JPWO2013014822A1 - Lamp and lighting device - Google Patents

Abstract

In the lamp (1), the LED module (11) is supported by a support member inside the globe (35), and the case (5) including the base (7) is mounted on the end side of the globe (35). The globe (35) forms a valve (3) with a stem (37) that closes the opening of the globe (35), and a fluid having a higher thermal conductivity than air is enclosed in the valve (3). The support member is composed of a plurality of rod-shaped members (9), and one or more rod-shaped members (9) are led out from the valve (3) to the outside, and the leading end portion of the support member is attached to the case (5). Thermally bonded.

Description

  The present invention relates to a lamp and an illumination device that use a light emitting element such as an LED (Light Emitting Diode) as a light source.

  In recent years, from the viewpoint of energy saving, a lamp using an LED with high efficiency and long life (hereinafter referred to as an LED lamp) has been proposed as a light bulb shaped lamp that replaces an incandescent light bulb.

  In the LED lamp, for example, a mounting substrate on which a large number of LEDs are mounted is mounted on an end portion of the case, and a circuit unit for causing the LED to emit light is housed in the case (Patent Document 1).

  While the electronic components constituting the circuit unit include components that are vulnerable to heat load, the LED generates heat when emitting light. Electronic components that are vulnerable to thermal load may be unstable in operation or have a short life due to heat generated during LED emission.

  For this reason, in order to suppress the thermal load on the circuit unit, various techniques for dissipating the heat at the time of LED emission to the outside of the LED lamp have been proposed. Specifically, a heat radiating groove is provided on the surface of the case (Patent Document 2), or the case is formed of a metal that is a good heat conducting material, whereby the heat of the LED is conducted to the base and heat is accumulated in the case. (See Non-Patent Document 1 (page 12)).

JP 2006-313717 A JP 2010-003580 A

Published “Lamp General Catalog 2010”: Panasonic Corporation Lighting Co., Ltd.

  In recent years, there has been a strong demand for higher brightness of LED lamps, and the above-described technology cannot answer this demand. That is, the amount of heat generated by the LED increases as the brightness increases, and the case becomes larger in order to release and transfer this heat. Increasing the case leads to an increase in the size of the LED lamp and cannot be applied to existing lighting devices.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a lamp having a new configuration that can cope with an increase in brightness without causing an increase in size of the lamp.

  In order to achieve the above object, the lamp according to the present invention includes a light emitting element as a light source supported by a support member inside the globe, and a case in which a base is attached is attached to the end of the globe. The globe includes a lid member that closes an opening on an end side, and a fluid having a thermal conductivity higher than that of air is sealed in the container, and the support The member is composed of a plurality of rod-shaped members, and one or more of the rod-shaped members are led out from the container to the outside, and the leading end portion is thermally joined to at least one of the case or the base. It is characterized by that.

  According to said structure, since the fluid which has a heat conductivity higher than air is enclosed in the bulb | ball, the heat | fever generated from the light emitting element can be conducted to a bulb | bulb with a fluid. As a result, the heat at the time of light emission can be radiated to the outside using a bulb.

  In addition, since the leading end of the rod-shaped member led out from the valve is connected to at least one of the case or the base, the heat that could not be transferred to the valve via the fluid is transferred from the rod-shaped member to the case or the base outside the valve. Can tell at least one.

It is a perspective view which shows the structure of the LED lamp which concerns on 1st Embodiment. It is sectional drawing of an LED lamp. (A) is a top view which shows the structure of a LED module, (b) is an AA 'arrow sectional drawing in (a), (c) is a BB' arrow in (a). It is sectional drawing. It is a perspective view which shows the mode of the heat exchanger plate in a case, (a) is the figure which looked at the heat exchanger plate from the upper side, (b) is the figure which looked at the heat exchanger plate from the lower side. It is a figure explaining manufacture of a stem. It is a figure explaining the assembly process of a lamp. It is a figure explaining the assembly process of a lamp. (A) is a figure explaining the fixing method which concerns on Example 1, an upper figure is a perspective view of the state before fixing a rod-shaped member, and a lower figure is equivalent to CC 'line of the upper figure after fixing. (B) is a figure explaining the fixing method according to Example 2, the upper figure is a perspective view of the state before fixing the rod-shaped member, and the lower figure is after fixing FIG. 6 is a cross-sectional view taken along the line DD ′ in the upper view. (A) is a figure explaining the support method which concerns on Example 3, (a-1), (a-2) is a perspective view which shows a support state, (a-3) is (a-1), It is EE 'arrow sectional drawing of (a-2), (b) is a figure explaining the support method which concerns on Example 4, (b-1), (b-2) shows a support state. (B-3) is a cross-sectional view taken along line FF ′ of (b-1) and (b-2). The upper figure in (a) is a perspective view for explaining the form of the bar-shaped member according to Example 5, the lower figure is a sectional view taken along the line GG ′ of the upper figure, and the upper figure in (b) is Example 6. It is a perspective view explaining the form of the rod-shaped member which concerns on, and a lower figure is a HH 'line arrow sectional drawing of an upper figure. (A) is a perspective view explaining the support method of the LED module in Example 5, (b) is II 'line sectional view taken on the line of (a), (c) is J of (a). It is -J 'arrow sectional drawing. It is sectional drawing of an LED lamp. It is the schematic of the illuminating device which concerns on this invention.

<< First Embodiment >>
1. Overall Configuration FIG. 1 is a perspective view showing the structure of an LED lamp 1 according to the first embodiment. FIG. 2 is a cross-sectional view of the LED lamp 1.

  As shown in FIG. 1, the LED lamp 1 includes a bulb 3 in which a fluid having higher thermal conductivity than air is enclosed, a case 5 attached to one end of the bulb 3, and a base provided in the case 5. 7, a rod-like member 9 that penetrates the bulb 3 and extends into the case 5, and an LED module 11 provided at the bulb 3 inner end of the rod-like member 9, and the case 5 inner end of the rod-like member 9 is the case 5 is touching.

  The LED lamp 1 stores a circuit unit 13 for receiving power through the base 7 and causing the LED module 11 to emit light in the case 5, and has an overall shape similar to that of a conventional incandescent bulb.

Hereinafter, each part which comprises the LED lamp 1 is demonstrated. In the present specification, the direction in which the lamp axis X (see FIG. 2) of the LED lamp 1 extends is the lower side, and the side with the globe is the upper side.
2. Configuration of each part (1) LED module 11
FIG. 3 is a diagram showing the structure of the LED module 11. (A) is a top view of the LED module 11, (b) is AA 'arrow sectional drawing in (a) of the figure, (c) is BB in (a) of the figure. FIG.

  As shown in FIGS. 1 to 3, particularly FIG. 3, the LED module 11 includes a mounting substrate 21, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 21, and a sealing body 25 that covers the plurality of LEDs 23. Prepare.

  As shown in FIG. 3A, the mounting substrate 21 has a rectangular shape in plan view and is made of a translucent material such as glass or alumina so that light emitted downward from the LED 23 can be transmitted. It is configured.

  The mounting board 21 has a connection pattern 27a for connecting a plurality of LEDs 23 (series connection and / or parallel connection) and a terminal pattern 27b for connecting to lead wires 67 and 69 connected to the circuit unit 13. , 27c.

  The conductive path 27 is also made of a transparent electrode such as ITO so that light from the LED 23 can be transmitted.

  As shown in FIG. 3B, the lead wires 67 and 69 are connected to the terminal patterns 27 b and 27 c by solder 31 at the tip portions that pass through the through holes 29 of the mounting substrate 21 from the lower side to the upper side.

  The LED 23 is mounted on the mounting substrate 21 in a so-called chip form. As shown in FIG. 3, the plurality of LEDs 23 are arranged in two rows in parallel with the longitudinal direction of the mounting substrate 21 at intervals (for example, at equal intervals). Note that the number, arrangement, and the like of the LEDs 23 are appropriately determined depending on the luminance required for the LED lamp 1.

  The sealing body 25 is made of a translucent material such as a silicone resin, for example, and covers the LEDs 23 arranged in two rows in a row unit to prevent air and moisture from entering the LEDs 23.

  The sealing body 25 has a wavelength conversion function when it is necessary to convert the wavelength of the light emitted from the LED 23. A wavelength conversion function can be implemented by mixing wavelength conversion materials, such as fluorescent substance particles, in a translucent material, for example.

In the present embodiment, the LED 23 emits blue light as an emission color, and the wavelength conversion material converts the blue light into yellow light. Thereby, the LED module 11 will emit the white light mixed by the blue light emitted from LED23, and the yellow light wavelength-converted by the wavelength conversion material.
(2) Valve 3
As shown in FIG. 2, the bulb 3 includes a globe 35 having an opening, and a stem 37 that closes the opening of the globe 35 in an airtight manner in a state where the LED module 11 is stored in the approximate center of the globe 35. Helium (He) gas having a higher thermal conductivity than air is enclosed. Thereby, the heat of the LED module 11 at the time of lighting can be efficiently transmitted to the globe 35.

  The globe 35 is a so-called A type, and is made of a glass material that is a translucent material. As shown in FIG. 2, the globe 35 includes a hollow spherical portion 35 a and a cylindrical portion 35 b extending downward from the spherical portion 35 a, and a lower end opening of the cylindrical portion 35 b is sealed with a stem 37. ing.

  The stem 37 is a so-called flare type, and is made of a glass material that is a translucent material. The stem 37 is provided with an exhaust pipe 39 used for exhausting the inside of the bulb 3, as well as lead wires 67 and 69 for supplying power to the LED module 11, and a support for supporting the LED module 11. Each of the functioning rod-like members 9 is sealed.

The joining of the stem 37 and the globe 35 is performed by heating the part to be joined and melting the glass material at the part.
(3) Rod-shaped member 9 (support member)
The rod-shaped member 9 extends in the vertical direction, and an intermediate portion thereof is sealed to the stem 37, and the stem 37 is attached to the globe 35, thereby penetrating the valve 3. The rod-shaped member 9 is made of a metal material, for example, a jumet material.

  There are a plurality of rod-shaped members 9 (here, four), and the LED module 11 is supported at the end located in the bulb 2.

  The LED module 11 is supported by joining the end portions of the four rod-shaped members 9 to portions close to the four corners of the LED module 11 having a rectangular shape in plan view. As shown in FIG. 3C, the rod-shaped member 9 is joined by the adhesive 43 in a state where the end of the rod-shaped member 9 is inserted into the concave portion 41 of the mounting substrate 21 of the LED module 11.

