09-08 | Tokyo Electron Ltd | 基板搬送装置および剥離システム |
EP2843695B9 (de) * | 2013-08-28 | 2021-04-14 | Mechatronic Systemtechnik GmbH | Vorrichtung, insbesondere Endeffektor |
JP6202962B2 (ja) * | 2013-09-20 | 2017-09-27 | 株式会社ディスコ | 切削装置 |
US9911640B2 (en) * | 2015-09-01 | 2018-03-06 | Boris Kesil | Universal gripping and suction chuck |
NL2018244B1 (en) * | 2017-01-27 | 2018-08-07 | Suss Microtec Lithography Gmbh | Endeffektor |
EP3605598B1 (en) * | 2017-05-11 | 2024-05-01 | Rorze Corporation | Thin-plate substrate holding finger and transfer robot provided with said finger |
JP6924488B2 (ja) * | 2018-04-12 | 2021-08-25 | 株式会社ハーモテック | 旋回流形成体 |
US10553472B2 (en) * | 2018-06-22 | 2020-02-04 | Jabil Inc. | Apparatus, system and method for providing a bernoulli-based semiconductor wafer pre-aligner |
KR102204884B1 (ko) * | 2018-09-27 | 2021-01-19 | 세메스 주식회사 | 기판 반송 로봇 및 기판 처리 설비 |
CN109677928A (zh) * | 2019-01-11 | 2019-04-26 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 机械手装置 |
JP7418924B2 (ja) * | 2020-05-13 | 2024-01-22 | 株式会社ディスコ | 保持機構 |
JP6888852B1 (ja) * | 2020-05-21 | 2021-06-16 | 株式会社ハーモテック | 搬送装置 |
CN111997985B (zh) * | 2020-07-29 | 2022-02-15 | 杭州孚亚科技有限公司 | 双空间吸附器 |
CN112606031A (zh) * | 2020-12-21 | 2021-04-06 | 昀智科技(北京)有限责任公司 | 真空吸附式环形末端夹持器 |
JP2023041150A (ja) | 2021-09-13 | 2023-03-24 | 株式会社ディスコ | ロボットハンド |
Citations (3)
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JP2005142462A (ja) * | 2003-11-10 | 2005-06-02 | Disco Abrasive Syst Ltd | ウエーハ搬送機構 |
JP2007176637A (ja) * | 2005-12-27 | 2007-07-12 | Harmotec Corp | 非接触搬送装置 |
JP2007216329A (ja) * | 2006-02-15 | 2007-08-30 | Uinzu:Kk | ハンド |
Family Cites Families (12)
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US6322116B1 (en) * | 1999-07-23 | 2001-11-27 | Asm America, Inc. | Non-contact end effector |
JP4669252B2 (ja) | 2000-06-09 | 2011-04-13 | 株式会社ハーモテック | 旋回流形成体および非接触搬送装置 |
EP1233442B1 (en) * | 2001-02-20 | 2009-10-14 | Harmotec Corporation | Non-contacting conveyance equipment |
US20040206304A1 (en) * | 2003-04-15 | 2004-10-21 | Menear John Edgar | Pressurized chuck for controlling backside wafer contamination |
JP4437415B2 (ja) * | 2004-03-03 | 2010-03-24 | リンク・パワー株式会社 | 非接触保持装置および非接触保持搬送装置 |
JP2006156692A (ja) * | 2004-11-29 | 2006-06-15 | Smc Corp | 非接触搬送装置 |
US7611182B2 (en) * | 2005-02-25 | 2009-11-03 | Semes Co., Ltd. | Wafer transfer apparatus |
JP2007176638A (ja) * | 2005-12-27 | 2007-07-12 | Harmotec Corp | 非接触搬送装置 |
US7926494B2 (en) * | 2007-07-31 | 2011-04-19 | Applied Materials, Inc. | Bernoulli blade |
KR101530978B1 (ko) * | 2008-03-24 | 2015-06-24 | 오일레스고교 가부시키가이샤 | 비접촉 반송 장치 |
CN102083720B (zh) | 2008-07-10 | 2016-03-02 | 翁令司工业股份有限公司 | 涡流形成体和非接触式运送装置 |
JP2010258129A (ja) * | 2009-04-23 | 2010-11-11 | Seiko Epson Corp | 吸引保持装置、吸引保持方法、搬送装置、及び搬送方法 |
-
2012
- 2012-08-24 WO PCT/JP2012/071446 patent/WO2013027828A1/ja active Application Filing
- 2012-08-24 TW TW101130850A patent/TWI481542B/zh active
- 2012-08-24 MY MYPI2013004187A patent/MY181832A/en unknown
- 2012-08-24 KR KR1020147003338A patent/KR20140036316A/ko active Search and Examination
- 2012-08-24 JP JP2013530072A patent/JP5918771B2/ja active Active
- 2012-08-24 EP EP12825546.0A patent/EP2750175B1/en active Active
- 2012-08-24 US US14/117,499 patent/US9187256B2/en active Active
- 2012-08-24 CN CN201280038140.7A patent/CN103733323B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005142462A (ja) * | 2003-11-10 | 2005-06-02 | Disco Abrasive Syst Ltd | ウエーハ搬送機構 |
JP2007176637A (ja) * | 2005-12-27 | 2007-07-12 | Harmotec Corp | 非接触搬送装置 |
JP2007216329A (ja) * | 2006-02-15 | 2007-08-30 | Uinzu:Kk | ハンド |
Also Published As
Publication number | Publication date |
---|---|
MY181832A (en) | 2021-01-08 |
EP2750175A4 (en) | 2015-03-25 |
TWI481542B (zh) | 2015-04-21 |
CN103733323B (zh) | 2016-08-17 |
TW201318945A (zh) | 2013-05-16 |
JP5918771B2 (ja) | 2016-05-18 |
US9187256B2 (en) | 2015-11-17 |
KR20140036316A (ko) | 2014-03-25 |
US20140227045A1 (en) | 2014-08-14 |
EP2750175B1 (en) | 2020-03-25 |
WO2013027828A1 (ja) | 2013-02-28 |
EP2750175A1 (en) | 2014-07-02 |
CN103733323A (zh) | 2014-04-16 |
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