The lower end portion of the rod-shaped member 9 is thermally connected to the heat transfer plate 15 that contacts the case 5. Thereby, the heat of the LED module 11 at the time of lighting is taken out of the bulb 3 through the rod-shaped member 9, and the taken-out heat is radiated (transferred) from the heat transfer plate 15 to the case 5, the base 7, and the socket of the lighting device. heat.
(4) Case 5
The case 5 has a cylindrical shape made of a resin material such as polybutylene terephthalate (PBT), and the half on the globe 35 side in the central axis direction becomes the large diameter portion 5a and the half on the base 7 side becomes the small diameter portion 5b. Yes.

  The large-diameter portion 5 a is mounted so as to be fitted to the lower end portion of the valve 3, and the small-diameter portion 5 b is provided by a base 7. A male screw is formed on the outer periphery of the small-diameter portion 5b, and is screwed with the female screw of the Edison type cap 7.

A fixing groove 5c for fixing the lead wire 65 connected to the base 7 is formed in the outer periphery of the small diameter portion 5b of the case 5 in parallel with the central axis of the case 5. Fixing means (locking means) 59 for fixing the circuit board 55 is provided. The fixing method will be described when the circuit unit 13 is described.
(5) Heat transfer plate 15
4A and 4B are perspective views showing a state of the heat transfer plate in the case, in which FIG. 4A is a view of the heat transfer plate as viewed from above, and FIG. 4B is a view of the heat transfer plate as viewed from below.

  In FIG. 4, the case, the valve, and the like are not shown.

  The heat transfer plate 15 is made of a material having excellent heat conductivity, here, an aluminum material, and has a disk shape corresponding to the inner peripheral shape of the large diameter portion 5 a of the case 5. As shown in the figure, the heat transfer plate 15 includes two lead wires 67 and 69 for connecting the LED module 11 and the circuit unit 13 on the circumference centering the through hole 46 for the exhaust pipe 39. The through holes 45 and the four through holes 47 for the rod-shaped member 9 are provided at an equal pitch.

  The lead wires 67 and 69 pass through the through hole 45 as they are, and the rod-like member 9 is fixed to the lower surface of the heat transfer plate 15 with an adhesive 49 in a state in which the lower end portion slightly protrudes from the through hole 47.

The heat transfer plate 15 has a small diameter portion 15 a on the upper side and a large diameter portion 15 b on the lower side. The outer peripheral surface of the small diameter portion 15 a is on the inner peripheral surface of the stem 37, and the outer peripheral surface of the large diameter portion 15 b is on the case 5. Each is fixed to the inner peripheral surface via an adhesive 51 (which may be either inorganic or organic). Thereby, a heat conduction path from the LED module 11 to the case 5 via the rod-shaped member 9 and the heat transfer plate 15 is established.
(6) Circuit unit 13
The circuit unit 13 includes a circuit board 55 and various electronic components 57 and 58 mounted on the circuit board 55, and receives commercial power (alternating current) received by the various electronic components 57 and 58 through the base 11. A rectifying circuit for rectifying and a smoothing circuit for smoothing the rectified DC power are configured.

  The rectifier circuit is constituted by a diode bridge 57 on the upper surface side of the circuit board 55, and the smoothing circuit is constituted by a capacitor 58 on the lower surface side of the circuit board 55, and the main body of the capacitor 58 is located inside the base 7.

  The circuit board 55 is fixed by the locking means 59 inside the case 5. Specifically, the peripheral edge portion of the lower surface of the circuit board 55 abuts on the stepped portion 59a inside the case 5, and the upper surface of the circuit board 55 is locked by the locking portion 59b. A plurality of (for example, four) locking portions 59b are formed at intervals (for example, at equal intervals) in the circumferential direction, and project toward the central axis side of the case 5 as approaching the stepped portion 59a. .

The circuit unit 13 is connected to the base 7 by lead wires 63 and 65 and to the LED module 11 by lead wires 67 and 69.
(7) Base 7
The base 7 has a function of electrically connecting the LED lamp 1 to a commercial power source in addition to a function of attaching the LED lamp 1 to a lighting fixture. The base 7 is an Edison type used in incandescent bulbs, and includes a shell portion 71 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 75 attached to the shell portion 71 via an insulating material 73. Become.

  One lead wire 65 connected to the circuit unit 13 is folded back to the outer peripheral surface side at the lower end of the small diameter portion 5 b of the case 5 and fitted into the fixing groove 5 c of the case 5 to the shell portion 71. By being covered, the shell portion 71 is connected. The other lead wire 63 is connected to the eyelet part 75 by soldering.

The base 7 is attached to the case 5 with the upper end portion of the shell portion 71 being crimped in a state where the shell portion 71 is screwed into the small diameter portion 5 b of the case 5.
3. Manufacturing method The manufacturing method of the LED lamp 1 which concerns on this embodiment is mainly demonstrated based on FIGS.

FIG. 5 is a diagram illustrating the manufacture of the stem, and FIGS. 6 and 7 are diagrams illustrating the assembly process of the lamp.
(1) Manufacture of Stem 37 An exhaust pipe 39, a pair of lead wires 67 and 69, and four rod-like members 9 are attached to the stem 37 in an airtight manner. Here, a manufacturing method of the mount 93 in which these are integrated will be described.

  First, as shown in FIG. 5A, a flare pipe 81 having a diverging shape, a thin pipe 83 for the exhaust pipe 39, two metal wires 85 for the lead wires 67 and 69, and a metal bar for the rod-like member 9 are used. 87, the upper end of the thin tube 83 is arranged in the upper part of the flare tube 81, and the two metal wires 85 and the four metal rods 87 are inserted from one end of the flare tube 81, so that the flare tube 81 is extended from both ends. The positional relationship among the thin tube 83, the metal wire 85, and the metal rod 87 is on the circumference around the thin tube 83, and the two metal wires 85 are opposed to each other with the thin tube 83 in between, and each set of two wires A pair of two metal rods 85 face each other with the narrow tube 83 interposed therebetween (see FIG. 4).

  While maintaining this positional relationship, the upper part of the flare tube 81 is heated by the burner 89. By heating, the upper part of the melted flare tube 81 and the upper end portion of the thin tube 83 are deformed and melted, and the melted glass material wraps around between the two metal wires 85 and the four metal rods 87, and the flare tube 81. The upper opening 81a is closed. As a result, as shown in FIG. 5B, the stem 37 in which the flare tube 81 and the thin tube 83 are welded is completed, and the metal wire 85 and the metal rod 87 are sealed to the stem 37.

Next, as shown in FIG. 5B, the portion of the stem 37 located above the narrow tube 83 is heated by a burner 89, and when the heated portion starts to melt, air is blown from the lower end opening of the narrow tube 83. . Eventually, air blows out from the melted portion, and an exhaust port 91 communicating with the narrow tube 83 is formed in the stem 37 as shown in FIG. Thereby, the mount 93 for holding the LED module 11 is completed.
(2) Assembly of LED lamp 1 Next, the assembly of the LED lamp 1 will be described with reference to FIGS.

  As shown in FIG. 6A, the mount 93 and the LED module 11 are prepared, and the four metal rods 87 are inserted into the recesses 41 (see FIG. 3C) of the mounting substrate 21. The front end portion 87 and the mounting substrate 21 are fixed by the adhesive 43. Thereby, the LED module 11 is supported by the metal rod 87.

  Next, the two metal wires 85 are passed through the through holes 29 of the mounting substrate 21, and the tip portions of the metal wires 85 and the terminal patterns 27 b and 27 c (see FIG. 3A) are fixed with the solder 31. Thereby, the metal wire 85 is connected to the LED module 11, and the mount 93 with the LED module 11 is completed as shown in FIG.

  Next, the LED module 11 of the mount 93 with the LED module 11 is inserted into the globe 35, the peripheral edge portion of the stem 37 and the opening end portion of the globe 35 are brought together, and the attached portion is heated by the burner 89. And the globe 35 are welded. As a result, the valve 3 is completed, the exhaust pipe 39 is used to seal the exhaust gas and helium gas in the valve 3, and the exhaust pipe 39 is then chipped off. The narrow tube 83 becomes the exhaust tube 39 when the inside of the valve 3 is evacuated.

  Subsequently, as shown in FIG. 7A, an exhaust pipe 39, two metal wires 85, and four metal rods 87 extending from the lower end of the valve 3 are connected to a metal plate 95 for the heat transfer plate 15. The metal plate 95 is brought close to the valve 3 through the corresponding through holes 95a, 95b, and 95c, and the inner peripheral surface of the lower end portion of the valve 3 and the outer periphery of the small diameter portion of the metal plate 95 are fixed by the adhesive 51.

  Then, after the circuit unit 13 is stored in the case 5 and the two metal wires 85 are connected to the circuit board 55, the case 5 is fixed to the lower end portion of the valve 3 with the adhesive 51. Note that the metal rod 87 and the metal plate 95 are connected to the case 5 and the metal plate 95 so that the heat of the LED module 11 (not lit yet) can be transferred to the case 5. 15

Next, the base 7 is screwed onto the small diameter portion 5 b of the case 5, and the metal wire connected to the circuit unit 13 is connected to the base 7. Thus, the LED lamp 1 is completed. The metal wire 85 and the like are electrically connected to the circuit unit 13 and the LED module 11 to become lead wires 67 and 69 and the like.
4). Light Distribution Characteristics In the LED lamp 1 according to the present embodiment, the LED module 11 is provided in the bulb 37 at a position corresponding to the light source (filament) position of the incandescent bulb. Thereby, the light emission center of the LED lamp 1 can be brought close to the light emission center of the conventional incandescent bulb.

  In addition, since the LED module 11 is configured using a light-transmitting mounting substrate 21, light emitted downward from the LED 23 passes through the mounting substrate 21 and is emitted from the bulb 3 to the outside.

Since the support member for the LED module 11 is composed of the four rod-shaped members 9, light emitted obliquely downward from the LED 23 can be reduced from being blocked by the rod-shaped member 9.
5. Heat Dissipation Characteristics The LED lamp 1 according to this embodiment radiates the heat of the LED 23 and the heat of the circuit unit 13 generated during lighting from a plurality of paths.
(1) Heat generated in the LED 23 Heat generated in the LED 23 is transmitted from the LED module 11 to the globe 35 via the helium gas in the bulb 3 (the first path), and further from the LED module 11 to a rod shape. It is transmitted to the globe 35 via the member 9 and the stem 37 (second route). The heat conducted to the globe 35 is released from the outer surface of the globe 35 to the atmosphere by conduction, convection, and radiation.

  In particular, since the structure is such that heat is conducted to the globe 35 via helium gas having excellent thermal conductivity, the heat transfer effect can be significantly improved as compared with the structure in which the heat of the LED 23 is conducted via the air in the globe. it can.

  In addition, since the LED module 11 is arranged at substantially the center of the spherical portion 35a of the globe 35, it becomes easy to transfer heat evenly to the helium in the bulb 3, and the globe 35 has a size similar to the glass bulb 3 of the incandescent bulb. -Because of the shape, the envelope area of the globe 35 is increased, and the heat dissipation characteristics can be improved from the globe 35 to the atmosphere.

  On the other hand, the heat of the LED 23 is transmitted from the LED module 11 to the case 5 and the base 7 via the rod-shaped member 9 and the heat transfer plate 15 (this is the third path). The heat of the case 5 is released to the atmosphere by conduction, convection, or radiation, and further transmitted to the base 7. The heat transferred to the base 7 is transferred from the socket to the lighting fixture side.

Thus, high heat dissipation characteristics can be obtained by having a plurality of heat paths for radiating heat. For example, even when the temperature of the bulb 3 rises due to the heat transmitted through the first and second paths and the heat cannot be further dissipated, the heat remaining in the LED module 11 is still high in a member other than the bulb 3. It can be transmitted to the case 5 and the base 7 which are not formed through the rod-shaped member 9.
(2) Heat generated in the circuit unit 13 The heat generated from the circuit unit 13 is transferred to the case 5 by heat transfer, convection, and radiation. Part of the heat transmitted to the case 5 is released from the case 5 to the outside by heat transfer, convection, and radiation, and the remaining heat is transferred from the base 7 to the socket on the lighting fixture side.

In the LED lamp 1, the size and shape of the globe 35 is matched to the incandescent bulb, and the LED module 11 is provided in the approximate center of the globe 35. Therefore, the distance between the LED module 11 and the circuit unit 13 is increased, and the circuit The thermal load that the unit 13 receives from the LED 23 can be reduced. Accordingly, the amount of heat stored in the case 5 is reduced, the amount of heat transmitted from the LED 23 via the rod-shaped member 9 can be increased, and the LED lamp 1 can be increased in brightness.
6). Fixing method of LED module and rod-shaped member Another example of the fixing method of the rod-shaped member and LED module will be described.

  (A) of FIG. 8 is a figure explaining the fixing method which concerns on Example 1, the upper figure is a perspective view of the state before fixing a rod-shaped member, and the lower figure is CC 'of the upper figure after fixing. It is an arrow sectional view in the position equivalent to a line, (b) is a figure explaining the fixing method concerning Example 2, the upper figure is a perspective view of the state before fixing a rod-shaped member, and the lower figure is It is arrow sectional drawing in the position equivalent to the DD 'line of the upper figure after fixation.

8 to 11 are schematic views, and illustration of the LED 23, the sealing body 25, the conductive path, the through holes 29 and 29 for the lead wires 67 and 69, and the like are omitted.
(1) Example 1
In the fixing method of Example 1, as shown in FIG. 8A, the end 103 of the rod-shaped member 101 is inserted into the through-hole 107 of the LED module 105 while the end 103 of the rod-shaped member 101 is inserted into the LED module 105. Are fixed with an adhesive 109 or the like.

  In the case of this example, when the through hole 29 for the lead wires 67 and 69 is formed, the through hole 107 for the rod-like member 9 can be formed at the same time, and the solder 31 for connecting the lead wires 67 and 69 is provided. It can also be used as an adhesive for fixing the rod-shaped member 9.

In this example, the end portion 103 of the rod-shaped member 9 is thin only at the tip in accordance with the through hole 107, and the LED module 11 is supported by the rod-shaped member 9 from below at a thick portion.
(2) Example 2
In the fixing method of Example 2, as shown in FIG. 8B, the tip end portion 113 of the rod-shaped member 111 is fixed to the LED module 115 by a pin 119 inserted through the through hole 117 of the LED module 115 from above. Also in this example, when the through holes 29 for the lead wires 67 and 69 are formed, the through holes 117 for the pins 119 can be formed at the same time.

Note that the end 113 of the rod-shaped member 111 is larger than the diameter of the through-hole 117, and the LED module 115 is supported from below by the end face.
7). LED Module Support Method Another example of the LED module support method using a rod-like member will be described.

(A) of FIG. 9 is a figure explaining the support method based on Example 3, (a-1), (a-2) is a perspective view which shows a support state, (a-3) is (a- 1) It is EE 'arrow sectional drawing of (a-2), (b) is a figure explaining the support method which concerns on Example 4, (b-1), (b-2) is It is a perspective view which shows a support state, (b-3) is FF 'arrow directional cross-sectional view of (b-1) and (b-2).
(1) Example 3
As shown in FIG. 9A, the support method of Example 3 is such that the end of the bar-shaped member 121 is joined to the gripping member 125 that holds the end of the LED module 123, so that the bar-shaped member 121 is connected to the LED module. 123 is supported.

  The grip member 125 is provided at an end portion on the short side of the LED module 123 having a rectangular shape in plan view, and one grip member 125 may be provided at each end portion as in the example of (a-1). As in the example of -2), there may be a plurality (two here) on each side.

  When the gripping member shown in (a-1) is indicated by reference numeral “125a”, the gripping member shown in (a-2) is indicated by reference numeral “125b”, and the gripping members 125a and 125b are described without distinction. Is indicated by reference numeral "125".

  The holding member 125 is made of a metal or a resin material, has a U-shaped cross section, and has a pair of contact portions 127a and 127b that contact the upper and lower surfaces of the LED module 123, and a pair of contact portions 127a, And a connecting portion 127c for connecting the end portions of 127b.

  The distance between the pair of contact portions 127a and 127b becomes narrower as the distance from the connecting portion 127c is increased in a state where the LED module 123 is not gripped, and the distance between the pair of contact portions 127a and 127b when the LED module 123 is mounted. Spread.

In this example, an adhesive is used for joining the gripping member 125 and the rod-shaped member 121 (not shown), but when the gripping member 125 is a metal, it can be welded.
(2) Example 4
As shown in FIG. 9B, the support method of Example 4 is supported by joining the end portion of the rod-shaped member 131 to the fixing means 135 that fixes the end portion of the LED module 133.

  The fixing means 135 is provided at the end portion on the short side of the LED module 11 having a rectangular shape in plan view, and there may be one fixing means at each end portion as in the example of (b-1). As in the example of -2), there may be a plurality (two here) on each side.

  The fixing means 135 includes a contact member 137 having a pair of contact portions 137 a and 137 b that contact the upper and lower surfaces of the end portion of the LED module 131, and a screw that is a connector for connecting the contact member 137 and the LED module 131. 139.

  A through hole for the screw 139 is formed in the upper contact portion 137a, and a screw hole for the screw 139 is formed in the lower contact portion 137b. In addition to the contact portions 137a and 137b, the contact member 137 includes a connecting portion 137c that connects these end portions, and has a U-shaped cross section.

  In this example, the connector uses a screw 139, but a rivet, a pin, or the like can be used, and an adhesive can also be used.

The fixing means 135 and the rod-shaped member 131 are joined using an adhesive in the same manner as in Example 3. However, when the contact member 137 is made of metal, it can be welded.
8). The aspect of the rod-shaped member 9 and a support method The other form and support method of the rod-shaped member 9 are demonstrated.

  10A and 10B are views showing the form of a rod-shaped member. FIG. 10A shows a rod-shaped member according to Example 5, and FIG. 10B shows a rod-shaped member according to Example 6. FIG.

  The upper diagram in FIG. 10A is a perspective view for explaining the form of the rod-shaped member according to Example 5, the lower diagram is a sectional view taken along the line GG ′ in the upper diagram, and the upper diagram in FIG. These are perspective views explaining the form of the rod-shaped member which concerns on Example 6, and a lower figure is a HH 'arrow directional cross-sectional view of an upper figure.

  The LED module shown in FIG. 10 is also a schematic diagram, and illustration of the LED 23, the sealing body 25, the conductive path 27, the through holes 29 for the lead wires 67 and 69, and the like is omitted.

  The rod-shaped members 201 and 211 are composed of the two rod-shaped members 9 in the embodiment, and the first linear portions 201a and 211a at the center and the second linear portions 201b on both sides of the first linear portions 201a and 211a. , 201c, 211b, and 211c, and the second straight portions 201b, 201c, 211b, and 211c have a “U” shape bent downward with respect to the first straight portions 201a and 211a. That is, the second straight lines 201b, 201c, 211b, and 211c correspond to the single rod-shaped members 9 in the embodiment.

  In Example 5, there are two U-shaped rod-shaped members 201, and as shown in FIG. 10A, these two first straight portions 201a are arranged in parallel, and the LED module 203 is mounted thereon. Fixed. In this case, if the first linear portion 201a is arranged in accordance with the plurality of LEDs 23 arranged in a row of the LED modules 203, the heat of the LEDs 23 can be efficiently led out of the bulb 3.

  In Example 6, there are two U-shaped rod-shaped members 211, and as shown in FIG. 10B, these two first straight portions 211 a have a cross shape corresponding to the diagonal line of the LED module 213. The LED module 213 is fixed thereon.

  In this case, when a plurality of LEDs are arranged in a matrix, the temperature of the central portion of the LED mounting region is the highest, and when the first straight portion 211a is crossed at the central portion of the mounting region, the heat of the LED is increased. It can be efficiently led out of the valve 3.

  (A) of FIG. 11 is a perspective view explaining the support method of the LED module in Example 5, (b) is II 'line sectional view taken on the line of (a), (c) is (a). ) Is a cross-sectional view taken along line JJ ′.

  As for the rod-shaped member 201, the 1st linear part 201a is attached to the LED module 203 via the attachment member 227. The attachment member 227 includes a receiving portion 221 that receives the first straight portion 201a from below, and contact portions 223 and 225 that are arranged on both sides of the receiving portion 221 and contact the lower surface of the LED module 203. The attachment member 227 is fixed to the LED module 203 with a connecting member 229 such as a screw or a rivet.

<< Second Embodiment >>
In the LED lamp 1 according to the first embodiment, the lower end of the rod-shaped member 9 is thermally connected to the case 5 via the heat transfer plate 15, but the lower end of the rod-shaped member may be connected to the base. It may be connected to the case and the base.

  2nd Embodiment demonstrates the LED lamp 301 which connected the lower end of the rod-shaped member to the nozzle | cap | die.

  FIG. 12 is a cross-sectional view of the LED lamp 301.

  As shown in the figure, the LED lamp 301 includes a bulb 303, a case 305, a base 307, a rod-shaped member 309, an LED module 11 and a circuit unit 311. The rod-shaped member 309 passes through the bulb 303 and is inside the case 305. The base 307 extends through the base 307 and is connected to the resin material 313 filled in the base 307.

  The valve 303 includes a globe 321 and a stem 323 that seals the opening of the globe 321 in an airtight manner, and helium gas is sealed after being evacuated through an exhaust pipe 325 provided at the top of the globe 321.

  The stem 323 is sealed with lead wires 67 and 69 between the LED module 11 and the circuit unit 311 and four rod-shaped members 309 in a state of penetrating the stem 323 in the vertical direction.

  The circuit unit 315 includes a circuit board 325 and electronic components 327 and 329 mounted substantially at the center of the upper surface of the circuit board 325, and the circuit board 325 is fixed to the case 305 by the engaging means 59. The capacitor 329 that is an electronic component is located above the diode bridge 327 that is an electronic component.

  The circuit board 325 has a through hole for the lead wires 67 and 69 and the rod-like member 309 (45 in FIG. 4) on the circumference centered on the electronic components 327 and 329 at equal intervals when viewed in plan. , 47). The lead wires 67 and 69 are soldered to the lower surface of the mounting substrate 325 when passing through the through hole, and the rod-shaped member 309 is stretched as it is to reach the resin material 313.

  The lead wire 331 connected to the circuit unit 315 is led out from the inside of the case 305 through the case 305 and the base 307, and the leading end is connected to the shell portion 335 by the solder 333.

<< Third Embodiment >>
In the embodiment and the like, the LED lamp has been particularly described, but the present invention can also be applied to an illumination device using the LED lamp.

  Since the LED lamp described in the background art uses a case as a heat dissipation member, the case is enlarged. In this case, the LED arrangement position is farther from the base than the filament position in the incandescent bulb. That is, the LED arrangement position (distance from the base) in the entire LED lamp is different from the filament position (distance from the base) in the entire incandescent lamp.

  When such an LED lamp is used in a lighting fixture having an incandescent bulb and having a reflecting mirror, for example, a downlight, a problem such as an annular shadow occurs on the irradiated surface. That is, when the light source position is different from that of the conventional incandescent bulb, a problem occurs in the light distribution characteristics and the like.

  In this modification, the case where the LED lamp 1 according to the first embodiment is mounted on a lighting fixture (downlight type) will be described.

  FIG. 13 is a schematic view of a lighting device according to the present invention.

  The lighting device 401 is used by being mounted on the ceiling 402, for example.

  As shown in FIG. 11, the lighting device 401 includes an LED lamp (for example, the LED lamp 1 described in the first embodiment), and a lighting fixture 403 that is mounted on and off the LED lamp 1. Is provided.

  The lighting fixture 403 includes, for example, a fixture main body 405 attached to the ceiling 402 and a cover 407 attached to the fixture main body 405 and covering the LED lamp 1. The cover 407 is an opening type here, and has a reflection film 411 on its inner surface that reflects light emitted from the LED lamp 1 in a predetermined direction (here, downward).

  The appliance body 405 includes a socket 409 to which the base 7 of the LED lamp 1 is attached (screwed), and power is supplied to the LED lamp 1 through the socket 409.

  In the present embodiment, since the arrangement position of the LED 23 (LED module 11) of the LED lamp 1 mounted on the lighting fixture 403 is close to the arrangement position of the filament of the incandescent bulb, the emission center in the LED lamp 1 and the emission center in the incandescent bulb. Are close to each other.

  For this reason, even if the LED lamp 1 is attached to the lighting fixture (403) to which the incandescent bulb is attached, the position of the light emission center as the lamp is similar, and thus an annular shadow is generated on the irradiated surface. The problem is less likely to occur.

  Note that the lighting fixture here is an example. For example, the lighting fixture may not have the opening-type cover 407 but may have a closed-type cover, or a posture in which the LED lamp faces sideways ( It may be a lighting fixture that is lit in a posture in which the central axis of the lamp is horizontal) or an inclined posture (a posture in which the central axis of the lamp is inclined with respect to the central axis of the lighting fixture).

  In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but it may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall. It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.

  Furthermore, although the lighting fixture is lighting one LED lamp with which it is mounted here, a plurality of, for example, three LED lamps may be mounted.

≪Modification≫
As mentioned above, although the structure of this invention was demonstrated based on the 1st-3rd embodiment, this invention is not restricted to the said embodiment. For example, the LED lamp and lighting device which combine suitably the partial structure of the LED lamp and lighting device which concern on 1st-3rd embodiment, and the structure which concerns on the following modification may be sufficient.

In addition, the materials, numerical values, and the like described in the above embodiments are merely preferable examples, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the LED lamp and the illumination device without departing from the scope of the technical idea of the present invention.
1. In the valve embodiment, the globes 35 and 321 and the stems 37 and 323 are made of glass material, and the rod-like members 9 and 309 are made of jumet material having good compatibility (adhesiveness) with the glass material. Other materials may be used as long as the properties can be maintained.

  As other materials, the globe and the stem can be made of a resin material, and the rod-like member can be made of a metal material. In the case of a resin material, for example, when a thermoplastic material is used, it can be carried out by heating and melting the joint portion between the glove and the stem, and when a thermosetting resin is used, it can be carried out by using an adhesive. Further, the gas tightness may be improved by using a gas barrier resin.

  In the embodiment, the bulbs 3 and 303 have an A-type shape, but other types such as a G-type and an R-type may be used, or a shape that is completely different from the shape of a light bulb or the like. Also good. Furthermore, although the stems 37 and 323 are flare types, for example, other types such as a disk-shaped button type may be used.

In the embodiment, the helium gas is enclosed in the valves 3 and 303, but other types of gas having a higher thermal conductivity than air may be enclosed. Other gases include neon.
2. Rod-shaped member In the embodiment, four rod-shaped members 9 and 309 are provided. However, it is preferable that there are three or more in order to stably support the LED module. Although the cross-sectional shape of the rod-shaped member was not particularly described, a circular shape is preferable in consideration of sealing to the stem.

  In the embodiment, the rod-shaped members 9 and 309 are made of a jumet material in consideration of the sealing property with the stems 37 and 323. However, for example, the jumet material is used only for the sealing portion with the stem, and other portions are separated. For example, a material such as nickel iron wire may be used. In this case, it is necessary to join members made of a plurality of materials by welding or the like to form a rod-shaped member having a predetermined length.

In the embodiment, the rod-shaped member has a bent portion at a plurality of locations in the portion arranged in the valve, but it may be a straight line or a curved shape without providing the bent portion.
3. Connection of Valve and Case In the first embodiment, the valve 3 and the case 5 are fixed by an adhesive 51. For this reason, the configuration is such that the heat of the bulb 3 is transmitted from the bulb 3 to the case 5 when the lamp is lit. However, if a fluid with high thermal conductivity is enclosed in the bulb, the temperature of the bulb rises and the heat is transferred to the case, which may increase the temperature of the case. In such a case, in order to reduce the thermal load on the circuit unit in the case, a material having low thermal conductivity may be interposed between the valve and the globe, and the two may be joined. At this time, it is preferable that the tip of the rod-shaped member led out from the valve is thermally connected to the base.
4). LED Module (1) Light Emitting Element In the embodiment and the like, the light emitting element is the LED 23, but may be, for example, an LD (laser diode) or an EL element (electric luminescence element).

Moreover, although LED23 was mounted on the mounting board by the chip type, LED may be mounted on the mounting board by the surface mounting type (what is called SMD) or a shell type, for example. Further, the plurality of LEDs may be a mixture of a chip type and a surface mount type.
(2) Mounting Board The mounting board 21 in the first and second embodiments has a rectangular shape in plan view.

  However, the mounting substrate may have other shapes such as a polygon such as a square shape and a pentagon (including a regular polygon shape), an elliptical shape, a circular shape, an annular shape, and the like.

Further, the number of mounting boards is not limited to one, but may be two or more. Furthermore, in the embodiment, the LED 23 is mounted on the front surface of the mounting substrate 21, but the LED may be mounted on the back surface.
(3) Sealing body In the first and second embodiments, the sealing body 25 covers the LEDs 23 arranged in two rows in a row unit. However, two rows may be covered together. And you may coat | cover with one sealing body with respect to several fixed number LED groups, and you may coat | cover with one sealing body with respect to all LED.
(4) Arrangement of LEDs In the first and second embodiments, the plurality of LEDs 23 are arranged in two rows, but they may be arranged so as to be positioned on four sides of a quadrangle in plan view. It may be arranged so as to be located on the circumference of an ellipse (including a circle). Furthermore, it may be arranged in a matrix.
(5) Others The LED module 11 emits white light by using the LED 23 that emits blue light and the phosphor particles that convert the wavelength of the blue light into yellow light. A combination of the semiconductor light emitting element and the phosphor particles of three colors that emit light in the three primary colors (red, green, and blue) may be used.

Further, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, may be used as the wavelength conversion material.
5. Case In the first and second embodiments and the like, the cases 5 and 305 are made of a resin material, but may be made of other materials. When using a metal material as another material, it is necessary to ensure insulation from the base. Insulation with the base can be ensured by, for example, applying an insulating film to the small-diameter portion of the case or by insulating the small-diameter portion. It can also be ensured by configuring each side with a resin material (two or more members are combined).

In the above embodiment, the surface of the cases 5 and 305 has not been particularly described. However, for example, heat radiating fins may be provided, or processing for improving the radiation rate may be performed.
6). Base In the first embodiment, etc., Edison type bases 7 and 307 are used, but other types, for example, pin types (specifically, G types such as GY and GX) are used. good.

  Further, in the above embodiment, the caps 7 and 307 are mounted (joined) to the case 5 305 by being screwed into the screw portions of the case 5 305 using the female screw of the shell portion. It may be joined to the case by other methods. Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.

  The lamp according to the present invention can be suitably used, for example, as a bulb-type LED lamp that replaces an incandescent bulb.

1 LED lamp 3 Bulb 5 Case 7 Base 9 Support member (bar-shaped member)
11 LED module 13 Circuit unit 15 Heat transfer plate

  The present invention relates to a lamp and an illumination device that use a light emitting element such as an LED (Light Emitting Diode) as a light source.

  In recent years, from the viewpoint of energy saving, a lamp using an LED with high efficiency and long life (hereinafter referred to as an LED lamp) has been proposed as a light bulb shaped lamp that replaces an incandescent light bulb.

  In the LED lamp, for example, a mounting substrate on which a large number of LEDs are mounted is mounted on an end portion of the case, and a circuit unit for causing the LED to emit light is housed in the case (Patent Document 1).

  While the electronic components constituting the circuit unit include components that are vulnerable to heat load, the LED generates heat when emitting light. Electronic components that are vulnerable to thermal load may be unstable in operation or have a short life due to heat generated during LED emission.

  For this reason, in order to suppress the thermal load on the circuit unit, various techniques for dissipating the heat at the time of LED emission to the outside of the LED lamp have been proposed. Specifically, a heat radiating groove is provided on the surface of the case (Patent Document 2), or the case is formed of a metal that is a good heat conducting material, whereby the heat of the LED is conducted to the base and heat is accumulated in the case. (See Non-Patent Document 1 (page 12)).

JP 2006-313717 A JP 2010-003580 A

Published “Lamp General Catalog 2010”: Panasonic Corporation Lighting Co., Ltd.

  In recent years, there has been a strong demand for higher brightness of LED lamps, and the above-described technology cannot answer this demand. That is, the amount of heat generated by the LED increases as the brightness increases, and the case becomes larger in order to release and transfer this heat. Increasing the case leads to an increase in the size of the LED lamp and cannot be applied to existing lighting devices.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a lamp having a new configuration that can cope with an increase in brightness without causing an increase in size of the lamp.

  In order to achieve the above object, the lamp according to the present invention includes a light emitting element as a light source supported by a support member inside the globe, and a case in which a base is attached is attached to the end of the globe. The globe includes a lid member that closes an opening on an end side, and a fluid having a thermal conductivity higher than that of air is sealed in the container, and the support The member is composed of a plurality of rod-shaped members, and one or more of the rod-shaped members are led out from the container to the outside, and the leading end portion is thermally joined to at least one of the case or the base. It is characterized by that.

  According to said structure, since the fluid which has a heat conductivity higher than air is enclosed in the bulb | ball, the heat | fever generated from the light emitting element can be conducted to a bulb | bulb with a fluid. As a result, the heat at the time of light emission can be radiated to the outside using a bulb.

  In addition, since the leading end of the rod-shaped member led out from the valve is connected to at least one of the case or the base, the heat that could not be transferred to the valve via the fluid is transferred from the rod-shaped member to the case or the base outside the valve. Can tell at least one.

It is a perspective view which shows the structure of the LED lamp which concerns on 1st Embodiment. It is sectional drawing of an LED lamp. (A) is a top view which shows the structure of a LED module, (b) is an AA 'arrow sectional drawing in (a), (c) is a BB' arrow in (a). It is sectional drawing. It is a perspective view which shows the mode of the heat exchanger plate in a case, (a) is the figure which looked at the heat exchanger plate from the upper side, (b) is the figure which looked at the heat exchanger plate from the lower side. It is a figure explaining manufacture of a stem. It is a figure explaining the assembly process of a lamp. It is a figure explaining the assembly process of a lamp. (A) is a figure explaining the fixing method which concerns on Example 1, an upper figure is a perspective view of the state before fixing a rod-shaped member, and a lower figure is equivalent to CC 'line of the upper figure after fixing. (B) is a figure explaining the fixing method according to Example 2, the upper figure is a perspective view of the state before fixing the rod-shaped member, and the lower figure is after fixing FIG. 6 is a cross-sectional view taken along the line DD ′ in the upper view. (A) is a figure explaining the support method which concerns on Example 3, (a-1), (a-2) is a perspective view which shows a support state, (a-3) is (a-1), It is EE 'arrow sectional drawing of (a-2), (b) is a figure explaining the support method which concerns on Example 4, (b-1), (b-2) shows a support state. (B-3) is a cross-sectional view taken along line FF ′ of (b-1) and (b-2). The upper figure in (a) is a perspective view for explaining the form of the bar-shaped member according to Example 5, the lower figure is a sectional view taken along the line GG ′ of the upper figure, and the upper figure in (b) is Example 6. It is a perspective view explaining the form of the rod-shaped member which concerns on, and a lower figure is a HH 'line arrow sectional drawing of an upper figure. (A) is a perspective view explaining the support method of the LED module in Example 5, (b) is II 'line sectional view taken on the line of (a), (c) is J of (a). It is -J 'arrow sectional drawing. It is sectional drawing of an LED lamp. It is the schematic of the illuminating device which concerns on this invention.

<< First Embodiment >>
1. Overall Configuration FIG. 1 is a perspective view showing the structure of an LED lamp 1 according to the first embodiment. FIG. 2 is a cross-sectional view of the LED lamp 1.

  As shown in FIG. 1, the LED lamp 1 includes a bulb 3 in which a fluid having higher thermal conductivity than air is enclosed, a case 5 attached to one end of the bulb 3, and a base provided in the case 5. 7, a rod-like member 9 that penetrates the bulb 3 and extends into the case 5, and an LED module 11 provided at the bulb 3 inner end of the rod-like member 9, and the case 5 inner end of the rod-like member 9 is the case 5 is touching.

  The LED lamp 1 stores a circuit unit 13 for receiving power through the base 7 and causing the LED module 11 to emit light in the case 5, and has an overall shape similar to that of a conventional incandescent bulb.

Hereinafter, each part which comprises the LED lamp 1 is demonstrated. In the present specification, the direction in which the lamp axis X (see FIG. 2) of the LED lamp 1 extends is the lower side, and the side with the globe is the upper side.
2. Configuration of each part (1) LED module 11
FIG. 3 is a diagram showing the structure of the LED module 11. (A) is a top view of the LED module 11, (b) is AA 'arrow sectional drawing in (a) of the figure, (c) is BB in (a) of the figure. FIG.

  As shown in FIGS. 1 to 3, particularly FIG. 3, the LED module 11 includes a mounting substrate 21, a plurality of LEDs 23 mounted on the upper surface of the mounting substrate 21, and a sealing body 25 that covers the plurality of LEDs 23. Prepare.

  As shown in FIG. 3A, the mounting substrate 21 has a rectangular shape in plan view and is made of a translucent material such as glass or alumina so that light emitted downward from the LED 23 can be transmitted. It is configured.

  The mounting board 21 has a connection pattern 27a for connecting a plurality of LEDs 23 (series connection and / or parallel connection) and a terminal pattern 27b for connecting to lead wires 67 and 69 connected to the circuit unit 13. , 27c.

  The conductive path 27 is also made of a transparent electrode such as ITO so that light from the LED 23 can be transmitted.

  As shown in FIG. 3B, the lead wires 67 and 69 are connected to the terminal patterns 27 b and 27 c by solder 31 at the tip portions that pass through the through holes 29 of the mounting substrate 21 from the lower side to the upper side.

  The LED 23 is mounted on the mounting substrate 21 in a so-called chip form. As shown in FIG. 3, the plurality of LEDs 23 are arranged in two rows in parallel with the longitudinal direction of the mounting substrate 21 at intervals (for example, at equal intervals). Note that the number, arrangement, and the like of the LEDs 23 are appropriately determined depending on the luminance required for the LED lamp 1.

  The sealing body 25 is made of a translucent material such as a silicone resin, for example, and covers the LEDs 23 arranged in two rows in a row unit to prevent air and moisture from entering the LEDs 23.

  The sealing body 25 has a wavelength conversion function when it is necessary to convert the wavelength of the light emitted from the LED 23. A wavelength conversion function can be implemented by mixing wavelength conversion materials, such as fluorescent substance particles, in a translucent material, for example.

In the present embodiment, the LED 23 emits blue light as an emission color, and the wavelength conversion material converts the blue light into yellow light. Thereby, the LED module 11 will emit the white light mixed by the blue light emitted from LED23, and the yellow light wavelength-converted by the wavelength conversion material.
(2) Valve 3
As shown in FIG. 2, the bulb 3 includes a globe 35 having an opening, and a stem 37 that closes the opening of the globe 35 in an airtight manner in a state where the LED module 11 is stored in the approximate center of the globe 35. Helium (He) gas having a higher thermal conductivity than air is enclosed. Thereby, the heat of the LED module 11 at the time of lighting can be efficiently transmitted to the globe 35.

  The globe 35 is a so-called A type, and is made of a glass material that is a translucent material. As shown in FIG. 2, the globe 35 includes a hollow spherical portion 35 a and a cylindrical portion 35 b extending downward from the spherical portion 35 a, and a lower end opening of the cylindrical portion 35 b is sealed with a stem 37. ing.

  The stem 37 is a so-called flare type, and is made of a glass material that is a translucent material. The stem 37 is provided with an exhaust pipe 39 used for exhausting the inside of the bulb 3, as well as lead wires 67 and 69 for supplying power to the LED module 11, and a support for supporting the LED module 11. Each of the functioning rod-like members 9 is sealed.

The joining of the stem 37 and the globe 35 is performed by heating the part to be joined and melting the glass material at the part.
(3) Rod-shaped member 9 (support member)
The rod-shaped member 9 extends in the vertical direction, and an intermediate portion thereof is sealed to the stem 37, and the stem 37 is attached to the globe 35, thereby penetrating the valve 3. The rod-shaped member 9 is made of a metal material, for example, a jumet material.

  There are a plurality of rod-shaped members 9 (here, four), and the LED module 11 is supported at the end located in the bulb 2.

  The LED module 11 is supported by joining the end portions of the four rod-shaped members 9 to portions close to the four corners of the LED module 11 having a rectangular shape in plan view. As shown in FIG. 3C, the rod-shaped member 9 is joined by the adhesive 43 in a state where the end of the rod-shaped member 9 is inserted into the concave portion 41 of the mounting substrate 21 of the LED module 11.

The lower end portion of the rod-shaped member 9 is thermally connected to the heat transfer plate 15 that contacts the case 5. Thereby, the heat of the LED module 11 at the time of lighting is taken out of the bulb 3 through the rod-shaped member 9, and the taken-out heat is radiated (transferred) from the heat transfer plate 15 to the case 5, the base 7, and the socket of the lighting device. heat.
(4) Case 5
The case 5 has a cylindrical shape made of a resin material such as polybutylene terephthalate (PBT), and the half on the globe 35 side in the central axis direction becomes the large diameter portion 5a and the half on the base 7 side becomes the small diameter portion 5b. Yes.

  The large-diameter portion 5 a is mounted so as to be fitted to the lower end portion of the valve 3, and the small-diameter portion 5 b is provided by a base 7. A male screw is formed on the outer periphery of the small-diameter portion 5b, and is screwed with the female screw of the Edison type cap 7.

A fixing groove 5c for fixing the lead wire 65 connected to the base 7 is formed in the outer periphery of the small diameter portion 5b of the case 5 in parallel with the central axis of the case 5. Fixing means (locking means) 59 for fixing the circuit board 55 is provided. The fixing method will be described when the circuit unit 13 is described.
(5) Heat transfer plate 15
4A and 4B are perspective views showing a state of the heat transfer plate in the case, in which FIG. 4A is a view of the heat transfer plate as viewed from above, and FIG. 4B is a view of the heat transfer plate as viewed from below.

  In FIG. 4, the case, the valve, and the like are not shown.

  The heat transfer plate 15 is made of a material having excellent heat conductivity, here, an aluminum material, and has a disk shape corresponding to the inner peripheral shape of the large diameter portion 5 a of the case 5. As shown in the figure, the heat transfer plate 15 includes two lead wires 67 and 69 for connecting the LED module 11 and the circuit unit 13 on the circumference centering the through hole 46 for the exhaust pipe 39. The through holes 45 and the four through holes 47 for the rod-shaped member 9 are provided at an equal pitch.

  The lead wires 67 and 69 pass through the through hole 45 as they are, and the rod-like member 9 is fixed to the lower surface of the heat transfer plate 15 with an adhesive 49 in a state in which the lower end portion slightly protrudes from the through hole 47.

The heat transfer plate 15 has a small diameter portion 15 a on the upper side and a large diameter portion 15 b on the lower side. The outer peripheral surface of the small diameter portion 15 a is on the inner peripheral surface of the stem 37, and the outer peripheral surface of the large diameter portion 15 b is on the case 5. Each is fixed to the inner peripheral surface via an adhesive 51 (which may be either inorganic or organic). Thereby, a heat conduction path from the LED module 11 to the case 5 via the rod-shaped member 9 and the heat transfer plate 15 is established.
(6) Circuit unit 13
The circuit unit 13 includes a circuit board 55 and various electronic components 57 and 58 mounted on the circuit board 55, and receives commercial power (alternating current) received by the various electronic components 57 and 58 through the base 11. A rectifying circuit for rectifying and a smoothing circuit for smoothing the rectified DC power are configured.

  The rectifier circuit is constituted by a diode bridge 57 on the upper surface side of the circuit board 55, and the smoothing circuit is constituted by a capacitor 58 on the lower surface side of the circuit board 55, and the main body of the capacitor 58 is located inside the base 7.

  The circuit board 55 is fixed by the locking means 59 inside the case 5. Specifically, the peripheral edge portion of the lower surface of the circuit board 55 abuts on the stepped portion 59a inside the case 5, and the upper surface of the circuit board 55 is locked by the locking portion 59b. A plurality of (for example, four) locking portions 59b are formed at intervals (for example, at equal intervals) in the circumferential direction, and project toward the central axis side of the case 5 as approaching the stepped portion 59a. .

The circuit unit 13 is connected to the base 7 by lead wires 63 and 65 and to the LED module 11 by lead wires 67 and 69.
(7) Base 7
The base 7 has a function of electrically connecting the LED lamp 1 to a commercial power source in addition to a function of attaching the LED lamp 1 to a lighting fixture. The base 7 is an Edison type used in incandescent bulbs, and includes a shell portion 71 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 75 attached to the shell portion 71 via an insulating material 73. Become.

  One lead wire 65 connected to the circuit unit 13 is folded back to the outer peripheral surface side at the lower end of the small diameter portion 5 b of the case 5 and fitted into the fixing groove 5 c of the case 5 to the shell portion 71. By being covered, the shell portion 71 is connected. The other lead wire 63 is connected to the eyelet part 75 by soldering.

The base 7 is attached to the case 5 with the upper end portion of the shell portion 71 being crimped in a state where the shell portion 71 is screwed into the small diameter portion 5 b of the case 5.
3. Manufacturing method The manufacturing method of the LED lamp 1 which concerns on this embodiment is mainly demonstrated based on FIGS.

FIG. 5 is a diagram illustrating the manufacture of the stem, and FIGS. 6 and 7 are diagrams illustrating the assembly process of the lamp.
(1) Manufacture of Stem 37 An exhaust pipe 39, a pair of lead wires 67 and 69, and four rod-like members 9 are attached to the stem 37 in an airtight manner. Here, a manufacturing method of the mount 93 in which these are integrated will be described.

  First, as shown in FIG. 5A, a flare pipe 81 having a diverging shape, a thin pipe 83 for the exhaust pipe 39, two metal wires 85 for the lead wires 67 and 69, and a metal bar for the rod-like member 9 are used. 87, the upper end of the thin tube 83 is arranged in the upper part of the flare tube 81, and the two metal wires 85 and the four metal rods 87 are inserted from one end of the flare tube 81, so that the flare tube 81 is extended from both ends. The positional relationship among the thin tube 83, the metal wire 85, and the metal rod 87 is on the circumference around the thin tube 83, and the two metal wires 85 are opposed to each other with the thin tube 83 in between, and each set of two wires A pair of two metal rods 85 face each other with the narrow tube 83 interposed therebetween (see FIG. 4).

  While maintaining this positional relationship, the upper part of the flare tube 81 is heated by the burner 89. By heating, the upper part of the melted flare tube 81 and the upper end portion of the thin tube 83 are deformed and melted, and the melted glass material wraps around between the two metal wires 85 and the four metal rods 87, and the flare tube 81. The upper opening 81a is closed. As a result, as shown in FIG. 5B, the stem 37 in which the flare tube 81 and the thin tube 83 are welded is completed, and the metal wire 85 and the metal rod 87 are sealed to the stem 37.

Next, as shown in FIG. 5B, the portion of the stem 37 located above the narrow tube 83 is heated by a burner 89, and when the heated portion starts to melt, air is blown from the lower end opening of the narrow tube 83. . Eventually, air blows out from the melted portion, and an exhaust port 91 communicating with the narrow tube 83 is formed in the stem 37 as shown in FIG. Thereby, the mount 93 for holding the LED module 11 is completed.
(2) Assembly of LED lamp 1 Next, the assembly of the LED lamp 1 will be described with reference to FIGS.

  As shown in FIG. 6A, the mount 93 and the LED module 11 are prepared, and the four metal rods 87 are inserted into the recesses 41 (see FIG. 3C) of the mounting substrate 21. The front end portion 87 and the mounting substrate 21 are fixed by the adhesive 43. Thereby, the LED module 11 is supported by the metal rod 87.

  Next, the two metal wires 85 are passed through the through holes 29 of the mounting substrate 21, and the tip portions of the metal wires 85 and the terminal patterns 27 b and 27 c (see FIG. 3A) are fixed with the solder 31. Thereby, the metal wire 85 is connected to the LED module 11, and the mount 93 with the LED module 11 is completed as shown in FIG.

  Next, the LED module 11 of the mount 93 with the LED module 11 is inserted into the globe 35, the peripheral edge portion of the stem 37 and the opening end portion of the globe 35 are brought together, and the attached portion is heated by the burner 89. And the globe 35 are welded. As a result, the valve 3 is completed, the exhaust pipe 39 is used to seal the exhaust gas and helium gas in the valve 3, and the exhaust pipe 39 is then chipped off. The narrow tube 83 becomes the exhaust tube 39 when the inside of the valve 3 is evacuated.

  Subsequently, as shown in FIG. 7A, an exhaust pipe 39, two metal wires 85, and four metal rods 87 extending from the lower end of the valve 3 are connected to a metal plate 95 for the heat transfer plate 15. The metal plate 95 is brought close to the valve 3 through the corresponding through holes 95a, 95b, and 95c, and the inner peripheral surface of the lower end portion of the valve 3 and the outer periphery of the small diameter portion of the metal plate 95 are fixed by the adhesive 51.

  Then, after the circuit unit 13 is stored in the case 5 and the two metal wires 85 are connected to the circuit board 55, the case 5 is fixed to the lower end portion of the valve 3 with the adhesive 51. Note that the metal rod 87 and the metal plate 95 are connected to the case 5 and the metal plate 95 so that the heat of the LED module 11 (not lit yet) can be transferred to the case 5. 15

Next, the base 7 is screwed onto the small diameter portion 5 b of the case 5, and the metal wire connected to the circuit unit 13 is connected to the base 7. Thus, the LED lamp 1 is completed. The metal wire 85 and the like are electrically connected to the circuit unit 13 and the LED module 11 to become lead wires 67 and 69 and the like.
4). Light Distribution Characteristics In the LED lamp 1 according to the present embodiment, the LED module 11 is provided in the bulb 37 at a position corresponding to the light source (filament) position of the incandescent bulb. Thereby, the light emission center of the LED lamp 1 can be brought close to the light emission center of the conventional incandescent bulb.

  In addition, since the LED module 11 is configured using a light-transmitting mounting substrate 21, light emitted downward from the LED 23 passes through the mounting substrate 21 and is emitted from the bulb 3 to the outside.

Since the support member for the LED module 11 is composed of the four rod-shaped members 9, light emitted obliquely downward from the LED 23 can be reduced from being blocked by the rod-shaped member 9.
5. Heat Dissipation Characteristics The LED lamp 1 according to this embodiment radiates the heat of the LED 23 and the heat of the circuit unit 13 generated during lighting from a plurality of paths.
(1) Heat generated in the LED 23 Heat generated in the LED 23 is transmitted from the LED module 11 to the globe 35 via the helium gas in the bulb 3 (the first path), and further from the LED module 11 to a rod shape. It is transmitted to the globe 35 via the member 9 and the stem 37 (second route). The heat conducted to the globe 35 is released from the outer surface of the globe 35 to the atmosphere by conduction, convection, and radiation.

  In particular, since the structure is such that heat is conducted to the globe 35 via helium gas having excellent thermal conductivity, the heat transfer effect can be significantly improved as compared with the structure in which the heat of the LED 23 is conducted via the air in the globe. it can.

  In addition, since the LED module 11 is arranged at substantially the center of the spherical portion 35a of the globe 35, it becomes easy to transfer heat evenly to the helium in the bulb 3, and the globe 35 has a size similar to the glass bulb 3 of the incandescent bulb. -Because of the shape, the envelope area of the globe 35 is increased, and the heat dissipation characteristics can be improved from the globe 35 to the atmosphere.

  On the other hand, the heat of the LED 23 is transmitted from the LED module 11 to the case 5 and the base 7 via the rod-shaped member 9 and the heat transfer plate 15 (this is the third path). The heat of the case 5 is released to the atmosphere by conduction, convection, or radiation, and further transmitted to the base 7. The heat transferred to the base 7 is transferred from the socket to the lighting fixture side.

Thus, high heat dissipation characteristics can be obtained by having a plurality of heat paths for radiating heat. For example, even when the temperature of the bulb 3 rises due to the heat transmitted through the first and second paths and the heat cannot be further dissipated, the heat remaining in the LED module 11 is still high in a member other than the bulb 3. It can be transmitted to the case 5 and the base 7 which are not formed through the rod-shaped member 9.
(2) Heat generated in the circuit unit 13 The heat generated from the circuit unit 13 is transferred to the case 5 by heat transfer, convection, and radiation. Part of the heat transmitted to the case 5 is released from the case 5 to the outside by heat transfer, convection, and radiation, and the remaining heat is transferred from the base 7 to the socket on the lighting fixture side.

In the LED lamp 1, the size and shape of the globe 35 is matched to the incandescent bulb, and the LED module 11 is provided in the approximate center of the globe 35. Therefore, the distance between the LED module 11 and the circuit unit 13 is increased, and the circuit The thermal load that the unit 13 receives from the LED 23 can be reduced. Accordingly, the amount of heat stored in the case 5 is reduced, the amount of heat transmitted from the LED 23 via the rod-shaped member 9 can be increased, and the LED lamp 1 can be increased in brightness.
6). Fixing method of LED module and rod-shaped member Another example of the fixing method of the rod-shaped member and LED module will be described.

  (A) of FIG. 8 is a figure explaining the fixing method which concerns on Example 1, the upper figure is a perspective view of the state before fixing a rod-shaped member, and the lower figure is CC 'of the upper figure after fixing. It is an arrow sectional view in the position equivalent to a line, (b) is a figure explaining the fixing method concerning Example 2, the upper figure is a perspective view of the state before fixing a rod-shaped member, and the lower figure is It is arrow sectional drawing in the position equivalent to the DD 'line of the upper figure after fixation.

8 to 11 are schematic views, and illustration of the LED 23, the sealing body 25, the conductive path, the through holes 29 and 29 for the lead wires 67 and 69, and the like are omitted.
(1) Example 1
In the fixing method of Example 1, as shown in FIG. 8A, the end 103 of the rod-shaped member 101 is inserted into the through-hole 107 of the LED module 105 while the end 103 of the rod-shaped member 101 is inserted into the LED module 105. Are fixed with an adhesive 109 or the like.

  In the case of this example, when the through hole 29 for the lead wires 67 and 69 is formed, the through hole 107 for the rod-like member 9 can be formed at the same time, and the solder 31 for connecting the lead wires 67 and 69 is provided. It can also be used as an adhesive for fixing the rod-shaped member 9.

In this example, the end portion 103 of the rod-shaped member 9 is thin only at the tip in accordance with the through hole 107, and the LED module 11 is supported by the rod-shaped member 9 from below at a thick portion.
(2) Example 2
In the fixing method of Example 2, as shown in FIG. 8B, the tip end portion 113 of the rod-shaped member 111 is fixed to the LED module 115 by a pin 119 inserted through the through hole 117 of the LED module 115 from above. Also in this example, when the through holes 29 for the lead wires 67 and 69 are formed, the through holes 117 for the pins 119 can be formed at the same time.

Note that the end 113 of the rod-shaped member 111 is larger than the diameter of the through-hole 117, and the LED module 115 is supported from below by the end face.
7). LED Module Support Method Another example of the LED module support method using a rod-like member will be described.

(A) of FIG. 9 is a figure explaining the support method based on Example 3, (a-1), (a-2) is a perspective view which shows a support state, (a-3) is (a- 1) It is EE 'arrow sectional drawing of (a-2), (b) is a figure explaining the support method which concerns on Example 4, (b-1), (b-2) is It is a perspective view which shows a support state, (b-3) is FF 'arrow directional cross-sectional view of (b-1) and (b-2).
(1) Example 3
As shown in FIG. 9A, the support method of Example 3 is such that the end of the bar-shaped member 121 is joined to the gripping member 125 that holds the end of the LED module 123, so that the bar-shaped member 121 is connected to the LED module. 123 is supported.

  The grip member 125 is provided at an end portion on the short side of the LED module 123 having a rectangular shape in plan view, and one grip member 125 may be provided at each end portion as in the example of (a-1). As in the example of -2), there may be a plurality (two here) on each side.

  When the gripping member shown in (a-1) is indicated by reference numeral “125a”, the gripping member shown in (a-2) is indicated by reference numeral “125b”, and the gripping members 125a and 125b are described without distinction. Is indicated by reference numeral "125".

  The holding member 125 is made of a metal or a resin material, has a U-shaped cross section, and has a pair of contact portions 127a and 127b that contact the upper and lower surfaces of the LED module 123, and a pair of contact portions 127a, And a connecting portion 127c for connecting the end portions of 127b.

  The distance between the pair of contact portions 127a and 127b becomes narrower as the distance from the connecting portion 127c is increased in a state where the LED module 123 is not gripped, and the distance between the pair of contact portions 127a and 127b when the LED module 123 is mounted. Spread.

In this example, an adhesive is used for joining the gripping member 125 and the rod-shaped member 121 (not shown), but when the gripping member 125 is a metal, it can be welded.
(2) Example 4
As shown in FIG. 9B, the support method of Example 4 is supported by joining the end portion of the rod-shaped member 131 to the fixing means 135 that fixes the end portion of the LED module 133.

  The fixing means 135 is provided at the end portion on the short side of the LED module 11 having a rectangular shape in plan view, and there may be one fixing means at each end portion as in the example of (b-1). As in the example of -2), there may be a plurality (two here) on each side.

  The fixing means 135 includes a contact member 137 having a pair of contact portions 137 a and 137 b that contact the upper and lower surfaces of the end portion of the LED module 131, and a screw that is a connector for connecting the contact member 137 and the LED module 131. 139.

  A through hole for the screw 139 is formed in the upper contact portion 137a, and a screw hole for the screw 139 is formed in the lower contact portion 137b. In addition to the contact portions 137a and 137b, the contact member 137 includes a connecting portion 137c that connects these end portions, and has a U-shaped cross section.

  In this example, the connector uses a screw 139, but a rivet, a pin, or the like can be used, and an adhesive can also be used.

The fixing means 135 and the rod-shaped member 131 are joined using an adhesive in the same manner as in Example 3. However, when the contact member 137 is made of metal, it can be welded.
8). The aspect of the rod-shaped member 9 and a support method The other form and support method of the rod-shaped member 9 are demonstrated.

  10A and 10B are views showing the form of a rod-shaped member. FIG. 10A shows a rod-shaped member according to Example 5, and FIG. 10B shows a rod-shaped member according to Example 6. FIG.

  The upper diagram in FIG. 10A is a perspective view for explaining the form of the rod-shaped member according to Example 5, the lower diagram is a sectional view taken along the line GG ′ in the upper diagram, and the upper diagram in FIG. These are perspective views explaining the form of the rod-shaped member which concerns on Example 6, and a lower figure is a HH 'arrow directional cross-sectional view of an upper figure.

  The LED module shown in FIG. 10 is also a schematic diagram, and illustration of the LED 23, the sealing body 25, the conductive path 27, the through holes 29 for the lead wires 67 and 69, and the like is omitted.

  The rod-shaped members 201 and 211 are composed of the two rod-shaped members 9 in the embodiment, and the first linear portions 201a and 211a at the center and the second linear portions 201b on both sides of the first linear portions 201a and 211a. , 201c, 211b, and 211c, and the second straight portions 201b, 201c, 211b, and 211c have a “U” shape bent downward with respect to the first straight portions 201a and 211a. That is, the second straight lines 201b, 201c, 211b, and 211c correspond to the single rod-shaped members 9 in the embodiment.

  In Example 5, there are two U-shaped rod-shaped members 201, and as shown in FIG. 10A, these two first straight portions 201a are arranged in parallel, and the LED module 203 is mounted thereon. Fixed. In this case, if the first linear portion 201a is arranged in accordance with the plurality of LEDs 23 arranged in a row of the LED modules 203, the heat of the LEDs 23 can be efficiently led out of the bulb 3.

  In Example 6, there are two U-shaped rod-shaped members 211, and as shown in FIG. 10B, these two first straight portions 211 a have a cross shape corresponding to the diagonal line of the LED module 213. The LED module 213 is fixed thereon.

  In this case, when a plurality of LEDs are arranged in a matrix, the temperature of the central portion of the LED mounting region is the highest, and when the first straight portion 211a is crossed at the central portion of the mounting region, the heat of the LED is increased. It can be efficiently led out of the valve 3.

  (A) of FIG. 11 is a perspective view explaining the support method of the LED module in Example 5, (b) is II 'line sectional view taken on the line of (a), (c) is (a). ) Is a cross-sectional view taken along line JJ ′.

  As for the rod-shaped member 201, the 1st linear part 201a is attached to the LED module 203 via the attachment member 227. The attachment member 227 includes a receiving portion 221 that receives the first straight portion 201a from below, and contact portions 223 and 225 that are arranged on both sides of the receiving portion 221 and contact the lower surface of the LED module 203. The attachment member 227 is fixed to the LED module 203 with a connecting member 229 such as a screw or a rivet.

<< Second Embodiment >>
In the LED lamp 1 according to the first embodiment, the lower end of the rod-shaped member 9 is thermally connected to the case 5 via the heat transfer plate 15, but the lower end of the rod-shaped member may be connected to the base. It may be connected to the case and the base.

  2nd Embodiment demonstrates the LED lamp 301 which connected the lower end of the rod-shaped member to the nozzle | cap | die.

  FIG. 12 is a cross-sectional view of the LED lamp 301.

  As shown in the figure, the LED lamp 301 includes a bulb 303, a case 305, a base 307, a rod-shaped member 309, an LED module 11 and a circuit unit 311. The rod-shaped member 309 passes through the bulb 303 and is inside the case 305. The base 307 extends through the base 307 and is connected to the resin material 313 filled in the base 307.

  The valve 303 includes a globe 321 and a stem 323 that seals the opening of the globe 321 in an airtight manner, and helium gas is sealed after being evacuated through an exhaust pipe 325 provided at the top of the globe 321.

  The stem 323 is sealed with lead wires 67 and 69 between the LED module 11 and the circuit unit 311 and four rod-shaped members 309 in a state of penetrating the stem 323 in the vertical direction.

  The circuit unit 315 includes a circuit board 325 and electronic components 327 and 329 mounted substantially at the center of the upper surface of the circuit board 325, and the circuit board 325 is fixed to the case 305 by the engaging means 59. The capacitor 329 that is an electronic component is located above the diode bridge 327 that is an electronic component.

  The circuit board 325 has a through hole for the lead wires 67 and 69 and the rod-like member 309 (45 in FIG. 4) on the circumference centered on the electronic components 327 and 329 at equal intervals when viewed in plan. , 47). The lead wires 67 and 69 are soldered to the lower surface of the mounting substrate 325 when passing through the through hole, and the rod-shaped member 309 is stretched as it is to reach the resin material 313.

  The lead wire 331 connected to the circuit unit 315 is led out from the inside of the case 305 through the case 305 and the base 307, and the leading end is connected to the shell portion 335 by the solder 333.

<< Third Embodiment >>
In the embodiment and the like, the LED lamp has been particularly described, but the present invention can also be applied to an illumination device using the LED lamp.

  Since the LED lamp described in the background art uses a case as a heat dissipation member, the case is enlarged. In this case, the LED arrangement position is farther from the base than the filament position in the incandescent bulb. That is, the LED arrangement position (distance from the base) in the entire LED lamp is different from the filament position (distance from the base) in the entire incandescent lamp.

  When such an LED lamp is used in a lighting fixture having an incandescent bulb and having a reflecting mirror, for example, a downlight, a problem such as an annular shadow occurs on the irradiated surface. That is, when the light source position is different from that of the conventional incandescent bulb, a problem occurs in the light distribution characteristics and the like.

  In this modification, the case where the LED lamp 1 according to the first embodiment is mounted on a lighting fixture (downlight type) will be described.

  FIG. 13 is a schematic view of a lighting device according to the present invention.

  The lighting device 401 is used by being mounted on the ceiling 402, for example.

  As shown in FIG. 11, the lighting device 401 includes an LED lamp (for example, the LED lamp 1 described in the first embodiment), and a lighting fixture 403 that is mounted on and off the LED lamp 1. Is provided.

  The lighting fixture 403 includes, for example, a fixture main body 405 attached to the ceiling 402 and a cover 407 attached to the fixture main body 405 and covering the LED lamp 1. The cover 407 is an opening type here, and has a reflection film 411 on its inner surface that reflects light emitted from the LED lamp 1 in a predetermined direction (here, downward).

  The appliance body 405 includes a socket 409 to which the base 7 of the LED lamp 1 is attached (screwed), and power is supplied to the LED lamp 1 through the socket 409.

  In the present embodiment, since the arrangement position of the LED 23 (LED module 11) of the LED lamp 1 mounted on the lighting fixture 403 is close to the arrangement position of the filament of the incandescent bulb, the emission center in the LED lamp 1 and the emission center in the incandescent bulb. Are close to each other.

  For this reason, even if the LED lamp 1 is attached to the lighting fixture (403) to which the incandescent bulb is attached, the position of the light emission center as the lamp is similar, and thus an annular shadow is generated on the irradiated surface. The problem is less likely to occur.

  Note that the lighting fixture here is an example. For example, the lighting fixture may not have the opening-type cover 407 but may have a closed-type cover, or a posture in which the LED lamp faces sideways ( It may be a lighting fixture that is lit in a posture in which the central axis of the lamp is horizontal) or an inclined posture (a posture in which the central axis of the lamp is inclined with respect to the central axis of the lighting fixture).

  In addition, the lighting device is a direct attachment type in which the lighting fixture is mounted in a state of being in contact with the ceiling or the wall, but it may be an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or the wall. It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.

  Furthermore, although the lighting fixture is lighting one LED lamp with which it is mounted here, a plurality of, for example, three LED lamps may be mounted.

≪Modification≫
As mentioned above, although the structure of this invention was demonstrated based on the 1st-3rd embodiment, this invention is not restricted to the said embodiment. For example, the LED lamp and lighting device which combine suitably the partial structure of the LED lamp and lighting device which concern on 1st-3rd embodiment, and the structure which concerns on the following modification may be sufficient.

In addition, the materials, numerical values, and the like described in the above embodiments are merely preferable examples, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the LED lamp and the illumination device without departing from the scope of the technical idea of the present invention.
1. In the valve embodiment, the globes 35 and 321 and the stems 37 and 323 are made of glass material, and the rod-like members 9 and 309 are made of jumet material having good compatibility (adhesiveness) with the glass material. Other materials may be used as long as the properties can be maintained.

  As other materials, the globe and the stem can be made of a resin material, and the rod-like member can be made of a metal material. In the case of a resin material, for example, when a thermoplastic material is used, it can be carried out by heating and melting the joint portion between the glove and the stem, and when a thermosetting resin is used, it can be carried out by using an adhesive. Further, the gas tightness may be improved by using a gas barrier resin.

  In the embodiment, the bulbs 3 and 303 have an A-type shape, but other types such as a G-type and an R-type may be used, or a shape that is completely different from the shape of a light bulb or the like. Also good. Furthermore, although the stems 37 and 323 are flare types, for example, other types such as a disk-shaped button type may be used.

In the embodiment, the helium gas is enclosed in the valves 3 and 303, but other types of gas having a higher thermal conductivity than air may be enclosed. Other gases include neon.
2. Rod-shaped member In the embodiment, four rod-shaped members 9 and 309 are provided. However, it is preferable that there are three or more in order to stably support the LED module. Although the cross-sectional shape of the rod-shaped member was not particularly described, a circular shape is preferable in consideration of sealing to the stem.

  In the embodiment, the rod-shaped members 9 and 309 are made of a jumet material in consideration of the sealing property with the stems 37 and 323. However, for example, the jumet material is used only for the sealing portion with the stem, and other portions are separated. For example, a material such as nickel iron wire may be used. In this case, it is necessary to join members made of a plurality of materials by welding or the like to form a rod-shaped member having a predetermined length.

In the embodiment, the rod-shaped member has a bent portion at a plurality of locations in the portion arranged in the valve, but it may be a straight line or a curved shape without providing the bent portion.
3. Connection of Valve and Case In the first embodiment, the valve 3 and the case 5 are fixed by an adhesive 51. For this reason, the configuration is such that the heat of the bulb 3 is transmitted from the bulb 3 to the case 5 when the lamp is lit. However, if a fluid with high thermal conductivity is enclosed in the bulb, the temperature of the bulb rises and the heat is transferred to the case, which may increase the temperature of the case. In such a case, in order to reduce the thermal load on the circuit unit in the case, a material having low thermal conductivity may be interposed between the valve and the globe, and the two may be joined. At this time, it is preferable that the tip of the rod-shaped member led out from the valve is thermally connected to the base.
4). LED Module (1) Light Emitting Element In the embodiment and the like, the light emitting element is the LED 23, but may be, for example, an LD (laser diode) or an EL element (electric luminescence element).

Moreover, although LED23 was mounted on the mounting board by the chip type, LED may be mounted on the mounting board by the surface mounting type (what is called SMD) or a shell type, for example. Further, the plurality of LEDs may be a mixture of a chip type and a surface mount type.
(2) Mounting Board The mounting board 21 in the first and second embodiments has a rectangular shape in plan view.

  However, the mounting substrate may have other shapes such as a polygon such as a square shape and a pentagon (including a regular polygon shape), an elliptical shape, a circular shape, an annular shape, and the like.

Further, the number of mounting boards is not limited to one, but may be two or more. Furthermore, in the embodiment, the LED 23 is mounted on the front surface of the mounting substrate 21, but the LED may be mounted on the back surface.
(3) Sealing body In the first and second embodiments, the sealing body 25 covers the LEDs 23 arranged in two rows in a row unit. However, two rows may be covered together. And you may coat | cover with one sealing body with respect to several fixed number LED groups, and you may coat | cover with one sealing body with respect to all LED.
(4) Arrangement of LEDs In the first and second embodiments, the plurality of LEDs 23 are arranged in two rows, but they may be arranged so as to be positioned on four sides of a quadrangle in plan view. It may be arranged so as to be located on the circumference of an ellipse (including a circle). Furthermore, it may be arranged in a matrix.
(5) Others The LED module 11 emits white light by using the LED 23 that emits blue light and the phosphor particles that convert the wavelength of the blue light into yellow light. A combination of the semiconductor light emitting element and the phosphor particles of three colors that emit light in the three primary colors (red, green, and blue) may be used.

Further, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, may be used as the wavelength conversion material.
5. Case In the first and second embodiments and the like, the cases 5 and 305 are made of a resin material, but may be made of other materials. When using a metal material as another material, it is necessary to ensure insulation from the base. Insulation with the base can be ensured by, for example, applying an insulating film to the small-diameter portion of the case or by insulating the small-diameter portion. It can also be ensured by configuring each side with a resin material (two or more members are combined).

In the above embodiment, the surface of the cases 5 and 305 has not been particularly described. However, for example, heat radiating fins may be provided, or processing for improving the radiation rate may be performed.
6). Base In the first embodiment, etc., Edison type bases 7 and 307 are used, but other types, for example, pin types (specifically, G types such as GY and GX) are used. good.

  Further, in the above embodiment, the caps 7 and 307 are mounted (joined) to the case 5 305 by being screwed into the screw portions of the case 5 305 using the female screw of the shell portion. It may be joined to the case by other methods. Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined.

  The lamp according to the present invention can be suitably used, for example, as a bulb-type LED lamp that replaces an incandescent bulb.

1 LED lamp 3 Bulb 5 Case 7 Base 9 Support member (bar-shaped member)
11 LED module 13 Circuit unit 15 Heat transfer plate

Claims (5)

A light-emitting element as a light source is supported by a support member inside the globe, and a case in which a base is attached is attached to the end side of the globe,
The glove constitutes a container with a lid member that closes the opening on the end side, and a fluid having a higher thermal conductivity than air is enclosed in the container,
The support member is composed of a plurality of rod-shaped members,
One or more said rod-shaped members are derived | led-out from the said container to the exterior, The leading-end | tip part is thermally joined to at least one of the said case or a nozzle | cap | die. The lamp according to claim 1, wherein the rod-shaped member is made of a metal material. The lamp according to claim 1 or 2, wherein the fluid having a higher thermal conductivity than air is helium gas. The said cover member consists of glass materials, and the junction part with the said cover member in the said rod-shaped member consists of dimet materials. The lamp | ramp of any one of Claims 1-3 characterized by the above-mentioned. In an illuminating device comprising a lamp and a lighting fixture that is lit by mounting the lamp,
The said lamp | ramp is a lamp | ramp of any one of Claims 1-4. The illuminating device characterized by the above-mentioned.

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